Low damage in situ contact cleaning method by a highly dense and directional ECR plasma
PARK, I. S, YOON, M, LEE, H. D, PARK, C. S, WEE, Y. J, CHOI, G. H, OH, K. Y, LEE, S. I, LEE, M. Y
Published in Japanese Journal of Applied Physics (1996)
Published in Japanese Journal of Applied Physics (1996)
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Electromigration Failure Mechanism and Lifetime Expectation for Bi-Modal Distribution in Cu/Low-k Interconnect
Young Jin Wee, Kim, A.T., Jung Eun Lee, Jae Yeol Maeng, Woon Hyuk Choi, Seowoo Nam, Seungjin Lee, Kyoung Woo Lee, Jaehak Kim, Keeyoung Jun, Seung Man Choi, Jaeouk Choo, Jungshik Heo, Hong Jae Shin, Nae In Lee
Published in 2007 IEEE International Interconnect Technology Conferencee (01.06.2007)
Published in 2007 IEEE International Interconnect Technology Conferencee (01.06.2007)
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