Diffusion of metals in polymers
Faupel, Franz, Willecke, Ralf, Thran, Axel
Published in Materials science & engineering. R, Reports : a review journal (15.03.1998)
Published in Materials science & engineering. R, Reports : a review journal (15.03.1998)
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Journal Article
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Year of Publication 09.09.2008
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Bi-layer etch stop process for defect reduction and via stress migration improvement
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Year of Publication 09.09.2008
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Bi-layer etch stop process for defect reduction and via stress migration improvement
WILLECKE RALF B, KRUSE NATHAN J, ZHAO JIN, KIM TAE S, FISCHER AUGUST J
Year of Publication 14.06.2007
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Year of Publication 14.06.2007
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Bi-layer etch stop process for defect reduction and via stress migration improvement
Kim, Tae S, Zhao, Jin, Kruse, Nathan J, Fischer, August J, Willecke, Ralf B
Year of Publication 03.04.2007
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Year of Publication 03.04.2007
Patent
Bi-layer etch stop process for defect reduction and via stress migration improvement
WILLECKE RALF B, KRUSE NATHAN J, ZHAO JIN, KIM TAE S, FISCHER AUGUST J
Year of Publication 03.04.2007
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Year of Publication 03.04.2007
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Bi-layer etch stop process for defect reduction and via stress migration improvement
WILLECKE RALF B, KRUSE NATHAN J, ZHAO JIN, KIM TAE S, FISCHER AUGUST J
Year of Publication 15.12.2005
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Year of Publication 15.12.2005
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METHOD OF DEPOSITING LOW-PERMITTIVITY FILM, SUBSTRATE PROCESSING SYSTEM, METHOD OF FORMING DUAL DAMASCENE STRUCTURE, AND DUAL DAMASCENE STRUCTURE
LIU KUO-WEI, BARNES MIKE, WILLECKE RALF B, YAU WAI-FAN, CHEUNG DAVID, MANDAL ROBERT P, LU YUNGNG, JENG SHIN-PUU, ISHIKAWA TETSUYA, MOGHADAM FARHAD, POON TZE
Year of Publication 03.06.2010
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Year of Publication 03.06.2010
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Plasma processes for depositing low dielectric constant films
Cheung, David, Yau, Wai-Fan, Mandal, Robert P, Jeng, Shin-Puu, Liu, Kuo-Wei, Lu, Yung-Cheng, Barnes, Michael, Willecke, Ralf B, Moghadam, Farhad, Ishikawa, Tetsuya, Poon, Tze Wing
Year of Publication 14.07.2009
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Year of Publication 14.07.2009
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Plasma processes for depositing low dielectric constant films
BARNES MICHAEL, POON TZE WING, LIU KUO-WEI, WILLECKE RALF B, YAU WAI-FAN, CHEUNG DAVID, MANDAL ROBERT P, LU YUNGNG, JENG SHIN-PUU, ISHIKAWA TETSUYA, MOGHADAM FARHAD
Year of Publication 14.07.2009
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Year of Publication 14.07.2009
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Plasma processes for depositing low dielectric constant films
JENG, SHIN-PUU, MOGHADAM, FARHAD, WILLECKE, RALF B, POON, TZE, CHEUNG, DAVID, LIU, KUO-WEI, LU, YUNGNG, BARNES, MIKE, ISHIKAWA, TETSUYA, MANDAL, ROBERT P, YAU, WAI-FAN
Year of Publication 10.12.2008
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Year of Publication 10.12.2008
Patent
Nickel silicide - silicon nitride adhesion through surface passivation
Tessmer, Glenn, Lu, Jiong-Ping, Hewson, Melissa, Miles, Donald, Willecke, Ralf, McKerrow, Andrew, Kirkpatrick, Brian, Montgomery, Clinton
Year of Publication 01.04.2004
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Year of Publication 01.04.2004
Patent
Plasma processes for depositing low dielectric constant films
JENG, SHIN-PUU, MOGHADAM, FARHAD, WILLECKE, RALF B, POON, TZE, CHEUNG, DAVID, LIU, KUO-WEI, LU, YUNGNG, BARNES, MIKE, ISHIKAWA, TETSUYA, MANDAL, ROBERT P, YAU, WAI-FAN
Year of Publication 04.07.2007
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Year of Publication 04.07.2007
Patent
Effects of dielectric liners on TDDB lifetime of a Cu/ low-k interconnect
Tsui, T.Y., Matz, P., Willecke, R., Zielinski, E., Tae Kim, Haase, G., McPherson, J., Singh, A., McKerrow, A.J.
Published in Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729) (2004)
Published in Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729) (2004)
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Conference Proceeding
Nickel silicide - silicon nitride adhesion through surface passivation
MILES DONALD S, WILLECKE RALF B, HEWSON MELISSA M, LU JIONG-PING, KIRKPATRICK BRIAN K, TESSMER GLENN J, MONTGOMERY CLINTON L, MCKERROW ANDREW J
Year of Publication 28.04.2005
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Year of Publication 28.04.2005
Patent