by Rimolo-Donadio, Renato, Supper, J., Winkel, T., Harrer, H., Schuster, C.
Published in IEEE transactions on electromagnetic compatibility (01.04.2012)

by Deutsch, Alina, Krabbenhoft, Roger S, Melde, Kathleen L, Surovic, Christopher W, Katopis, George A, Kopcsay, Gerard V, Zhen Zhou, Zhaoqing Chen, Kwark, Young H, Winkel, Thomas-Michael, Xiaoxiong Gu, Standaert, Theodorus E
Published in IEEE transactions on electromagnetic compatibility (01.05.2010)

by Winkel, Thomas-Michael
Published in 2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (01.10.2017)

by Guo, Fei, Aygun, Kemal, Becker, W. Dale, Talocia, Stefano Grivet, Hejase, Jose A., Wong, Wui-Weng, Zhou, Tingdong, Barnes, Heidi, Peng, Zhen, Pelger, Alexander, Sahouli, Mohamed, Schutt-Aine, Jose, Ling, Feng, Griese, Elmar, Paladhi, Pavel Roy, Sharma, Rohit, Pham, Nam, Winkel, Thomas-Michael, Fledell, Evan, Hill, Michael J., Silva, Benjamin, Hu, Kaisheng, Aronsson, Jonatan, Liu, Chang, Jeong, Yiru, Yilmaz, Ali E.
Published in 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (17.10.2021)

by Winkel, Thomas-Michael, Frech, Roland, Gneiting, Thomas
Published in 2007 IEEE Electrical Performance of Electronic Packaging (01.10.2007)

by Winkel, T., Harrer, H., Strach, T., Rimolo-Donadio, Renato, Kwark, Y., Xiaomin Duan, Schuster, C.
Published in 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems (01.10.2012)

by Rimolo-Donadio, Renato, Winkel, T., Siviero, C., Kaller, D., Harrer, H., Bruns, H., Schuster, C.
Published in 2011 IEEE 15th Workshop on Signal Propagation on Interconnects (SPI) (01.05.2011)

by DEUTSCH, Alina, WINKEL, Thomas-Michael, KOPCSAY, Gerard V, SUROVIC, Christopher W, RUBIN, Barry J, KATOPIS, George A, CHAMBERLIN, Bruce J, KRABBENHOFT, Roger S
Published in IEEE transactions on advanced packaging (01.02.2005)

by Winkel, T.-M., Frech, R., Klink, E., Kaller, D., Genovese, E.
Published in 2006 IEEE Workship on Signal Propagation on Interconnects (01.05.2006)

by Winkel, T.-M., Deutsch, A., Katopis, G.A., Kopcsay, G.V., Dyckman, W.D., Chamberlin, B., Surovic, C.W., Liu, H., Baks, C.
Published in 2007 IEEE Workshop on Signal Propagation on Interconnects (01.05.2007)

by Winkel, Thomas-Michael, Dutta, Lohit Sagar, Grabinski, Hartmut
Published in 56th ARFTG Conference Digest (01.11.2000)

by Winkel, Thomas-Michael, Dutta, Lohit Sagar, Grabinski, Hartmut
Published in 49th ARFTG Conference Digest (01.06.1997)

by Winkel, Thomas-Michael, Dutta, Lohit Sagar, Grabinski, Hartmut
Published in 47th ARFTG Conference Digest (01.06.1996)

by Winkel, T-M, Harrer, H, Kaller, D, Supper, J, Dreps, D M, Christian, K L, Cosmadelis, D, Zhou, T, Strach, T, Ludwig, J, Edwards, D L
Published in IBM journal of research and development (01.01.2009)

by Harrer, H., Dreps, D. M., Winkel, T.-M., Scholz, W., Truong, B. G., Huber, A., Zhou, T., Christian, K. L., Goth, G. F.
Published in IBM journal of research and development (01.01.2007)

by Chamberlin, Bruce J, Huber, Andreas, Winkel, Thomas-Michael, Huels, Harald
Year of Publication 23.03.2021

by Winkel, T.-M., Becker, W. D., Harrer, H., Pross, H., Kaller, D., Garben, B., Chamberlin, B. J., Kuppinger, S. A.
Published in IBM journal of research and development (01.05.2004)

by Oggioni, Stefano S, Huber, Andreas, Winkel, Thomas-Michael, Huels, Harald, Strach, Thomas
Year of Publication 04.08.2020

by Chamberlin, Bruce J, Huber, Andreas, Winkel, Thomas-Michael, Huels, Harald
Year of Publication 26.06.2018

by CHAMBERLIN, Bruce J, HUELS, Harald, WINKEL, Thomas-Michael, HUBER, Andreas
Year of Publication 17.05.2018