Search Results - "WENG Li-Sheng" :: K.UTB vyhledávací portál | TBU Library Retrieval Portal

Ultrasonic Frequency-Dependent Amplitude Attenuation Characteristics Technique for Nondestructive Evaluation of Concrete

Ultrasonic Frequency-Dependent Amplitude Attenuation Characteristics Technique for Nondestructive Evaluation of Concrete

by J Woody Ju, Li-Sheng, Weng, Liu, Yi
Published in ACI materials journal (01.05.2006)

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Journal Article

An unpredictable gastrointestinal bleed

An unpredictable gastrointestinal bleed

by Li, De-Feng, Tian, Yan-Hui, Shi, Rui-Yue, Yao, Jun, Wang, Li-Sheng, Xu, Zheng-Lei
Published in Revista española de enfermedades digestivas (01.04.2024)

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Journal Article

Proof of hidden node number and experiments on RBF network for well log data inversion

Proof of hidden node number and experiments on RBF network for well log data inversion

by Kou-Yuan Huang, Liang-Chi Shen, Jiun-Der You, Li-Sheng Weng
Published in 2016 IEEE International Geoscience and Remote Sensing Symposium (IGARSS) (01.07.2016)

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Conference Proceeding

Well log data inversion using radial basis function network

Well log data inversion using radial basis function network

by Kou-Yuan Huang, Liang-Chi Shen, Li-Sheng Weng
Published in 2011 IEEE International Geoscience and Remote Sensing Symposium (01.07.2011)

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Conference Proceeding

Radial basis function network for well log data inversion

Radial basis function network for well log data inversion

by Kou-Yuan Huang, Liang-Chi Shen, Li-Sheng Weng
Published in The 2011 International Joint Conference on Neural Networks (01.07.2011)

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Conference Proceeding

An unpredictable gastrointestinal bleed

An unpredictable gastrointestinal bleed

by Li, De-Feng, Xu, Zheng-Lei, Tian, Yan-Hui, Yao, Jun, Weng, Li-Sheng, Shi, Rui-Yue
Published in Revista española de enfermedades digestivas (01.04.2024)

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Journal Article

CHIP PACKAGE WITH CORE EMBEDDED INTEGRATED DEVICES

CHIP PACKAGE WITH CORE EMBEDDED INTEGRATED DEVICES

by WENG, Li-Sheng, RAMALINGAM, Suresh
Year of Publication 15.02.2024

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Patent

CHIP PACKAGE WITH CORE EMBEDDED INTEGRATED PASSIVE DEVICE

CHIP PACKAGE WITH CORE EMBEDDED INTEGRATED PASSIVE DEVICE

by WENG, Li-Sheng, PFEIFFENBERGER, Alexander Helmut
Year of Publication 30.05.2024

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Patent

PACKAGE COMPRISING A SUBSTRATE AND A HIGH-DENSITY INTERCONNECT INTEGRATED DEVICE

PACKAGE COMPRISING A SUBSTRATE AND A HIGH-DENSITY INTERCONNECT INTEGRATED DEVICE

by WENG, Li-Sheng, SONG, Zhimin, SUN, Yangyang
Year of Publication 20.09.2023

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Patent

CHIP PACKAGE WITH NEAR-DIE INTEGRATED PASSIVE DEVICE

CHIP PACKAGE WITH NEAR-DIE INTEGRATED PASSIVE DEVICE

by WENG, Li-Sheng, SHI, Hong, RAMALINGAM, Suresh
Year of Publication 10.08.2023

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Patent

Integrated device comprising interconnect structures having an inner interconnect, a dielectric layer and a conductive layer

Integrated device comprising interconnect structures having an inner interconnect, a dielectric layer and a conductive layer

by Weng, Li-Sheng, Sun, Yangyang, Li, Yue
Year of Publication 13.06.2023

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Patent

Multi-die interconnect

Multi-die interconnect

by Weng, Li-Sheng, We, Hong Bok
Year of Publication 28.02.2023

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Patent

PACKAGE ON PACKAGE (POP) INTERCONNECT REGIONS WITH REDUCED CAPACITANCE TO REDUCE IMPEDANCE DISCONTINUITY

PACKAGE ON PACKAGE (POP) INTERCONNECT REGIONS WITH REDUCED CAPACITANCE TO REDUCE IMPEDANCE DISCONTINUITY

by SHAH, Milind, WENG, Li-Sheng, HSU, Marcus, KIM, Chin Kwan
Year of Publication 10.10.2024

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Patent

MULTI-DIE INTERCONNECT

MULTI-DIE INTERCONNECT

by WENG, Li-Sheng, WE, Hong Bok
Year of Publication 06.03.2024

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Patent

Repurposed seed layer for high frequency noise control and electrostatic discharge connection

Repurposed seed layer for high frequency noise control and electrostatic discharge connection

by Weng, Li-Sheng, Sun, Yangyang, Li, Yue
Year of Publication 05.07.2022

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Patent

PACKAGE COMPRISING WIRE BONDS COUPLED TO INTEGRATED DEVICES

PACKAGE COMPRISING WIRE BONDS COUPLED TO INTEGRATED DEVICES

by ZHOU, Rong, WENG, Li-Sheng, ZHAO, Lily, SUN, Yangyang
Year of Publication 07.02.2024

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Patent

PACKAGE COMPRISING A SUBSTRATE AND A HIGH-DENSITY INTERCONNECT INTEGRATED DEVICE

PACKAGE COMPRISING A SUBSTRATE AND A HIGH-DENSITY INTERCONNECT INTEGRATED DEVICE

by WENG, Li-Sheng, SONG, Zhimin, SUN, Yangyang
Year of Publication 19.05.2022

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Patent

PACKAGE COMPRISING A SUBSTRATE AND A HIGH-DENSITY INTERCONNECT INTEGRATED DEVICE

PACKAGE COMPRISING A SUBSTRATE AND A HIGH-DENSITY INTERCONNECT INTEGRATED DEVICE

by WENG, Li-Sheng, SONG, Zhimin, SUN, Yangyang
Year of Publication 12.05.2022

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Patent

CHIP PACKAGE WITH INTEGRATED CURRENT CONTROL

CHIP PACKAGE WITH INTEGRATED CURRENT CONTROL

by WENG, Li-Sheng, LEE, Chao-Chin, CHENG, Chun-Yuan
Year of Publication 12.10.2023

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Patent

Certificateless key-insulated signature without random oracles

Certificateless key-insulated signature without random oracles

by Wan, Zhong-mei, Lai, Xue-jia, Weng, Jian, Liu, Sheng-li, Long, Yu, Hong, Xuan
Published in Journal of Zhejiang University. A. Science (01.12.2009)

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Journal Article