Design, Simulation and Fabrication of Electrowetting-Based Actuators for Integrated Digital Microfluidics
Jiangang Wu, Ruifeng Yue, Xuefeng Zeng, Ming Kang, Zheyao Wang, Litian Liu
Published in 2006 1st IEEE International Conference on Nano/Micro Engineered and Molecular Systems (01.01.2006)
Published in 2006 1st IEEE International Conference on Nano/Micro Engineered and Molecular Systems (01.01.2006)
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Conference Proceeding
Seed Layer Etching, Thermal Reflow and Bonding of Cu-Sn Micro Bumps with 5\ \mu \mathrm Diameters
Shi, Yunfan, Wang, Zilin, Huang, Rutian, Kang, Jin, Zheng, Kai, Bu, Weihai, Wang, Zheyao
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
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Conference Proceeding
Droplet creator based on electrowetting-on-dielectric for lab on a chip
Zeng, Xuefeng, Yue, Ruifeng, Wu, Jiangang, Hu, Huan, Dong, Liang, Wang, Zheyao, He, Feng, Liu, Litian
Published in Science in China Series E (01.04.2006)
Published in Science in China Series E (01.04.2006)
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Journal Article
Design and optimization of laminated piezoresistive microcantilever sensors
Wang, Zheyao, Yue, Ruifeng, Zhang, Ruoxin, Liu, Litian
Published in Sensors and actuators. A. Physical. (17.05.2005)
Published in Sensors and actuators. A. Physical. (17.05.2005)
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Journal Article
Through-silicon-via Architecture of 3D Integration for Superconducting Quantum Computing Application
Yu, Jiexun, Wang, Qian, Zheng, Yao, Song, Changming, Fang, Junpeng, Li, Tiefu, Wu, Haihua, Wang, Zheyao, Cai, Jian
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
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Conference Proceeding
Measurement of orthodontic forces exerted on the upper right central incisor with the increase of the distance of tooth movement and thickness of the aligner
Ren, Chaochao, Li, Xiaowei, Wang, Zheyao, Wang, Hongmei, Bai, Yuxing
Published in Zhonghua kouqiang yixue zazhi (01.03.2014)
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Published in Zhonghua kouqiang yixue zazhi (01.03.2014)
Journal Article
A Micro-Scale Low-Temperature Atmospheric Micro-Plasma Jet with Hollow-Cone Electrodes
Zhang, Chenxiang, Fang, Chuan, Jiang, Liwei, Li, He-Ping, Wang, Zheyao
Published in 2022 IEEE 35th International Conference on Micro Electro Mechanical Systems Conference (MEMS) (09.01.2022)
Published in 2022 IEEE 35th International Conference on Micro Electro Mechanical Systems Conference (MEMS) (09.01.2022)
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Conference Proceeding
Development of Open Microfluidic Devices for Water-in-Oil Two-Phase Flow
Wang, Linjue, Niu, Chenqi, Zhang, Chong, Wang, Zheyao
Published in 2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS) (01.01.2020)
Published in 2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS) (01.01.2020)
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Conference Proceeding
Thermal and Electrical Reliability Tests of Air-Gap Through-Silicon Vias
Huang, Cui, Liu, Ran, Wang, Zheyao
Published in IEEE transactions on device and materials reliability (01.03.2015)
Published in IEEE transactions on device and materials reliability (01.03.2015)
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Magazine Article
An Atmospheric Microplasma Generator with Low Breakdown Voltages
Jiang, Liwei, Zhang, Chenxiang, Fang, Chuan, Li, He-Ping, Wang, Zheyao
Published in 2021 IEEE 34th International Conference on Micro Electro Mechanical Systems (MEMS) (25.01.2021)
Published in 2021 IEEE 34th International Conference on Micro Electro Mechanical Systems (MEMS) (25.01.2021)
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Conference Proceeding
DESIGN AND SIMULATION OF A NOVEL OPERATION MODE OF INTEGRATED FERROELECTRIC MICRO-SENSORS
WANG, CHAO, WANG, ZHEYAO, REN, TIANLING, LIU, LITIAN
Published in Integrated ferroelectrics (01.11.2006)
Published in Integrated ferroelectrics (01.11.2006)
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Journal Article
Coaxial Through-Silicon-Vias Using Low-κ SiO2 Insulator
Yu, Pengbo, Lin, Hongxiao, He, Zhiwei, Song, Changming, Cai, Jian, Wang, Qian, Wang, Zheyao
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
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Conference Proceeding
A Micromachined Piezoelectric Ultrasonic Transducer Operating in 33 Mode Using Square Interdigital Electrodes
Wang, Chao, Wang, Zheyao, Ren, Tian-Ling, Zhu, Yiping, Yang, Yi, Wu, Xiaoming, Wang, Haining, Fang, Huajun, Liu, Litian
Published in IEEE sensors journal (01.07.2007)
Published in IEEE sensors journal (01.07.2007)
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Journal Article
A Micromachined Piezoelectric Ultrasonic Transducer Operating in d@@d33@ Mode Using Square Interdigital Electrodes
Chao, Wang, Wang, Zheyao, Ren, Tian-Ling, Zhu, Yiping, Yang, Yi, Wu, Xiaoming, Wang, Haining, Fang, Huajun, Liu, Litian
Published in IEEE sensors journal (01.07.2007)
Published in IEEE sensors journal (01.07.2007)
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Journal Article
A Micromachined Piezoelectric Ultrasonic Transducer Operating in d sub(33) Mode Using Square Interdigital Electrodes
Wang, Chao, Wang, Zheyao, Ren, Tian-Ling, Zhu, Yiping, Yang, Yi, Wu, Xiaoming, Wang, Haining, Fang, Huajun, Liu, Litian
Published in IEEE sensors journal (01.01.2007)
Published in IEEE sensors journal (01.01.2007)
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Journal Article