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RE (La, Nd and Yb) doped CeO2 abrasive particles for chemical mechanical polishing of dielectric materials: Experimental and computational analysis
Cheng, Jie, Huang, Shuo, Li, Yang, Wang, Tongqing, Xie, Lile, Lu, Xinchun
Published in Applied surface science (15.03.2020)
Published in Applied surface science (15.03.2020)
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LINC00958 promotes bladder cancer carcinogenesis by targeting miR-490-3p and AURKA
Zhen, Hongtao, Du, Peng, Yi, Qiang, Tang, Xiaolong, Wang, Tongqing
Published in BMC cancer (26.10.2021)
Published in BMC cancer (26.10.2021)
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Effect of photocatalytic oxidation technology on GaN CMP
Wang, Jie, Wang, Tongqing, Pan, Guoshun, Lu, Xinchun
Published in Applied surface science (01.01.2016)
Published in Applied surface science (01.01.2016)
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Synthesis of CeO2 Nanoparticles Derived by Urea Condensation for Chemical Mechanical Polishing
Wang, Zhenyang, Wang, Tongqing, Zhang, Lifei, Lu, Xinchun
Published in Electronic materials letters (01.11.2023)
Published in Electronic materials letters (01.11.2023)
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Detecting seasonal and long-term vertical displacement in the North China Plain using GRACE and GPS
Wang, Linsong, Chen, Chao, Du, Jinsong, Wang, Tongqing
Published in Hydrology and earth system sciences (15.06.2017)
Published in Hydrology and earth system sciences (15.06.2017)
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Chemical effects on the tribological behavior during copper chemical mechanical planarization
Li, Jing, Liu, Yuhong, Wang, Tongqing, Lu, Xinchun
Published in Materials chemistry and physics (01.03.2015)
Published in Materials chemistry and physics (01.03.2015)
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Exploiting interaction of fine and coarse features and attribute co-occurrence for person attribute recognition
Sun, Zhiyong, Ye, Junyong, Wang, Tongqing, Jiang, Li, Li, Yang
Published in Multimedia tools and applications (01.03.2021)
Published in Multimedia tools and applications (01.03.2021)
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Fabrication of Flexible and Transparent Metal Mesh Electrodes Using Surface Energy‐Directed Assembly Process for Touch Screen Panels and Heaters
Yuan, Siqing, Fan, Zebin, Wang, Guangji, Chai, Zhimin, Wang, Tongqing, Zhao, Dewen, Busnaina, Ahmed A., Lu, Xinchun
Published in Advanced science (01.12.2023)
Published in Advanced science (01.12.2023)
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Synergetic effect of potassium molybdate and benzotriazole on the CMP of ruthenium and copper in KIO4-based slurry
Cheng, Jie, Wang, Tongqing, Mei, Hegeng, Zhou, Wenbin, Lu, Xinchun
Published in Applied surface science (30.11.2014)
Published in Applied surface science (30.11.2014)
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Electrochemical investigation of copper passivation kinetics and its application to low-pressure CMP modeling
Li, Jing, Liu, Yuhong, Wang, Tongqing, Lu, Xinchun, Luo, Jianbin
Published in Applied surface science (15.01.2013)
Published in Applied surface science (15.01.2013)
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Kinematic analysis of in situ measurement during chemical mechanical planarization process
Li, Hongkai, Wang, Tongqing, Zhao, Qian, Meng, Yonggang, Lu, Xinchun
Published in Review of scientific instruments (01.10.2015)
Published in Review of scientific instruments (01.10.2015)
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Improvement of via dishing and non-uniformity in TSV chemical mechanical planarization
Rao, Can, Wang, Tongqing, Wang, Jie, Liu, Yuhong, Lu, Xinchun
Published in Microelectronic engineering (05.02.2016)
Published in Microelectronic engineering (05.02.2016)
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Effect of a Cu seed layer on electroplated Cu film
Pan, Yan, Liu, Yuhong, Wang, Tongqing, Lu, Xinchun
Published in Microelectronic engineering (01.05.2013)
Published in Microelectronic engineering (01.05.2013)
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