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"WU KENGUNG"
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"WU KENGUNG"
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Method of making circuit board module
by
CHIANG WENUNG
,
LU CHENG-KANG
,
FU MING-HUANG
,
HSIEH YINGI
,
WU KENGUNG
Year of Publication
02.12.2014
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Ceramic-copper foil bonding method
by
CHIANG, WENUNG
,
WU, JUN-JAE
,
WU
,
KENGUNG
Year of Publication
07.08.2013
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CIRCUIT BOARD MODULE AND METHOD OF MAKING THE SAME
by
CHIANG WENUNG
,
LU CHENG-KANG
,
FU MING-HUANG
,
HSIEH YINGI
,
WU KENGUNG
Year of Publication
02.01.2014
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Method of making circuit board module
by
CHIANG WENUNG
,
LU CHENG-KANG
,
FU MING-HUANG
,
HSIEH YINGI
,
WU KENGUNG
Year of Publication
08.10.2013
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Packaging substrate device, method for making the packaging substrate device, and packaged light emitting device
by
CHIANG WENUNG
,
LU CHENG-KANG
,
FU MING-HUANG
,
HSIEH YINGI
,
WU KENGUNG
Year of Publication
11.06.2013
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Packaging device for an electronic element and method for making the same
by
CHIANG WENUNG
,
LU CHENG-KANG
,
FU MING-HUANG
,
HSIEH YINGI
,
WU KENGUNG
Year of Publication
30.04.2013
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Ceramic-copper foil bonding method
by
CHIANG, WENUNG
,
WU, JUN-JAE
,
WU
,
KENGUNG
Year of Publication
01.09.2010
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Ceramic-copper foil bonding method
by
CHIANG, WENUNG
,
WU, JUN-JAE
,
WU
,
KENGUNG
Year of Publication
24.06.2009
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Circuit board module and method of making the same
by
CHIANG WENUNG
,
LU CHENG-KANG
,
FU MING-HUANG
,
HSIEH YINGI
,
WU KENGUNG
Year of Publication
18.11.2010
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Ceramic-Copper Foil Bonding Method
by
CHIANG WENUNG
,
WU KENGUNG
,
WU JUN-JAE
Year of Publication
18.06.2009
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PACKAGING SUBSTRATE DEVICE, METHOD FOR MAKING THE PACKAGING SUBSTRATE DEVICE, AND PACKAGED LIGHT EMITTING DEVICE
by
CHIANG WENUNG
,
LU CHENG-KANG
,
FU MING-HUANG
,
HSIEH YINGI
,
WU KENGUNG
Year of Publication
14.10.2010
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PRINTED CIRCUIT BOARD AND METHOD FOR MAKING THE SAME
by
CHIANG WENUNG
,
LU CHENG-KANG
,
FU MING-HUANG
,
HSIEH YINGI
,
WU KENGUNG
Year of Publication
23.09.2010
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PACKAGING DEVICE FOR AN ELECTRONIC ELEMENT AND METHOD FOR MAKING THE SAME
by
CHIANG WENUNG
,
LU CHENG-KANG
,
FU MING-HUANG
,
HSIEH YINGI
,
WU KENGUNG
Year of Publication
16.09.2010
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Keramik-kobberfolie-bindingsfremgangsmåde
by
CHIANG, WENUNG
,
WU, JUN-JAE
,
WU
,
KENGUNG
Year of Publication
04.11.2013
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