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"WILBUR C. KRUSELL"
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"WILBUR C. KRUSELL"
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Tantalum oxide thin films for dielectric applications by low-pressure chemical vapor deposition : physical and electrical properties
by
HITCHENS, W. R
,
KRUSELL, W. C
,
DOBKIN, D. M
Published in
Journal of the Electrochemical Society
(01.09.1993)
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METHOD OF REMOVING METAL IN SCRUBBER
by
KRUSELL WILBUR C
Year of Publication
13.05.2010
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METHOD OF REMOVING METALS IN SCRUBBER
by
KRUSELL WILBUR C
Year of Publication
28.06.2007
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Verfahren zum Reinigen von Substraten
by
KRUSELL
,
WILBUR C
Year of Publication
26.04.2007
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METHODS AND APPARATUS FOR CLEANING SEMICONDUCTOR SUBSTRATES AFTER POLISHING OF COPPER FILM
by
DIANE J. HYMES
,
LIMING ZHANG
,
WILBUR C
.
KRUSELL
,
YUEXING ZHAO
Year of Publication
15.09.2010
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PROCEDE POUR ENLEVER LES METAUX DANS UN DISPOSITIF DE RECURAGE
by
KRUSELL WILBUR C
Year of Publication
02.04.1999
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METHODS AND APPARATUS FOR CLEANING SEMICONDUCTOR SUBSTRATES AFTER POLISHING OF COPPER FILM
by
HYMES, DIANE J
,
ZHAO, YUEXING
,
ZHANG, LIMING
,
KRUSELL
,
WILBUR C
Year of Publication
24.02.2009
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PROCESS FOR BRUSH CLEANING
by
SIMMONS, MARK, A
,
KRUSELL
,
WILBUR
,
C
Year of Publication
11.05.2005
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Metal contaminant removal during substrate cleaning
by
KRUSELL WILBUR C
Year of Publication
19.01.1996
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Method to remove metals in a scrubber
by
KRUSELL WILBUR C
,
MALIK IGOR J
Year of Publication
14.08.2001
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Methods and apparatus for cleaning semiconductor substrates after polishing of copper film
by
ZHAO YUEXING
,
KRUSELL WILBUR C
,
ZHANG LIMING
,
HYMES DIANE J
Year of Publication
09.08.2005
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Methods and apparatus for cleaning semiconductor substrates after polishing of copper film
by
Zhang, Liming
,
Zhao, Yuexing
,
Hymes, Diane J
,
Krusell
,
Wilbur C
Year of Publication
09.08.2005
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PROCESS FOR BRUSH CLEANING
by
SIMMONS, MARK, A
,
KRUSELL
,
WILBUR
,
C
Year of Publication
10.01.2001
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Methods and apparatus for cleaning semiconductor substrates after polishing of copper film
by
ZHAO YUEXING
,
KRUSELL WILBUR C
,
ZHANG LIMING
,
HYMES DIANE J
Year of Publication
19.02.2004
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Method and apparatus for in-situ monitoring of thickness during chemical-mechanical polishing
by
PECEN JIRI
,
CHADDA SAKET
,
JAIRATH RAHUL
,
KRUSELL WILBUR C
Year of Publication
16.09.2003
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Method and apparatus for in-situ monitoring of thickness during chemical-mechanical polishing
by
Pecen, Jiri
,
Chadda, Saket
,
Jairath, Rahul
,
Krusell
,
Wilbur C
Year of Publication
16.09.2003
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Drip chemical delivery apparatus
by
LARSON; LANE L
,
KRUSELL
;
WILBUR C
Year of Publication
29.12.1998
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PROCESS FOR BRUSH CLEANING
by
SIMMONS, MARK, A
,
KRUSELL
,
WILBUR
,
C
Year of Publication
26.08.1998
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Drip chemical delivery method and apparatus
by
LARSON; LANE L
,
KRUSELL
;
WILBUR C
Year of Publication
03.03.1998
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Process for brush cleaning
by
SIMMONS; MARK A
,
KRUSELL
;
WILBUR C
Year of Publication
02.12.1997
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