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"WOO, CHRISTY, MEIU"
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"WOO, CHRISTY, MEIU"
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Integrated circuit contact system
by
YAO HUADE WALTER
,
WOO CHRISTY MEIU
,
CHENG NING
Year of Publication
09.08.2011
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Consistent plating system for electroplating
by
WOO CHRISTY MEIU
Year of Publication
07.08.2001
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Recycling consistent plating system for electroplating
by
MEIU WOO CHRISTY
Year of Publication
13.03.2001
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ENDPOINT DETECTION METHOD FOR CMP PROCESSES
by
WOO
,
CHRISTY
,
MEIU
Year of Publication
17.06.1999
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Method for determining metal work function by formation of Schottky diodes with shadow mask
by
PAN JAMES N
,
WOO CHRISTY MEIU
Year of Publication
16.05.2006
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Semiconductor wafer polishing apparatus
by
ACHUTHAN KRISHNASHREE
,
WOO CHRISTY MEIU
Year of Publication
08.10.2002
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Storage-annealing plated CU interconnects
by
WOO CHRISTY MEIU
,
JOO YOUNGANG
Year of Publication
08.05.2001
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Reactive pre-clean using reducing gas during nickel silicide process
by
WOO CHRISTY MEIU
,
NGO MINH VAN
Year of Publication
13.04.2004
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Nitrogen oxide plasma treatment for reduced nickel silicide bridging
by
WOO CHRISTY MEIU
,
NGO MINH VAN
Year of Publication
30.03.2004
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Composite barrier layers with controlled copper interface surface roughness
by
KING PAUL L
,
MARATHE AMIT
,
WOO CHRISTY MEIU
,
WANG CONNIE PININ
Year of Publication
13.07.2010
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Barrier layer integrity test
by
WOO CHRISTY MEIU
,
JOO YOUNGANG
,
LUKANC TODD
Year of Publication
14.10.2003
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Testing dielectric and barrier layers for integrated circuit interconnects
by
WOO CHRISTY MEIU
,
MARATHE AMIT P
Year of Publication
29.07.2003
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SILICON OXIDE LINER FOR REDUCED NICKEL SILICIDE BRIDGING
by
NGO, MINH, VAN
,
WOO
,
CHRISTY
,
MEIU
Year of Publication
16.07.2003
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Method for manufacturing a low dielectric constant stop layer for integrated circuit interconnects
by
WOO CHRISTY MEIU
,
NGO MINH VAN
Year of Publication
15.07.2003
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Integrated plasma treatment and nickel deposition and tool for performing same
by
WOO CHRISTY MEIU
,
NGO MINH VAN
Year of Publication
01.07.2003
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Composite tantalum nitride/tantalum copper capping layer
by
ERB DARRELL M
,
WOO CHRISTY MEIU
,
AVANZINO STEVEN C
Year of Publication
02.01.2007
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COPPER INTERCONNECTS WITH IMPROVED ELECTROMIGRATION RESISTANCE AND LOW RESISTIVITY
by
WOO
,
CHRISTY
,
MEIU
,
WANG, PININ, CONNIE
Year of Publication
14.05.2003
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Silicon oxide liner for reduced nickel silicide bridging
by
WOO CHRISTY MEIU
,
NGO MINH VAN
Year of Publication
15.04.2003
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Method of promoting void free copper interconnects
by
WANG PININ CONNIE
,
WOO CHRISTY MEIU
Year of Publication
15.04.2003
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Barrier metal integrity testing using a dual level line to line leakage testing pattern and partial CMP
by
WOO CHRISTY MEIU
,
MARATHE AMIT P
Year of Publication
11.03.2003
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