Heat-Depolymerizable Polypropylene Carbonate as a Temporary Bonding Adhesive for Fabrication of Flexible Silicon Sensor Chips
Xue, Xingjun, Yang, Shujie, Wang, Zheyao
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.11.2017)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.11.2017)
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Journal Article
Void-formation in uncured and partially-cured BCB bonding adhesive on patterned surfaces
Song, Zhen, Wu, Dong, Zhu, Huizhong, Liu, Litian, Wang, Zheyao
Published in Microelectronic engineering (02.04.2015)
Published in Microelectronic engineering (02.04.2015)
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Journal Article
Changes in force associated with the amount of aligner activation and lingual bodily movement of the maxillary central incisor
Li, Xiaowei, Ren, Chaochao, Wang, Zheyao, Zhao, Pai, Wang, Hongmei, Bai, Yuxing
Published in Korean journal of orthodontics (2012) (01.03.2016)
Published in Korean journal of orthodontics (2012) (01.03.2016)
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Journal Article
A chemisorption-based microcantilever chemical sensor for the detection of trimethylamine
Yang, Rui, Huang, Xin, Wang, Zheyao, Zhou, Youzheng, Liu, Litian
Published in Sensors and actuators. B, Chemical (04.03.2010)
Published in Sensors and actuators. B, Chemical (04.03.2010)
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Journal Article
Thermal and Electrical Properties of BCB-Liner Through-Silicon Vias
Huang, Cui, Pan, Liyang, Liu, Ran, Wang, Zheyao
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.12.2014)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.12.2014)
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Journal Article
High aspect ratio copper through-silicon-vias for 3D integration
Song, Chongshen, Wang, Zheyao, Chen, Qianwen, Cai, Jian, Liu, Litian
Published in Microelectronic engineering (01.10.2008)
Published in Microelectronic engineering (01.10.2008)
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Journal Article
Conference Proceeding
Mechanical Reliability Testing of Air-Gap Through-Silicon Vias
Huang, Cui, Wu, Ke, Wang, Zheyao
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.05.2016)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.05.2016)
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Journal Article
Bottom-up copper electroplating using transfer wafers for fabrication of high aspect-ratio through-silicon-vias
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Journal Article
Conference Proceeding
Fabrication of Ni Microbumps With Small Feature Size on Au Using Electroless Ni Plating With Noncontact Induction
Du, Yuxin, Song, Zhen, Zhu, Huizhong, Wang, Zheyao
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.08.2015)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.08.2015)
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Journal Article
The influence of ultrasonic agitation on copper electroplating of blind-vias for SOI three-dimensional integration
Chen, Qianwen, Wang, Zheyao, Cai, Jian, Liu, Litian
Published in Microelectronic engineering (01.03.2010)
Published in Microelectronic engineering (01.03.2010)
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Journal Article
Conference Proceeding