Search Results - "WANG TSUNG-DING" :: K.UTB vyhledávací portál | TBU Library Retrieval Portal

Supercarrier Redistribution Layers to Realize Ultra Large 2.5D Wafer Scale Packaging by CoWoS

Supercarrier Redistribution Layers to Realize Ultra Large 2.5D Wafer Scale Packaging by CoWoS

by Hou, S. Y., Lee, Chien Hsun, Wang, Tsung-Ding, Hou, Hao Cheng, Hu, Hsieh-Pin
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)

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Conference Proceeding

REDISTRIBUTION LINES AND THE METHOD FORMING THE SAME THROUGH STITCHING

REDISTRIBUTION LINES AND THE METHOD FORMING THE SAME THROUGH STITCHING

by HOU SHANG YUN, HOU HAO CHENG, LEE CHIEN HSUN, WANG TSUNG DING
Year of Publication 24.09.2024

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Patent

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

by LIN SHENG CHI, HOU SHANG YUN, LIANG YU MIN, FLESHMAN COLLIN JORDON, HOU HAO CHENG, LEE CHIEN HSUN, PAN KUO LUNG, WANG TSUNG DING, CHENG JUNG WEI, CHUN SHU RONG, CHEN WEI YU
Year of Publication 05.10.2023

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Patent

SUBSTRATE DESIGN FOR SEMICONDUCTOR PACKAGES AND METHOD OF FORMING SAME

SUBSTRATE DESIGN FOR SEMICONDUCTOR PACKAGES AND METHOD OF FORMING SAME

by YU CHEN HUA, LEE CHIEN HSUN, WANG TSUNG DING, CHENG JUNG WEI
Year of Publication 23.08.2016

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Patent

SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME

SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME

by LIU CHUNG SHI, WU JIUN YI, LIANG YU MIN, HOU HAO CHENG, CHOU LI WEI, LEE CHIEN HSUN, LIN HUNG JEN, WANG TSUNG DING, CHENG JUNG WEI
Year of Publication 08.04.2019

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Patent

SUBSTRATE DESIGN FOR SEMICONDUCTOR PACKAGES AND METHOD OF FORMING SAME

SUBSTRATE DESIGN FOR SEMICONDUCTOR PACKAGES AND METHOD OF FORMING SAME

by YU CHEN HUA, HOU HAO CHENG, LII MIRNG JI, LEE CHIEN HSUN, LIN HUNG JEN, WANG TSUNG DING, CHENG JUNG WEI, LIU MING CHE
Year of Publication 08.12.2017

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Patent

PACKAGE STRUCTURES AND METHODS FOR FORMING THE SAME

PACKAGE STRUCTURES AND METHODS FOR FORMING THE SAME

by YU CHEN HUA, WU JIUN YI, WANG TSUNG DING
Year of Publication 08.01.2014

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Patent

SUBSTRATE DESIGN FOR SEMICONDUCTOR PACKAGES AND METHOD OF FORMING SAME

SUBSTRATE DESIGN FOR SEMICONDUCTOR PACKAGES AND METHOD OF FORMING SAME

by YU CHEN HUA, HOU HAO CHENG, LII MIRNG JI, LEE CHIEN HSUN, LIN HUNG JEN, WANG TSUNG DING, CHENG JUNG WEI, LIU MING CHE
Year of Publication 09.03.2016

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Patent

PACKAGE ON PACKAGE DEVICES AND METHODS OF PACKAGING SEMICONDUCTOR DIES

PACKAGE ON PACKAGE DEVICES AND METHODS OF PACKAGING SEMICONDUCTOR DIES

by WU JIUN YI, SUNG M.C, LEE CHIEN HSUN, LII MIRNG JI, WANG TSUNG DING
Year of Publication 02.01.2015

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Patent

IMPROVING THE DELAMINATION RESISTANCE OF STACKED DIES IN DIE SAW

IMPROVING THE DELAMINATION RESISTANCE OF STACKED DIES IN DIE SAW

by LEE BO I, WANG TSUNG DING
Year of Publication 17.03.2011

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Patent

PACKAGE-ON-PACKAGE STRUCTURE AND METHODS FOR FORMING THE SAME

PACKAGE-ON-PACKAGE STRUCTURE AND METHODS FOR FORMING THE SAME

by WU JIUN YI, HOU HAO CHENG, LEE CHIEN HSUN, WANG TSUNG DING, CHENG JUNG WEI, SUNG MING CHUNG
Year of Publication 19.09.2014

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Patent

WAFER-LEVEL MOLDED STRUCTURE FOR PACKAGE ASSEMBLY

WAFER-LEVEL MOLDED STRUCTURE FOR PACKAGE ASSEMBLY

by LEE BO I, WANG TSUNG DING, LEE CHIEN HSIUN
Year of Publication 04.03.2011

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Patent

SUBSTRATE FIXING JIGS FOR PACKAGING AND FABRICATION METHODS FOR SEMICONDUCTOR CHIP PACKAGES

SUBSTRATE FIXING JIGS FOR PACKAGING AND FABRICATION METHODS FOR SEMICONDUCTOR CHIP PACKAGES

by YU CHEN HUA, LEE BO I, WANG TSUNG DING, CHENG WILLIAM, LEE CHIEN HSIUN
Year of Publication 26.10.2011

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Patent

PACKAGE STRUCTURE INCLUDING LOWER MOLDED STRUCTURE INCLUDING A SUBSTRATE PORTION, AND METHODS OF FORMING THE PACKAGE STRUCTURE

PACKAGE STRUCTURE INCLUDING LOWER MOLDED STRUCTURE INCLUDING A SUBSTRATE PORTION, AND METHODS OF FORMING THE PACKAGE STRUCTURE

by Hou, Shang-Yun, Hou, Hao-Cheng, Chen, Chin-Liang, Wang, Tsung-Ding, Lee, Chien-Hsun
Year of Publication 26.09.2024

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Patent

Redistribution Lines and The Method Forming the Same Through Stitching

Redistribution Lines and The Method Forming the Same Through Stitching

by Hou, Shang-Yun, Hou, Hao-Cheng, Wang, Tsung-Ding, Lee, Chien-Hsun
Year of Publication 19.09.2024

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Patent

MULTI-DIE PACKAGE STRUCTURES INCLUDING REDISTRIBUTION LAYERS

MULTI-DIE PACKAGE STRUCTURES INCLUDING REDISTRIBUTION LAYERS

by Yu, Chen-Hua, Yee, Kuo-Chung, Wang, Tsung-Ding, Lee, Chien-Hsun
Year of Publication 25.07.2024

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Patent

Three-Dimensional Semiconductor Device and Method

Three-Dimensional Semiconductor Device and Method

by Hou, Hao-Cheng, Wang, Tsung-Ding, Lee, Chien-Hsun, Wang, Jeng-An, Lin, Sheng-Chi
Year of Publication 28.03.2024

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Patent

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

by Liang, Yu-Min, Hou, Hao-Cheng, Wang, Tsung-Ding, Cheng, Jung-Wei
Year of Publication 29.02.2024

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Patent

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

by Hou, Hao-Cheng, Wang, Tsung-Ding, Lee, Chien-Hsun, Cheng, Jung-Wei
Year of Publication 22.02.2024

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Patent

Packages with Chips Comprising Inductor-Vias and Methods Forming the Same

Packages with Chips Comprising Inductor-Vias and Methods Forming the Same

by Hou, Shang-Yun, Hou, Hao-Cheng, Wang, Tsung-Ding, Lee, Chien-Hsun, Cheng, Jung Wei
Year of Publication 08.02.2024

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Patent

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