A 4.6-μm, 127-dB Dynamic Range, Ultra-Low Power Stacked Digital Pixel Sensor With Overlapped Triple Quantization
Ikeno, Rimon, Mori, Kazuya, Uno, Masayuki, Miyauchi, Ken, Isozaki, Toshiyuki, Takayanagi, Isao, Nakamura, Junichi, Wuu, Shou-Gwo, Bainbridge, Lyle, Berkovich, Andrew, Chen, Song, Chilukuri, Ramakrishna, Gao, Wei, Tsai, Tsung-Hsun, Liu, Chiao
Published in IEEE transactions on electron devices (01.06.2022)
Published in IEEE transactions on electron devices (01.06.2022)
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Journal Article
A 4.0 μm Stacked Digital Pixel Sensor Operating in a Dual Quantization Mode for High Dynamic Range
Mori, Kazuya, Yasuda, Naoto, Miyauchi, Ken, Isozaki, Toshiyuki, Takayanagi, Isao, Nakamura, Junichi, Chien, Ho-Ching, Fu, Ken, Wuu, Shou-Gwo, Berkovich, Andrew, Chen, Song, Gao, Wei, Liu, Chiao
Published in IEEE transactions on electron devices (01.06.2022)
Published in IEEE transactions on electron devices (01.06.2022)
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Journal Article
A 3.96μm, 124dB Dynamic Range, 6.2mW Stacked Digital Pixel Sensor with Monochrome and Near-Infrared Dual-Channel Global Shutter Capture
Chen, Song, Liu, Chiao, Bainbridge, Lyle, Chao, Qing, Chilukuri, Ramakrishna, Gao, Wei, Hammond, Andrew P., Tsai, Tsung-Hsun, Miyauchi, Ken, Takayanagi, Isao, Nagamatsu, Masato, Abe, Hirofumi, Mori, Kazuya, Uno, Masayuki, Isozaki, Toshiyuki, Ikeno, Rimon, Chen, Hsin-Li, Lin, Chih-Hao, Fu, Wen-Chien, Wuu, Shou-Gwo
Published in 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) (11.06.2023)
Published in 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) (11.06.2023)
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Conference Proceeding
Extraction and Estimation of Pinned Photodiode Capacitance in CMOS Image Sensors
Chao, Calvin Yi-Ping, Yi-Che Chen, Kuo-Yu Chou, Jhy-Jyi Sze, Fu-Lung Hsueh, Shou-Gwo Wuu
Published in IEEE journal of the Electron Devices Society (01.07.2014)
Published in IEEE journal of the Electron Devices Society (01.07.2014)
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Journal Article
Nonsilicide source/drain pixel for 0.25-μm CMOS image sensor
Dun-Nian Yaung, Shou-Gwo Wuu, Yean-Kuen Fang, Wang, C.S., Chien-Hsien Tseng, Mon-Song Lian
Published in IEEE electron device letters (01.02.2001)
Published in IEEE electron device letters (01.02.2001)
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Journal Article
A new and improved borderless contact (BLC) structure for high-performance Ti-salicide in sub-quarter micron CMOS devices
Liu, Wen-Chau, Thei, Kong-Beng, Wang, Wei-Chou, Pan, Hsi-Jen, Wuu, Shou-Gwo, Lei, Ming-Ta, Wang, Chung-Shu, Cheng, Shiou-Ying
Published in IEEE electron device letters (01.07.2000)
Published in IEEE electron device letters (01.07.2000)
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Journal Article
A novel double ion-implant (DII) Ti-salicide technology for high-performance sub-0.25-μm CMOS devices applications
Thei, K-B, Liu, W-C, Chuang, H-M, Lin, K-W, Cheng, C-C, Ho, C-H, Su, C-W, Wuu, S-G, Wang, C-S
Published in IEEE transactions on electron devices (01.08.2001)
Published in IEEE transactions on electron devices (01.08.2001)
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Journal Article
