Remaining useful life prediction of lithium batteries in calendar ageing for automotive applications
Eddahech, A., Briat, O., Woirgard, E., Vinassa, J.M.
Published in Microelectronics and reliability (01.09.2012)
Published in Microelectronics and reliability (01.09.2012)
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Conference Proceeding
Characterization methods and modelling of ultracapacitors for use as peak power sources
Lajnef, W., Vinassa, J.-M., Briat, O., Azzopardi, S., Woirgard, E.
Published in Journal of power sources (01.06.2007)
Published in Journal of power sources (01.06.2007)
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Journal Article
Impact of Calendar Life and Cycling Ageing on Supercapacitor Performance
El Brouji, E.-H., Briat, O., Vinassa, J.-M., Bertrand, N., Woirgard, E.
Published in IEEE transactions on vehicular technology (01.10.2009)
Published in IEEE transactions on vehicular technology (01.10.2009)
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Journal Article
A preliminary study on the thermal and mechanical performances of sintered nano-scale silver die-attach technology depending on the substrate metallization
Le Henaff, F., Azzopardi, S., Deletage, J.Y., Woirgard, E., Bontemps, S., Joguet, J.
Published in Microelectronics and reliability (01.09.2012)
Published in Microelectronics and reliability (01.09.2012)
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Conference Proceeding
Power modules die attach: A comprehensive evolution of the nanosilver sintering physical properties versus its porosity
Youssef, T., Rmili, W., Woirgard, E., Azzopardi, S., Vivet, N., Martineau, D., Meuret, R., Le Quilliec, G., Richard, C.
Published in Microelectronics and reliability (01.08.2015)
Published in Microelectronics and reliability (01.08.2015)
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Journal Article
Power electronic assemblies: Thermo-mechanical degradations of gold-tin solder for attaching devices
Arabi, F., Theolier, L., Martineau, D., Deletage, J.-Y., Medina, M., Woirgard, E.
Published in Microelectronics and reliability (01.09.2016)
Published in Microelectronics and reliability (01.09.2016)
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Journal Article
Identification and analysis of power substrates degradations subjected to severe aging tests
Woirgard, E., Arabi, F., Sabbah, W., Martineau, D., Theolier, L., Azzopardi, S.
Published in Microelectronics and reliability (01.08.2015)
Published in Microelectronics and reliability (01.08.2015)
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Journal Article
Ageing monitoring of lithium-ion cell during power cycling tests
Eddahech, A., Briat, O., Henry, H., Delétage, J.-Y., Woirgard, E., Vinassa, J.-M.
Published in Microelectronics and reliability (01.09.2011)
Published in Microelectronics and reliability (01.09.2011)
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How supercapacitors reach end of life criteria during calendar life and power cycling tests
Chaari, R., Briat, O., Delétage, J.Y., Woirgard, E., Vinassa, J.-M.
Published in Microelectronics and reliability (01.09.2011)
Published in Microelectronics and reliability (01.09.2011)
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Contribution of calendar ageing modes in the performances degradation of supercapacitors during power cycling
Briat, O., Vinassa, J.-M., Bertrand, N., El Brouji, H., Delétage, J.-Y., Woirgard, E.
Published in Microelectronics and reliability (01.09.2010)
Published in Microelectronics and reliability (01.09.2010)
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Comparison between changes of ultracapacitors model parameters during calendar life and power cycling ageing tests
El Brouji, H., Briat, O., Vinassa, J.-M., Bertrand, N., Woirgard, E.
Published in Microelectronics and reliability (01.08.2008)
Published in Microelectronics and reliability (01.08.2008)
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Conference Proceeding
Electrical characterization under mechanical stress at various temperatures of PiN power diodes in a health monitoring approach
Baccar, F., Azzopardi, S., Theolier, L., El Boubkari, K., Deletage, J-Y., Woirgard, E.
Published in Microelectronics and reliability (01.09.2013)
Published in Microelectronics and reliability (01.09.2013)
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Conference Proceeding
Analysis of the dynamic behavior changes of supercapacitors during calendar life test under several voltages and temperatures conditions
El Brouji, H., Briat, O., Vinassa, J-M., Henry, H., Woirgard, E.
Published in Microelectronics and reliability (01.09.2009)
Published in Microelectronics and reliability (01.09.2009)
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Conference Proceeding
Failure mechanism of trench IGBT under short-circuit after turn-off
Benmansour, A., Azzopardi, S., Martin, J.C., Woirgard, E.
Published in Microelectronics and reliability (01.09.2006)
Published in Microelectronics and reliability (01.09.2006)
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Conference Proceeding
Quantification of ageing of ultracapacitors during cycling tests with current profile characteristics of hybrid and electric vehicles applications
LAJNEF, W, VINASSA, J.-M, BRIAT, O, EL BROUJI, H, AZZOPARDI, S, WOIRGARD, E
Published in IET electric power applications (01.09.2007)
Published in IET electric power applications (01.09.2007)
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Journal Article
An investigation into the reliability of power modules considering baseplate solders thermal fatigue in aeronautical applications
Micol, A., Zeanh, A., Lhommeau, T., Azzopardi, S., Woirgard, E., Dalverny, O., Karama, M.
Published in Microelectronics and reliability (01.09.2009)
Published in Microelectronics and reliability (01.09.2009)
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Journal Article
Conference Proceeding
Apparent heat capacity model of the SiC MOSFET's Aluminium top surface for short-circuits simulations
Loche-Moinet, F., Theolier, L., Woirgard, E.
Published in 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (25.04.2022)
Published in 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (25.04.2022)
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Conference Proceeding
Uni-axial mechanical stress effect on Trench Punch through IGBT under short-circuit operation
Belmehdi, Y., Azzopardi, S., Benmansour, A., Delétage, J.-Y., Woirgard, E.
Published in Microelectronics and reliability (01.09.2009)
Published in Microelectronics and reliability (01.09.2009)
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Conference Proceeding
Assessment of the Trench IGBT reliability: low temperature experimental characterization
Azzopardi, S., Benmansour, A., Ishiko, M., Woirgard, E.
Published in Microelectronics and reliability (01.09.2005)
Published in Microelectronics and reliability (01.09.2005)
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