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Method for making interconnect for low temperature chip attachment
by
DANOVITCH, DAVID HIRSCH
,
CARLOS JUAN SAMBUCETTI
,
GRUBER, PETER ALFRED
,
BERGER, DANIEL GEORGE
,
BROUILLETTE, GUY PAUL
,
MICHAEL LIEHR
,
WILLAM THOMAS MOTSIFF
,
HUMPHREY, BRUCE LEE
Year of Publication
01.11.1999
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Patent
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chemistry
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sciences
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basic electric elements
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casings or constructional details of electric apparatus
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cladding or plating by soldering or welding
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cutting by applying heat locally, e.g. flame cutting
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electric solid state devices not otherwise provided for
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electric techniques not otherwise provided for
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esp@cenet
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