Through-silicon via arrays manufactured by photo assisted electrochemical etching and copper electroplating under SC-CO2 environment
Ho-Chiao Chuang, Hsi-Min Yang, Cheng-Hsiang Wu, Sánchez, Jorge, Jenq-Huey Shyu
Published in 2017 19th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS) (01.06.2017)
Published in 2017 19th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS) (01.06.2017)
Get full text
Conference Proceeding