A Comparison of Behaviors between Hydrogenated/Unhydrogenated Polysilicon Thin Film Transistors under Electric Stress
Yaung, Dun-Nian, Fang, Yean-Kuen, Lee, Kan-Yuan, Hwang, Kuo-Ching, Wuu, Shou-Gwo, Liang, Mong-Song
Published in Japanese Journal of Applied Physics (01.07.2000)
Published in Japanese Journal of Applied Physics (01.07.2000)
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Journal Article
A 3.96-$\mu$m, 124-dB Dynamic-Range, Digital-Pixel Sensor With Triple-and Single-Quantization Operations for Monochrome and Near-Infrared Dual-Channel Global Shutter Operation
Miyauchi, Ken, Uno, Masayuki, Isozaki, Toshiyuki, Fukuhara, Hideyuki, Mori, Kazuya, Abe, Hirofumi, Nagamatsu, Masato, Ikeno, Rimon, Takayanagi, Isao, Chen, Hsin-Li, Lin, Chih-Hao, Fu, Wen-Chien, Wuu, Shou-Gwo, Chen, Song, Bainbridge, Lyle, Chao, Qing, Chilukuri, Ramakrishna, Gao, Wei, Hammond, Andrew P., Tsai, Tsung-Hsun, Liu, Chiao
Published in IEEE journal of solid-state circuits (2024)
Published in IEEE journal of solid-state circuits (2024)
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Journal Article
IMAGE SENSOR WITH LOW STEP HEIGHT BETWEEN BACK-SIDE METAL AND PIXEL ARRAY
WANG MING TSONG, CHENG NAI WEN, WUU SHOU GWO, WU TUNG TING, TSENG CHIEN HSIEN
Year of Publication 07.11.2014
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Year of Publication 07.11.2014
Patent
SELF-ALIGNED IMPLANTATION PROCESS FOR FORMING JUNCTION ISOLATION REGIONS
CHEN CHIA CHAN, YANG DAO HONG, CHUNG MING HAO, WUU SHOU GWO, TSENG CHIEN HSIEN, WU KUO YU
Year of Publication 10.12.2013
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Year of Publication 10.12.2013
Patent
STRESS ENGINEERING TO REDUCE DARK CURRENT OF CMOS IMAGE SENSORS
LIN CHUNG TE, CHENG NAI WEN, HSIAO RU SHANG, WUU SHOU GWO, TSENG CHIEN HSIEN
Year of Publication 02.11.2011
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Year of Publication 02.11.2011
Patent
On the high-performance Ti-salicide ULSI CMOS devices prepared by a borderless contact technique and double-implant structure
Thei, Kong-Beng, Chuang, Hung-Ming, Yu, Kuo-Hui, Liu, Wen-Chau, Liu, Rong-Chau, Lin, Kun-Wei, Su, Chi-Wen, Ho, Chin-Shiung, Wuu, Shou-Gwo, Wang, Chung-Shu
Published in Semiconductor science and technology (01.03.2002)
Published in Semiconductor science and technology (01.03.2002)
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Journal Article
A peripheral switchable 3D stacked CMOS image sensor
Liu, Charles Chih-Min, Chin-Hao Chang, Hon-Yih Tu, Chao, Calvin Yi-Ping, Fu-Lung Hsueh, Szu-Ying Chen, Hsu, Vincent, Jen-Cheng Liu, Dun-Nien Yaung, Shou-Gwo Wuu
Published in 2014 Symposium on VLSI Circuits Digest of Technical Papers (01.06.2014)
Published in 2014 Symposium on VLSI Circuits Digest of Technical Papers (01.06.2014)
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Conference Proceeding
The impacts of back-end high temperature thermal treatments on the characteristics and gate oxide reliability of thin film transistor in ultra large scale integrated circuit process
LEE, K. Y, FANG, Y. K, CHEN, C. W, YAUNG, D. N, WUU, K. H, HO, J. J, LIANG, M. S, WUU, S. G
Published in Japanese Journal of Applied Physics (01.05.1997)
Published in Japanese Journal of Applied Physics (01.05.1997)
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Journal Article