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Year of Publication 16.06.2015
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Year of Publication 04.06.2015
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Year of Publication 04.12.2014
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Year of Publication 02.12.2014
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Year of Publication 24.12.2015
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Year of Publication 17.09.2015
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Edge protection of bonded wafers during wafer thinning
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Year of Publication 01.07.2014
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COMBINATION OF TSV AND BACK SIDE WIRING IN 3D INTEGRATION
IYER SUBRAMANIAN S, BATRA POOJA R, LA TULIPE, JR. DOUGLAS C, WINSTEL KEVIN R, SKORDAS SPYRIDON, GOLZ JOHN W
Year of Publication 02.07.2015
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Year of Publication 02.07.2015
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Year of Publication 01.07.2015
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Substrate bonding with diffusion barrier structures
LIN WEI, VO TUAN A, LA TULIPE, JR. DOUGLAS C, WINSTEL KEVIN R, SKORDAS SPYRIDON, PRIYADARSHINI DEEPIKA, EDELSTEIN DANIEL C
Year of Publication 23.06.2015
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Year of Publication 23.06.2015
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