Application of the Short-Pulse Propagation Technique for Broadband Characterization of PCB and Other Interconnect Technologies
Deutsch, Alina, Krabbenhoft, Roger S, Melde, Kathleen L, Surovic, Christopher W, Katopis, George A, Kopcsay, Gerard V, Zhen Zhou, Zhaoqing Chen, Kwark, Young H, Winkel, Thomas-Michael, Xiaoxiong Gu, Standaert, Theodorus E
Published in IEEE transactions on electromagnetic compatibility (01.05.2010)
Published in IEEE transactions on electromagnetic compatibility (01.05.2010)
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Journal Article
The IEEE EPS Packaging Benchmark Suite
Guo, Fei, Aygun, Kemal, Becker, W. Dale, Talocia, Stefano Grivet, Hejase, Jose A., Wong, Wui-Weng, Zhou, Tingdong, Barnes, Heidi, Peng, Zhen, Pelger, Alexander, Sahouli, Mohamed, Schutt-Aine, Jose, Ling, Feng, Griese, Elmar, Paladhi, Pavel Roy, Sharma, Rohit, Pham, Nam, Winkel, Thomas-Michael, Fledell, Evan, Hill, Michael J., Silva, Benjamin, Hu, Kaisheng, Aronsson, Jonatan, Liu, Chang, Jeong, Yiru, Yilmaz, Ali E.
Published in 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (17.10.2021)
Published in 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (17.10.2021)
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Conference Proceeding
Long Range Connector Via Coupling Effects for High Speed Signals
Winkel, Thomas-Michael, Frech, Roland, Gneiting, Thomas
Published in 2007 IEEE Electrical Performance of Electronic Packaging (01.10.2007)
Published in 2007 IEEE Electrical Performance of Electronic Packaging (01.10.2007)
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Conference Proceeding
Framework for co-simulation of signal and power integrity in server systems
Winkel, T., Harrer, H., Strach, T., Rimolo-Donadio, Renato, Kwark, Y., Xiaomin Duan, Schuster, C.
Published in 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems (01.10.2012)
Published in 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems (01.10.2012)
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Conference Proceeding
Fast parametric pre-layout analysis of signal integrity for backplane interconnects
Rimolo-Donadio, Renato, Winkel, T., Siviero, C., Kaller, D., Harrer, H., Bruns, H., Schuster, C.
Published in 2011 IEEE 15th Workshop on Signal Propagation on Interconnects (SPI) (01.05.2011)
Published in 2011 IEEE 15th Workshop on Signal Propagation on Interconnects (SPI) (01.05.2011)
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Conference Proceeding
Extraction of εr(f) and tan δ(f) for printed circuit board insulators up to 30 GHz using the short-pulse propagation technique
DEUTSCH, Alina, WINKEL, Thomas-Michael, KOPCSAY, Gerard V, SUROVIC, Christopher W, RUBIN, Barry J, KATOPIS, George A, CHAMBERLIN, Bruce J, KRABBENHOFT, Roger S
Published in IEEE transactions on advanced packaging (01.02.2005)
Published in IEEE transactions on advanced packaging (01.02.2005)
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Conference Proceeding
Impact of Broken High Frequency Signal Return Path on Signal Integrity
Winkel, T.-M., Frech, R., Klink, E., Kaller, D., Genovese, E.
Published in 2006 IEEE Workship on Signal Propagation on Interconnects (01.05.2006)
Published in 2006 IEEE Workship on Signal Propagation on Interconnects (01.05.2006)
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Conference Proceeding
Determination of transmission line parameters in time- and frequency domain for product related packaging structures
Winkel, T.-M., Deutsch, A., Katopis, G.A., Kopcsay, G.V., Dyckman, W.D., Chamberlin, B., Surovic, C.W., Liu, H., Baks, C.
Published in 2007 IEEE Workshop on Signal Propagation on Interconnects (01.05.2007)
Published in 2007 IEEE Workshop on Signal Propagation on Interconnects (01.05.2007)
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Conference Proceeding
Accurate Characterization of Fringing Effects at On-Chip Line Steps
Winkel, Thomas-Michael, Dutta, Lohit Sagar, Grabinski, Hartmut
Published in 56th ARFTG Conference Digest (01.11.2000)
Published in 56th ARFTG Conference Digest (01.11.2000)
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Conference Proceeding
An Accurate Determination of the Characteristic Impedance Matrix of Coupled Symmetrical Lines on Chips Baser on High Frequency S-Parameter Measurements
Winkel, Thomas-Michael, Dutta, Lohit Sagar, Grabinski, Hartmut
Published in 49th ARFTG Conference Digest (01.06.1997)
Published in 49th ARFTG Conference Digest (01.06.1997)
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Conference Proceeding
An On-Wafer Deembedding Procedure for Devices under Measurement with Error-Networks Containing Arbitrary Line Lengths
Winkel, Thomas-Michael, Dutta, Lohit Sagar, Grabinski, Hartmut
Published in 47th ARFTG Conference Digest (01.06.1996)
Published in 47th ARFTG Conference Digest (01.06.1996)
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Conference Proceeding
Packaging design challenges of the IBM System z10 Enterprise Class server
Winkel, T-M, Harrer, H, Kaller, D, Supper, J, Dreps, D M, Christian, K L, Cosmadelis, D, Zhou, T, Strach, T, Ludwig, J, Edwards, D L
Published in IBM journal of research and development (01.01.2009)
Published in IBM journal of research and development (01.01.2009)
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Journal Article
High-speed interconnect and packaging design of the IBM System z9 processor cage
Harrer, H., Dreps, D. M., Winkel, T.-M., Scholz, W., Truong, B. G., Huber, A., Zhou, T., Christian, K. L., Goth, G. F.
Published in IBM journal of research and development (01.01.2007)
Published in IBM journal of research and development (01.01.2007)
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Journal Article
Manufacturing a product using a soldering process
Chamberlin, Bruce J, Huber, Andreas, Winkel, Thomas-Michael, Huels, Harald
Year of Publication 23.03.2021
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Year of Publication 23.03.2021
Patent
First- and second-level packaging of the z990 processor cage
Winkel, T.-M., Becker, W. D., Harrer, H., Pross, H., Kaller, D., Garben, B., Chamberlin, B. J., Kuppinger, S. A.
Published in IBM journal of research and development (01.05.2004)
Published in IBM journal of research and development (01.05.2004)
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Journal Article
Discrete electronic device embedded in chip module
Oggioni, Stefano S, Huber, Andreas, Winkel, Thomas-Michael, Huels, Harald, Strach, Thomas
Year of Publication 04.08.2020
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Year of Publication 04.08.2020
Patent
Manufacturing a product using a soldering process
Chamberlin, Bruce J, Huber, Andreas, Winkel, Thomas-Michael, Huels, Harald
Year of Publication 26.06.2018
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Year of Publication 26.06.2018
Patent
MANUFACTURING A PRODUCT USING A SOLDERING PROCESS
CHAMBERLIN, Bruce J, HUELS, Harald, WINKEL, Thomas-Michael, HUBER, Andreas
Year of Publication 17.05.2018
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Year of Publication 17.05.2018
Patent