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Published in Ceramics international (01.10.2024)
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Packaging method of semiconductor thermoelectric device
CHEN LEI, LI MINGLEI, CHI GUIJUN, WU HEJIE, KAN ZONGXIANG, CHEN SHUSHAN, CHEN LAIDONG
Year of Publication 16.07.2024
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Year of Publication 16.07.2024
Patent