Microstructural characterization of inlaid copper interconnect lines
BESSER, Paul R, ZSCHECH, Ehrenfried, BAKER, Brett, BRAECKELMANN, Greg, ZHAO, Larry, SIMPSON, Cindy, CAPASSO, Cristiano, KAWASAKI, Hisao, WEITZMAN, Elizabeth, BLUM, Werner, WINTER, Delrose, ORTEGA, Richard, ROSE, Stewart, HERRICK, Matt, GALL, Martin, THRASHER, Stacye, TINER, Mike
Published in Journal of electronic materials (01.04.2001)
Published in Journal of electronic materials (01.04.2001)
Get full text
Conference Proceeding
Journal Article