Research Status of Manufacturing Technology of Tungsten Alloy Wire
Cao, Jun, Sun, Yongzhen, Wu, Baoan, Tang, Huiyi, Ding, Yong, Song, Kexing, Cui, Chengqiang
Published in Micromachines (Basel) (11.05.2023)
Published in Micromachines (Basel) (11.05.2023)
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Study on the effect of heat treatment on the microstructure and properties of C17300 beryllium copper alloy microwires
Cao, Jun, Li, Chong, Sun, Yongzhen, Wu, Baoan, Tang, Huiyi, Shen, Xiaoyu, Song, Kexing, Zhou, Yanjun, Cui, Chengqiang
Published in Journal of materials research and technology (01.07.2023)
Published in Journal of materials research and technology (01.07.2023)
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Investigation of the Influence of Alloy Atomic Doping on the Properties of Cu-Sn Alloys Based on First Principles
Wei, Zongfan, Chen, Jiaying, Xue, Jingteng, Qu, Nan, Liu, Yong, Sun, Ling, Xiao, Yuchen, Wu, Baoan, Zhu, Jingchuan, Tang, Huiyi
Published in Metals (Basel ) (01.05.2024)
Published in Metals (Basel ) (01.05.2024)
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Study on Manufacturing Technology of Ultra-Thin/Narrow Bonding Cu Strip for Electronic Packaging
Cao, Jun, Zhang, Junchao, Wu, Baoan, Tang, Huiyi, Ding, Yong, Song, Kexing, Yang, Guannan, Cui, Chengqiang
Published in Micromachines (Basel) (12.04.2023)
Published in Micromachines (Basel) (12.04.2023)
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Texture evolution and its influence mechanism on properties of single crystal copper and polycrystalline copper during cumulative deformation
Li, Xin, Zhou, Yanjun, Liu, Yahui, Li, Shaolin, Song, Kexing, Feng, Cunli, Wu, Baoan, Zhang, Pengfei, Wu, Hanjiang, Gu, Jihua, He, Siyu, Gao, Yan
Published in Journal of materials research and technology (01.05.2023)
Published in Journal of materials research and technology (01.05.2023)
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Microstructural evolution and properties of Cu–20 wt% Ag alloy wire by multi-pass continuous drawing
Cheng, Chu, Song, Kexing, Mi, Xujun, Wu, Baoan, Xiao, Zhu, Xie, Haofeng, Zhou, Yanjun, Guo, Xiuhua, Liu, Haitao, Chen, Dingbiao, Shen, Xiaoyu, Ding, Yong
Published in Nanotechnology reviews (Berlin) (31.12.2020)
Published in Nanotechnology reviews (Berlin) (31.12.2020)
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Effect of Ceramic Capillary Parameters on Bonded Morphology and Strength
Cao, Jun, Zhang, Junchao, Song, Kexing, Wu, Baoan, Ding, Yong, Chen, Dingbiao, Ding, Yutian
Published in Micromachines (Basel) (29.12.2020)
Published in Micromachines (Basel) (29.12.2020)
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Study on Manufacturing Technology of Ag-8.5Au-3.5Pd Fine Alloy Wire
Cao, Jun, Zhang, Junchao, Wu, Baoan, Tang, Huiyi, Lv, Changchun, Song, Kexing, Yang, Guannan, Cui, Chengqiang, Gao, Yangguang
Published in Micromachines (Basel) (09.08.2021)
Published in Micromachines (Basel) (09.08.2021)
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Effect of Ni-RGO nanosheets on the creep behavior of Sn–Ag–Cu composite solder joints
Zhang, Hehe, Xu, Ziqi, Guo, Chunjiang, Wu, Baoan, Liu, Haiding, Li, Feng, Zhang, Liping, Xiao, Yuchen
Published in Materials chemistry and physics (01.10.2024)
Published in Materials chemistry and physics (01.10.2024)
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Journal Article
Strengthening mechanism of ultra-high strength Cu–20Ag alloy wire induced by cumulative strain
Zhang, Pengfei, Zhou, Yanjun, Liu, Yahui, Li, Shaolin, Song, Kexing, Cao, Jun, Wu, Baoan, Li, Xin, Wu, Hanjiang, Gu, Jihua, He, Siyu, Gao, Yan
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (10.10.2022)
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (10.10.2022)
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Journal Article
Microstructure evolution of high-strength and ultra-high-conductivity microfilament wire prepared by continuous deformation of single-crystal copper
Li, Xin, Zhou, Yanjun, Liu, Yahui, Li, Shaolin, Song, Kexing, Feng, Cunli, Wu, Baoan, Zhang, Pengfei, Wu, Hanjiang, Gu, Jihua, He, Siyu, Gao, Yan
Published in Journal of materials science (01.11.2022)
Published in Journal of materials science (01.11.2022)
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Journal Article
Effect of Au Coating on the Electrolytic Migration of Ag Bonding Wires for Electronic Packaging Applications
Xiao, Yuchen, Tang, Huiyi, Zhang, Hehe, Sun, Ling, Xie, Yong, Wu, Baoan, Xie, Weidong, Cai, Xinnan, Li, Feng
Published in Journal of physics. Conference series (01.12.2022)
Published in Journal of physics. Conference series (01.12.2022)
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Journal Article
Au-coated Ag alloy bonding wires with enhanced oxidation resistance for electronic packaging applications
Xiao, Yuchen, Tang, Huiyi, Zhang, Hehe, Yang, Xiaoling, Sun, Ling, Xie, Yong, Wu, Baoan, Luan, Baifeng, Xie, Weidong, Cai, Xinnan
Published in Microelectronics international (17.03.2023)
Published in Microelectronics international (17.03.2023)
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