Bandwidth Enhancement Based on Optimized Via Location for Multiple Vias EBG Power/Ground Planes
Chuen-De Wang, Yi-Min Yu, de Paulis, F., Scogna, A. C., Orlandi, A., Yih-Peng Chiou, Tzong-Lin Wu
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.02.2012)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.02.2012)
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Journal Article
ABF-Based TSV Arrays With Improved Signal Integrity on 3-D IC/Interposers: Equivalent Models and Experiments
Wang, Chuen-De, Chang, Yu-Jen, Lu, Yi-Chang, Chen, Peng-Shu, Lo, Wei-Chung, Chiou, Yih-Peng, Wu, Tzong-Lin
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.10.2013)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.10.2013)
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Journal Article
Bandwidth-enhanced EBG structure for power noise suppression in 60 GHz RF SiP
Chuen-De Wang, Tzong-Lin Wu
Published in 2011 IEEE International Symposium on Electromagnetic Compatibility (01.08.2011)
Published in 2011 IEEE International Symposium on Electromagnetic Compatibility (01.08.2011)
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Conference Proceeding
Mold-based compartment shielding to mitigate the intra-system coupled noise on SiP modules
Chih-Ying Hsiao, Chun-Hsiang Huang, Chuen-De Wang, Kuo-Hsien Liao, Chia-Hsien Shen, Chen-Chao Wang, Tzong-Lin Wu
Published in 2011 IEEE International Symposium on Electromagnetic Compatibility (01.08.2011)
Published in 2011 IEEE International Symposium on Electromagnetic Compatibility (01.08.2011)
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Conference Proceeding
A New Model for Through-Silicon Vias on 3-D IC Using Conformal Mapping Method
CHENG, Tai-Yu, WANG, Chuen-De, CHIOU, Yih-Peng, WU, Tzong-Lin
Published in IEEE microwave and wireless components letters (01.06.2012)
Published in IEEE microwave and wireless components letters (01.06.2012)
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Journal Article
Parallel-plate noise suppression using a ground surface perturbation lattice (GSPL) structure
Scogna, Antonio Ciccomancini, Chuen-De Wang, Orlandi, Antonio, Tzong-Lin Wu
Published in 2010 Asia-Pacific International Symposium on Electromagnetic Compatibility (01.04.2010)
Published in 2010 Asia-Pacific International Symposium on Electromagnetic Compatibility (01.04.2010)
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Conference Proceeding
Conformal shielding investigation for SiP modules
Chun-Hsiang Huang, Chih-Ying Hsiao, Chuen-De Wang, Chen, Tonny, Liao Kuo-Hsien, Tzong-Lin Wu
Published in 2010 IEEE Electrical Design of Advanced Package & Systems Symposium (01.12.2010)
Published in 2010 IEEE Electrical Design of Advanced Package & Systems Symposium (01.12.2010)
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Conference Proceeding
Low slow-wave effect and crosstalk for low-cost ABF-coated TSVs in 3-D IC interposer
Yu-Jen Chang, Tai-Yu Zheng, Hao-Hsiang Chuang, Chuen-De Wang, Peng-Shu Chen, Tzu-Ying Kuo, Chau-Jie Zhan, Shih-Hsien Wu, Wei-Chung Lo, Yi-Chang Lu, Yih-Peng Chiou, Tzong-Lin Wu
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
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Conference Proceeding
A stopband enhanced EBG power/ground plane based on via location design
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Conference Proceeding
INTEGRATED FAN-OUT PACKAGE AND METHOD OF FABRICATING THE SAME
Wu Chi-Hsi, Tai Shih-Peng, Wang Chuen-De, Liu Chun-Yi, Yeh Der-Chyang, Chen Hsien-Wei
Year of Publication 30.11.2017
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Year of Publication 30.11.2017
Patent
Integrated fan-out package and method of fabricating the same
Wu Chi-Hsi, Tai Shih-Peng, Wang Chuen-De, Liu Chun-Yi, Yeh Der-Chyang, Chen Hsien-Wei
Year of Publication 07.11.2017
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Year of Publication 07.11.2017
Patent