FEM-based combined degradation model of wire bond and die-attach for lifetime estimation of power electronics
Grams, Arian, Jaeschke, Johannes, Wittler, Olaf, Fabian, Benjamin, Thomas, Sven, Schneider-Ramelow, Martin
Published in Microelectronics and reliability (01.08.2020)
Published in Microelectronics and reliability (01.08.2020)
Get full text
Journal Article
Microstructural evolution of ultrasonic-bonded aluminum wires
Broll, Marian Sebastian, Geissler, Ute, Höfer, Jan, Schmitz, Stefan, Wittler, Olaf, Lang, Klaus Dieter
Published in Microelectronics and reliability (01.05.2015)
Published in Microelectronics and reliability (01.05.2015)
Get full text
Journal Article
Fracture mechanics in new designed power module under thermo-mechanical loads
Durand, Camille, Klingler, Markus, Coutellier, Daniel, Naceur, Hakim, Grams, Arian, Wittler, Olaf
Published in MATEC web of conferences (01.01.2014)
Published in MATEC web of conferences (01.01.2014)
Get full text
Journal Article
Behavior of Different Ultrasonically Bonded Aluminum Heavy Wires in the Shear Test
Kuttler, Simon, Wittler, Olaf, Schneider-Ramelow, Martin
Published in Journal of electronic materials (01.09.2024)
Published in Journal of electronic materials (01.09.2024)
Get full text
Journal Article
Influence of temperature and humidity on power cycling capability of power modules
Wuest, Felix, Wittler, Olaf, Schneider-Ramelow, Martin
Published in Microelectronics and reliability (01.11.2020)
Published in Microelectronics and reliability (01.11.2020)
Get full text
Journal Article
Validation and Optimization of Calculated Stress Fields in Double-Mold Optoelectronics Sensor Packaging
Huber, Fabian, Etschmaier, Harald, Dobs, Tom, Walter, Hans, Wittler, Olaf, Hadley, Peter
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.06.2020)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.06.2020)
Get full text
Journal Article
Extraction of elastic-plastic material properties of thin films through nanoindentaion technique with support of numerical methods : THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICRO-ELECTRONICS AND MICRO-SYSTEMS (EUROSIME 2010)
DOWHAN, Łukasz, WYMYSŁOWSKI, Artur, JANUS, Paweł, EKWINSKA, Magdalena, WITTLER, Olaf
Published in Microelectronics and reliability (2011)
Get full text
Published in Microelectronics and reliability (2011)
Journal Article
Numerical Simulation of a Wire Bond Shear Test Using Nonlinear Adaptive Remeshing
Kuttler, Simon, Wittler, Olaf, Schneider-Ramelow, Martin
Published in 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (25.04.2022)
Published in 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (25.04.2022)
Get full text
Conference Proceeding
Extraction of elastic–plastic material properties of thin films through nanoindentaion technique with support of numerical methods
Dowhań, Łukasz, Wymysłowski, Artur, Janus, Paweł, Ekwińska, Magdalena, Wittler, Olaf
Published in Microelectronics and reliability (01.06.2011)
Published in Microelectronics and reliability (01.06.2011)
Get full text
Journal Article
Determination of Lemaitre Damage Parameters for Al H11 Wire Material
Kuttler, Simon, Abali, Bilen Emek, Wittler, Olaf
Published in 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (17.04.2023)
Published in 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (17.04.2023)
Get full text
Conference Proceeding
Analyzing the Influence of RDL Stack-up on Wafer Warpage in FOWLP through Experimental and Numerical Investigations
Huber, Saskia, Scheibe, Philipp, Mutlu, Sukrucan, Wittler, Olaf, Schneider-Ramelow, Martin
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Get full text
Conference Proceeding
Influence of Geometry Effects on Thermo-Mechanical Reliability of Aluminum Bond Wires in Discrete SiC MOSFETs
Kilian, Borja, Maniar, Youssef, Gleichauf, Jonas, Wittler, Olaf, Schneider-Ramelow, Martin
Published in 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (07.04.2024)
Published in 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (07.04.2024)
Get full text
Conference Proceeding
Establishing EcoReliability of Electronic Devices in Manufacturing Environments
Middendorf, Andreas, Benecke, Stephan, Nissen, Nils F., Wittler, Olaf, Lang, Klaus-D.
Published in Procedia CIRP (2015)
Published in Procedia CIRP (2015)
Get full text
Journal Article
Modification of Prony Series Coefficients to Account for Thermo-Oxidative Ageing Effects within Numerical Simulations
Dijk, Marius van, Wittler, Olaf, Wagner, Stefan, Schneider-Ramelow, Martin
Published in 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (17.04.2023)
Published in 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (17.04.2023)
Get full text
Conference Proceeding
Finite Element-Based Monitoring of Solder Degradation in Discrete SiC MOSFETs
Kilian, Borja, Gleichauf, Jonas, Maniar, Youssef, Wittler, Olaf, Schneider-Ramelow, Martin
Published in 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (17.04.2023)
Published in 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (17.04.2023)
Get full text
Conference Proceeding
Novel Test Structures for Hermeticity Testing of Wafer Bonding Technologies
Schneider, Arnold, Rank, Holger, Müller-Fiedler, Roland, Wittler, Olaf, Reichl, Herbert
Published in ECS transactions (01.10.2010)
Published in ECS transactions (01.10.2010)
Get full text
Journal Article
SiC Fan-out Wafer Level Package for High Power Application
Mackowiak, Piotr, Wittler, Olaf, Braun, Tanja, Erbacher, Kolia, Schiffer, Michael, Schneider-Ramelow, Martin
Published in 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) (07.12.2022)
Published in 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) (07.12.2022)
Get full text
Conference Proceeding