Search Results - "WYMYSLOWSKI, Artur" :: K.UTB vyhledávací portál

Loading…

Guest Editorial: 2016 EuroSimE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems

by Wymysłowski, Artur
Published in Microelectronics and reliability (01.07.2017)

Get full text

Journal Article

Loading…

Guest Editorial: 2015 EuroSimE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems

by Wymysłowski, Artur
Published in Microelectronics and reliability (01.07.2016)

Get full text

Journal Article

Loading…

Guest Editorial: 2014 EuroSimE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems

by Wymysłowski, Artur
Published in Microelectronics and reliability (01.04.2015)

Get full text

Journal Article

Loading…

Guest Editorial: 2013 EuroSimE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems

by Wymysłowski, Artur
Published in Microelectronics and reliability (01.06.2014)

Get full text

Journal Article

Loading…

Strength analysis of solder joints used in microelectronics packaging

by Wymysłowski, Artur, Jankowski, Krystian
Published in Eksploatacja i niezawodność (01.01.2020)

Get full text

Journal Article

Loading…

Guest Editorial: 2012 EuroSimE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems

by Wymysłowski, Artur
Published in Microelectronics and reliability (01.08.2013)

Get full text

Journal Article

Loading…

2011 EuroSimE international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems

by Wymysłowski, Artur
Published in Microelectronics and reliability (01.07.2012)

Get full text

Journal Article

Loading…

Guest Editorial: 2009 EuroSimE international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems

by Wymysłowski, Artur
Published in Microelectronics and reliability (01.07.2010)

Get full text

Journal Article

Loading…

Adhesion work analysis through molecular modeling and wetting angle measurement

by Król, Dawid Jan, Wymysłowski, Artur, Allaf, Kamil Nouri
Published in Microelectronics and reliability (01.04.2015)

Get full text

Journal Article

Loading…

Application of nanoindentation technique for investigation of elasto-plastic properties of the selected thin film materials

by WYMYSLOWSKI, Artur, DOWHAN, Lukasz
Published in Microelectronics and reliability (01.03.2013)

Get full text

Journal Article

Loading…

Guest Editorial: 2007 EuroSimE conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems

by Wymysłowski, Artur
Published in Microelectronics and reliability (01.06.2008)

Get full text

Journal Article

Loading…

Thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems

by Wymysłowski, Artur
Published in Microelectronics and reliability (01.12.2007)

Get full text

Journal Article

Loading…

Multi-objective decision support system in numerical reliability optimization of modern electronic packaging

by Dowhań, Łukasz, Wymysłowski, Artur, Dudek, Rainer
Published in Microsystem technologies : sensors, actuators, systems integration (01.12.2009)

Get full text

Journal Article

Loading…

Numerical prototyping methods in microsystem accelerometers design

by Dowhań, Łukasz, Wymysłowski, Artur, Kaliciński, Stanisław, Janus, Paweł
Published in Microelectronics and reliability (01.07.2011)

Get full text

Journal Article Conference Proceeding

Loading…

Extraction of elastic–plastic material properties of thin films through nanoindentaion technique with support of numerical methods

by Dowhań, Łukasz, Wymysłowski, Artur, Janus, Paweł, Ekwińska, Magdalena, Wittler, Olaf
Published in Microelectronics and reliability (01.06.2011)

Get full text

Journal Article

Loading…

An approach of numerical multi-objective optimization in stacked packaging

by Dowhań, Łukasz, Wymysłowski, Artur, Dudek, Rainer
Published in Microelectronics and reliability (01.06.2008)

Get full text

Journal Article

Loading…

Numerical approach to characterization of thermally conductive adhesives

by Fałat, Tomasz, Wymysłowski, Artur, Kolbe, Jana
Published in Microelectronics and reliability (01.02.2007)

Get full text

Journal Article

Loading…

Thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems

by Wymysłowski, Artur, Vandevelde, Bart, Andersson, Dag
Published in Microelectronics and reliability (01.02.2007)

Get full text

Journal Article

Loading…

Influence of matrix viscoelastic properties on thermal conductivity of TCA – Numerical approach

by Falat, Tomasz, Wymysłowski, Artur, Kolbe, Jana, Jansen, Kaspar M.B., Ernst, Leo
Published in Microelectronics and reliability (01.12.2007)

Get full text

Journal Article Conference Proceeding

Loading…

Lab-on-Chip Platform for Culturing and Dynamic Evaluation of Cells Development

by Podwin, Agnieszka, Lizanets, Danylo, Przystupski, Dawid, Kubicki, Wojciech, Śniadek, Patrycja, Kulbacka, Julita, Wymysłowski, Artur, Walczak, Rafał, Dziuban, Jan A
Published in Micromachines (Basel) (14.02.2020)

Get full text

Journal Article

Refine Results

Format

Subject Area

Topic

Language

Year of Publication

Database