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"WANG, CHUNG-PAO"
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"WANG, CHUNG-PAO"
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Thermal and Optical Properties of Epoxy/Siloxane Hybrimer Based on Sol-Gel-Derived Phenyl-Siloxane
by
Wu, Kuo-Hui
,
Cheng, Ken-Fa
,
Yang, Cheng-Chien
,
Wang
,
Chung
-
Pao
,
Liu, Chi-I
Published in
Open Journal of Composite Materials (Irvine, CA)
(2015)
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Structure of printed circuit board and carrier and method of making semiconductor package
by
WANG
,
CHUNG
-
PAO
Year of Publication
20.06.2019
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Patent
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PRINTED CIRCUIT BOARD AND METHOD OF PACKAGING THE SAME
by
WANG
,
Chung
-
Pao
Year of Publication
07.03.2019
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Patent
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Electronic package and carrier board and carrier and a method for manufacturing the same of
by
WANG
,
CHUNG
-
PAO
Year of Publication
16.04.2023
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Patent
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A lead frame and package
by
WANG
,
CHUNG
-
PAO
Year of Publication
16.04.2023
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Patent
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A semiconductor package and lead frame
by
WANG
,
CHUNG
-
PAO
Year of Publication
16.03.2023
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A carrier board for a semiconductor package and package
by
WANG
,
CHUNG
-
PAO
Year of Publication
11.01.2023
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Patent
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A lead frame and package used in electronic product
by
WANG
,
CHUNG
-
PAO
Year of Publication
01.08.2022
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A terminal and carrier used in electronic product
by
WANG
,
CHUNG
-
PAO
Year of Publication
11.03.2022
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Patent
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10
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Printing circuit board with traces in an insulator
by
Wang Chung
-
Pao
Year of Publication
25.10.2016
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Patent
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PRINTED CIRCUIT BOARD
by
WANG CHUNG
-
PAO
Year of Publication
20.10.2016
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Patent
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12
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A printed circuit board and package
by
WANG
,
CHUNG
-
PAO
Year of Publication
01.11.2021
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Patent
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A printed circuit board and package
by
WANG
,
CHUNG
-
PAO
Year of Publication
21.08.2020
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Patent
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A printing circuit board and a semiconductor package
by
WANG
,
CHUNG
-
PAO
Year of Publication
01.05.2020
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PRINTING CIRCUIT BOARD AND THE APPLICATION THE SAME OF
by
WANG CHUNG
-
PAO
Year of Publication
20.11.2014
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A printing circuit board structure
by
WANG
,
CHUNG PAO
Year of Publication
01.02.2020
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Printed circuit board structure
by
WANG CHUNG
-
PAO
Year of Publication
10.01.2020
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A structure of a Printing Circuit Board and a carrier and methods of manufacturing semiconductor package
by
WANG
,
CHUNG
-
PAO
Year of Publication
01.08.2019
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Structure of printed circuit board and carrier and method of making a package body
by
WANG CHUNG
-
PAO
Year of Publication
05.07.2019
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A printing circuit board and the application
by
WANG
,
CHUNG PAO
Year of Publication
01.10.2017
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