Comparison of high-speed shear properties of low-temperature Sn-Bi/Cu and Sn-In/Cu solder joints
Wang, Qin, Cai, Shanshan, Yang, Shiyu, Yu, Yongjian, Wan, Yongkang, Peng, Jubo, Wang, Jiajun, Wang, Xiaojing
Published in Journal of materials science. Materials in electronics (01.03.2024)
Published in Journal of materials science. Materials in electronics (01.03.2024)
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Journal Article
Perniciousness analysis of IC hardware Trojan based on characteristic function deployment
Huang, Jiaoying, Yang, Daming, Wan, Yongkang
Published in Journal of physics. Conference series (01.09.2018)
Published in Journal of physics. Conference series (01.09.2018)
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Journal Article
Sensitive bits based prediction method of functional failure time for SRAM-based FPGA
Gao Cheng, Wan Yongkang, Zhang Cheng, Wang Xiangfen, Huang Jiaoying
Published in 2016 Prognostics and System Health Management Conference (PHM-Chengdu) (01.10.2016)
Published in 2016 Prognostics and System Health Management Conference (PHM-Chengdu) (01.10.2016)
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Conference Proceeding
Discussion on multilayer ceramic replacements for tantalum capacitors
Jiaoying Huang, Yongkang Wan, Cheng Gao, Yuanyuan Xiong
Published in 2015 Prognostics and System Health Management Conference (PHM) (01.10.2015)
Published in 2015 Prognostics and System Health Management Conference (PHM) (01.10.2015)
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Conference Proceeding
Research on Pull-Off Strength Test Method of Cross-Surface SiP Device
Wang, Shinan, Wan, Yongkang, Meng, Zhichao, Yu, Yongjian
Published in 2024 25th International Conference on Electronic Packaging Technology (ICEPT) (07.08.2024)
Published in 2024 25th International Conference on Electronic Packaging Technology (ICEPT) (07.08.2024)
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Conference Proceeding
Effect of daisy chain structure on electromigration reliability of microbumps: A simulation study
Yan, Chenkan, Wang, Dun, Zhang, Kaihong, Zhang, Huibin, Yu, Yongjian, Xie, Weikun, Zhu, Kai, Wan, Yongkang
Published in 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) (14.09.2021)
Published in 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) (14.09.2021)
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Conference Proceeding
Defect Localization and Optimization of PIND for Large Size CQFP Devices
Wang, Shinan, Ma, Yong, Zhang, Kaihong, Yu, Yongjian, Wan, Yongkang, Xie, Weikun
Published in 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) (14.09.2021)
Published in 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) (14.09.2021)
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Conference Proceeding
Feeding mechanism and thread rolling production line
YAN PING, XIA GUOHUA, WAN YONGKANG, CHEN ZHIBO, LIU HUA, YAO YUAN, BAO FEIFEI, YAN QIN
Year of Publication 21.06.2024
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Year of Publication 21.06.2024
Patent
Screw positioning mechanism and laser marking device
YAN PING, FENG JIAWEI, WAN YONGKANG, CHEN ZHIBO, LIU HUA, YAO YUAN, BAO FEIFEI, YAN QIN
Year of Publication 28.05.2024
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Year of Publication 28.05.2024
Patent