INTEGRATED HEAT SPREADER WITH ENHANCED VAPOR CHAMBER FOR MULTICHIP PACKAGES
Wan, Zhimin, Chang, Je-Young, Matayabas, JR., James C, Arrington, Kyle
Year of Publication 05.11.2020
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Year of Publication 05.11.2020
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THERMAL MANAGEMENT SOLUTIONS USING COMPARTMENTALIZED PHASE CHANGE MATERIALS
Wan, Zhimin, Zhao, Junnan, Deng, Yikang, Xu, Cheng, Zhang, Chong, Wang, Ying
Year of Publication 01.10.2020
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Year of Publication 01.10.2020
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ION BEAM ETCHING WITH GAS TREATMENT AND PULSING
LI, Weiyi, KAMARTHY, Gowri Channa, YUN, Seokmin, HUANG, Shuogang, WAN, Zhimin
Year of Publication 06.08.2020
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Year of Publication 06.08.2020
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EFFECTIVE HEAT CONDUCTION FROM HOTSPOT TO HEAT SPREADER THROUGH PACKAGE SUBSTRATE
Wan, Zhimin, Lee, Kyu-oh, Zhao, Junnan, Liu, Lingtao, Deng, Yikang, Jha, Chandra Mohan, Xu, Cheng
Year of Publication 11.06.2020
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Year of Publication 11.06.2020
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IN-SITU FORMATION OF A THERMOELECTRIC DEVICE IN A SUBSTRATE PACKAGING
Wan, Zhimin, Lee, Kyu-oh, Zhao, Junnan, Deng, Yikang, Xu, Cheng, Zhang, Chong, Wang, Ying
Year of Publication 16.04.2020
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Year of Publication 16.04.2020
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DUAL SIDE DIE PACKAGING FOR ENHANCED HEAT DISSIPATION
Wan, Zhimin, Devasenathipathy, Shankar, Chiu, Chia-Pin, Jha, Chandra Mohan, Tang, Weihua
Year of Publication 09.04.2020
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Year of Publication 09.04.2020
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INTEGRATED HEAT SPREADER WITH MULTIPLE CHANNELS FOR MULTICHIP PACKAGES
WAN, ZHIMIN, DEVASENATHIPATHY, SHANKAR, TANG, WEIHUA, CHIU, CHIA-PIN, MOHAN JHA, CHANDRA
Year of Publication 02.04.2020
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Year of Publication 02.04.2020
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THERMAL ASSEMBLIES FOR MULTI-CHIP PACKAGES
Wan, Zhimin, Devasenathipathy, Shankar, Chiu, Chia-Pin, Chang, Je-Young, Jha, Chandra Mohan, Gebrehiwot, Betsegaw Kebede
Year of Publication 13.02.2020
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Year of Publication 13.02.2020
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VENTED LIDS FOR INTEGRATED CIRCUIT PACKAGES
Wan, Zhimin, Li, Peng, Antoniswamy, Aravindha R, Chan Arguedas, Sergio Antonio, Zhao, Junnan, Jha, Chandra Mohan, Xu, Cheng, Wang, Ying
Year of Publication 24.12.2020
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Year of Publication 24.12.2020
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