Analytical, Numerical-, and Measurement-Based Methods for Extracting the Electrical Parameters of Through Silicon Vias (TSVs)
Ndip, Ivan, Zoschke, Kai, Lobbicke, Kai, Wolf, M. Jurgen, Guttowski, Stephan, Reichl, Herbert, Lang, Klaus-Dieter, Henke, Heino
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.03.2014)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.03.2014)
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Journal Article
Novel Cu-nanowire-based technology enabling fine pitch interconnects for 2.5D/3D Integration
Shehzad, Adil, Yin, Ran, Panchenko, Iuliana, Muller, Maik, Bickel, Steffen, Birlem, Olav, Quednau, Sebastian, Wolf, Jurgen M.
Published in 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) (13.09.2022)
Published in 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) (13.09.2022)
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Conference Proceeding
3D system integration on 300 mm wafer level: High-aspect-ratio TSVs with ruthenium seed layer by thermal ALD and subsequent copper electroplating
Killge, Sebastian, Bartusseck, Irene, Junige, Marcel, Neumann, Volker, Reif, Johanna, Wenzel, Christian, Böttcher, Mathias, Albert, Matthias, Jürgen Wolf, M., Bartha, Johann W.
Published in Microelectronic engineering (15.01.2019)
Published in Microelectronic engineering (15.01.2019)
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Journal Article
Cu-In fine-pitch-interconnects: influence of processing conditions on the interconnection quality
Bickel, Steffen, Sen, Shawon, Meyer, Jorg, Panchenko, Iuliana, Wolf, M. Jurgen
Published in 2018 7th Electronic System-Integration Technology Conference (ESTC) (01.09.2018)
Published in 2018 7th Electronic System-Integration Technology Conference (ESTC) (01.09.2018)
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Conference Proceeding
Flux-induced porous structures in Cu-SnAg solidliquid-interdiffusion microbump interconnects
Meyer, Jorg, Upasani, Prathamesh Jayant, Bickel, Steffen, Panchenko, Iuliana, Wolf, M. Jurgen
Published in 2018 7th Electronic System-Integration Technology Conference (ESTC) (01.09.2018)
Published in 2018 7th Electronic System-Integration Technology Conference (ESTC) (01.09.2018)
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Conference Proceeding
Reliability Investigation of Large GaAs Pixel Detectors Flip-Chip-Bonded on Si Readout Chips
Klein, M, Hutter, M, Engelmann, G, Fritzsch, T, Oppermann, H, Dietrich, L, Wolf, M J, Bramer, B, Dudek, R, Reichl, H
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.03.2011)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.03.2011)
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Journal Article
Characterisation of Cu/Cu bonding using self-assembled monolayer
Lykova, Maria, Panchenko, Iuliana, Künzelmann, Ulrich, Reif, Johanna, Geidel, Marion, Wolf, M. Jürgen, Lang, Klaus-Dieter
Published in Soldering & surface mount technology (27.03.2018)
Published in Soldering & surface mount technology (27.03.2018)
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Journal Article
Low temperature Cu/In bonding for 3D integration
Panchenko, Iuliana, Bickel, Steffen, Meyer, Jorg, Muller, Maik, Wolf, Jurgen M.
Published in 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) (01.05.2017)
Published in 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) (01.05.2017)
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Conference Proceeding
3D integration of standard integrated circuits
Puschmann, Rene, Bottcher, Mathias, Bartusseck, Irene, Windrich, Frank, Fiedler, Conny, John, Peggy, Manier, Charles, Zoschke, Kai, Grafe, Jurgen, Oppermann, Hermann, Wolf, M. Jurgen, Lang, K. Dieter, Ziesmann, Michael
Published in 2013 IEEE International 3D Systems Integration Conference (3DIC) (01.10.2013)
Published in 2013 IEEE International 3D Systems Integration Conference (3DIC) (01.10.2013)
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Conference Proceeding
Low Temperature Solid State Bonding of Cu-In Fine-Pitch Interconnects
Bickel, Steffen, Panchenko, Iuliana, Tachikawa, Wataru, Wolf, M. Jurgen
Published in 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) (15.09.2020)
Published in 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) (15.09.2020)
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Conference Proceeding
Microfluidic Interposer for High Performance Fluidic Chip Cooling
Steller, Wolfram, Windrich, Frank, Bremner, Douglas, Robertson, Stephen, Mrosko, Raul, Keller, Jurgen, Brunschwiler, Thomas, Schlottig, Gerd, Oppermann, Hermann, Wolf, M. Jurgen, Lang, Klaus-Dieter
Published in 2018 7th Electronic System-Integration Technology Conference (ESTC) (01.09.2018)
Published in 2018 7th Electronic System-Integration Technology Conference (ESTC) (01.09.2018)
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Conference Proceeding
Influence of flux-assisted isothermal storage on intermetallic compounds in Cu/SnAg microbumps
Wambera, Laura, Panchenko, Iuliana, Steller, Wolfram, Muller, Maik, Wolf, M. Jurgen
Published in 2017 40th International Spring Seminar on Electronics Technology (ISSE) (01.05.2017)
Published in 2017 40th International Spring Seminar on Electronics Technology (ISSE) (01.05.2017)
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Conference Proceeding
Acoustic GHz-microscopy and its potential applications in 3D-integration technologies
Brand, Sebastian, Appenroth, Tim, Naumann, Falk, Steller, Wolfram, Wolf, M. Jurgen, Czurratis, Peter, Altmann, Frank, Petzold, Matthias
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
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Conference Proceeding
Fabrication of Application Specific Integrated Passive Devices Using Wafer Level Packaging Technologies
Zoschke, K., Wolf, M.J., Topper, M., Ehrmann, O., Fritzsch, T., Kaletta, K., Schmuckle, F.-J., Reichl, H.
Published in IEEE transactions on advanced packaging (01.08.2007)
Published in IEEE transactions on advanced packaging (01.08.2007)
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Journal Article
Clinical Outcomes With Dabrafenib Plus Trametinib in a Clinical Trial Versus Real-World Standard of Care in Patients With BRAF-Mutated Advanced NSCLC
Johnson, Bruce E., Baik, Christina S., Mazieres, Julien, Groen, Harry J.M., Melosky, Barbara, Wolf, Jürgen, Zadeh Vosta Kolaei, Fatemeh Asad, Wu, Wen-Hsing, Knoll, Stefanie, Ktiouet Dawson, Meryem, Johns, Adam, Planchard, David
Published in JTO clinical and research reports (01.05.2022)
Published in JTO clinical and research reports (01.05.2022)
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Journal Article