Extremely Low-Loss Planar Transition From Hollow Dielectric Waveguide to Printed Circuit Board for Millimeter-Wave Interconnect
Liu, Chung-Yuan, Ding, Hsiang-En, Wu, Shih-Hsien, Wu, Tzong-Lin
Published in IEEE transactions on microwave theory and techniques (01.09.2021)
Published in IEEE transactions on microwave theory and techniques (01.09.2021)
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Journal Article
PIPPON: Improve Impedance Prediction of Power Distribution Network Using Pole Proposal Network
Lu, Cheng-Hsueh, Tseng, Ling-Yu, Chang, Shih-Chieh, Wu, Shih-Hsien
Published in 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI) (29.07.2023)
Published in 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI) (29.07.2023)
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Conference Proceeding
An Embedded Multi-Die Active Bridge (EMAB) Chip for Rapid-Prototype Programmable 2.5D/3D Packaging Technology
Zhang, Jie, Lu, Wei, Huang, Po-Tsang, Li, Sih-Han, Hung, Tsung-Yi, Wu, Shih-Hsien, Dai, Ming-Ji, Chung, I-Shan, Chen, Wen-Chao, Wang, Chin-Hung, Sheu, Shyh-Shyuan, Chen, Hung-Ming, Chen, Kuan-Neng, Lo, Wei-Chung, Wu, Chih-I
Published in 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) (12.06.2022)
Published in 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) (12.06.2022)
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Conference Proceeding
Bandstop power delivery network with wideband noise isolation up to 40 GHz
Shih-Hsien Wu, Yo-Shen Lin
Published in 2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC) (01.05.2015)
Published in 2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC) (01.05.2015)
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Conference Proceeding
Novel crosstalk modeling for multiple through-silicon-vias (TSV) on 3-D IC: Experimental validation and application to Faraday cage design
Yu-Jen Chang, Hao-Hsiang Chuang, Yi-Chang Lu, Yih-Peng Chiou, Tzong-Lin Wu, Peng-Shu Chen, Shih-Hsien Wu, Tzu-Ying Kuo, Chau-Jie Zhan, Wei-Chung Lo
Published in 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems (01.10.2012)
Published in 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems (01.10.2012)
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Conference Proceeding
Compact TSV-based wideband bandpass filters on 3-D IC
Ying-Cheng Tseng, Peng-Shu Chen, Wei-Chung Lo, Shih-Hsien Wu, Tzong-Lin Wu
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
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Conference Proceeding
Electrical testing of blind Through-Silicon Via (TSV) for 3D IC integration
Jui-Feng Hung, Lau, J. H., Peng-Shu Chen, Shih-Hsien Wu, Shinn-Juh Lai, Ming-Lin Li, Shyh-Shyuan Sheu, Pei-Jer Tzeng, Zhe-Hui Lin, Tzu-Kun Ku, Wei-Chung Lo, Ming-Jer Kao
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
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Conference Proceeding
Low slow-wave effect and crosstalk for low-cost ABF-coated TSVs in 3-D IC interposer
Yu-Jen Chang, Tai-Yu Zheng, Hao-Hsiang Chuang, Chuen-De Wang, Peng-Shu Chen, Tzu-Ying Kuo, Chau-Jie Zhan, Shih-Hsien Wu, Wei-Chung Lo, Yi-Chang Lu, Yih-Peng Chiou, Tzong-Lin Wu
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
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Conference Proceeding
A Design Flow for Micro Bump and Stripe Planning on Modern Chip-Package Co-Design
Huang, Ming-Yu, Chen, Hung-Ming, Chen, Kuan-Neng, Wu, Shih-Hsien, Lee, Yu-Min, Su, An-Yu
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
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Conference Proceeding
Eye Estimation Methods for MIPI C-PHY
Cheng, Yu-Ying, Weng, Pei-Yang, Yang, Suani-Kai, Wu, Shih-Hsien, Wu, Tzong-Lin
Published in IEEE transactions on signal and power integrity (2024)
Published in IEEE transactions on signal and power integrity (2024)
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Journal Article
An Electrical Testing Method for Blind Through Silicon Vias (TSVs) for 3D IC Integration
SHEU, Shyh-Shyuan, LIN, Zhe-Hui, KU, Tzu-Kun, LO, Wei-Chung, KAO, Ming-Jer, HUNG, Jui-Feng, LAU, John H, CHEN, Peng-Shu, WU, Shih-Hsien, SU, Keng-Li, LIN, Chih-Sheng, LAI, Shinn-Juh, CHENG, Kuo-Hsing
Published in Journal of microelectronics and electronic packaging (01.10.2011)
Published in Journal of microelectronics and electronic packaging (01.10.2011)
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Journal Article
The Worst-Case Eye Prediction Algorithm for MIPI C-PHY Signaling on Mobile Artificial Intelligence (AI) Chips
Cheng, Yu-Ying, Yang, Suani-Kai, Wu, Shih-Hsien, Wu, Tzong-Lin
Published in 2024 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI) (05.08.2024)
Published in 2024 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI) (05.08.2024)
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Conference Proceeding