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"WE HONG BOK"
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"WE HONG BOK"
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Package with a substrate comprising periphery interconnects
by
We
,
Hong Bok
,
Patil, Aniket
Year of Publication
05.09.2023
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Variable dielectric constant materials in same layer of a package
by
We
,
Hong Bok
,
Patil, Aniket
Year of Publication
01.08.2023
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Hybrid package apparatus and method of fabricating
by
Navaja, Brigham
,
We
,
Hong Bok
,
Patil, Aniket
Year of Publication
02.04.2024
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Thermal mitigation die using back side etch
by
We
,
Hong Bok
,
Patil, Aniket
,
Kim, Jonghae
Year of Publication
14.11.2023
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Redistribution layer connection
by
We
,
Hong Bok
,
Hsu, Marcus
,
Patil, Aniket
Year of Publication
10.10.2023
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Thermal structures adapted to electronic device heights in integrated circuit (IC) packages
by
We
,
Hong Bok
,
Yan, Bohan
,
Patil, Aniket
Year of Publication
05.09.2023
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Package having a substrate comprising surface interconnects aligned with a surface of the substrate
by
We
,
Hong Bok
,
Hsu, Marcus
,
Patil, Aniket
Year of Publication
20.06.2023
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Packages with local high-density routing region embedded within an insulating layer
by
Kang, Kuiwon
,
We
,
Hong Bok
,
Patil, Aniket
Year of Publication
14.03.2023
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Multi-die interconnect
by
Weng, Li-Sheng
,
We
,
Hong Bok
Year of Publication
28.02.2023
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SPLIT DIE INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING DIE-TO-DIE (D2D) CONNECTIONS IN DIE-SUBSTRATE STANDOFF CAVITY, AND RELATED FABRICATION METHODS
by
Navaja, Brigham
,
We
,
Hong Bok
,
Patil, Aniket
Year of Publication
02.02.2023
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Integrated circuit (IC) package employing added metal for embedded metal traces in ETS-based substrate for reduced signal path impedance, and related fabrication methods
by
Buot, Joan Rey Villarba
,
We
,
Hong Bok
,
Patil, Aniket
Year of Publication
24.09.2024
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Substrate comprising a high-density interconnect portion embedded in a core layer
by
Kang, Kuiwon
,
We
,
Hong Bok
,
Patil, Aniket
Year of Publication
10.01.2023
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Double sided embedded trace substrate
by
Kang, Kuiwon
,
Wang, Zhijie
,
We
,
Hong Bok
Year of Publication
03.01.2023
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Package comprising an integrated device coupled to a substrate through a cavity
by
Kang, Kuiwon
,
We
,
Hong Bok
,
Patil, Aniket
Year of Publication
03.01.2023
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Integrated circuit (IC) packages employing split, double-sided metallization structures to facilitate a semiconductor die ("die") module employing stacked dice, and related fabrication methods
by
We
,
Hong Bok
,
Hsu, Marcus
,
Patil, Aniket
Year of Publication
27.09.2022
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Package comprising a substrate with interconnect routing over solder resist layer and an integrated device coupled to the substrate and method for manufacturing the package
by
Kang, Kuiwon
,
We
,
Hong Bok
,
Patil, Aniket
Year of Publication
13.09.2022
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THERMAL STRUCTURES ADAPTED TO ELECTRONIC DEVICE HEIGHTS IN INTEGRATED CIRCUIT (IC) PACKAGES
by
We
,
Hong Bok
,
Yan, Bohan
,
Patil, Aniket
Year of Publication
01.09.2022
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Substrate comprising interconnects in a core layer configured for skew matching
by
Buot, Joan Rey Villarba
,
We
,
Hong Bok
,
Patil, Aniket
Year of Publication
09.04.2024
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DEEP TRENCH CAPACITORS (DTCs) EMPLOYING BYPASS METAL TRACE SIGNAL ROUTING, AND RELATED INTEGRATED CIRCUIT (IC) PACKAGES AND FABRICATION METHODS
by
Buot, Joan Rey Villarba
,
We
,
Hong Bok
,
Patil, Aniket
Year of Publication
01.02.2024
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Multi-terminal integrated passive devices embedded on die and a method for fabricating the multi-terminal integrated passive devices
by
We
,
Hong Bok
,
Patil, Aniket
,
Kim, Jonghae
Year of Publication
24.05.2022
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