Showing
1 - 20
results of
38
for search '
"WALTER DAVID N"
'
Skip to content
Portal K.UTB
Čeština
Login
TBU Catalog
e-resources
E-THESES
All Fields
Title
Author
Subject
Find
Advanced Search
Search Results - "WALTER DAVID N"
Showing
1 - 20
results of
38
for search '
"WALTER DAVID N"
'
, query time: 0.95s
Refine Results
Sort
Relevance
Date Descending
Date Ascending
1
Loading…
Method for Fabricating Array-Molded Package-on-Package
by
GERBER MARK A
,
WALTER DAVID N
Year of Publication
30.01.2014
Get full text
Patent
Save to List
Saved in:
2
Loading…
Method for fabricating array-molded package-on-package
by
GERBER MARK A
,
WALTER DAVID N
Year of Publication
05.11.2013
Get full text
Patent
Save to List
Saved in:
3
Loading…
Method for Fabricating Array-Molded Package-on-Package
by
GERBER MARK A
,
WALTER DAVID N
Year of Publication
25.07.2013
Get full text
Patent
Save to List
Saved in:
4
Loading…
Array-molded package-on-package having redistribution lines
by
GERBER MARK A
,
WALTER DAVID N
Year of Publication
06.11.2012
Get full text
Patent
Save to List
Saved in:
5
Loading…
Array-molded package-on-package having redistribution lines
by
Gerber, Mark A
,
Walter
,
David N
Year of Publication
06.11.2012
Get full text
Patent
Save to List
Saved in:
6
Loading…
Array-Molded Package-On-Package Having Redistribution Lines
by
GERBER MARK A
,
WALTER DAVID N
Year of Publication
28.07.2011
Get full text
Patent
Save to List
Saved in:
7
Loading…
Method for Fabricating Array-Molded Package-on-Package
by
GERBER MARK A
,
WALTER DAVID N
Year of Publication
07.07.2011
Get full text
Patent
Save to List
Saved in:
8
Loading…
Array molded package-on-package having redistribution lines
by
GERBER MARK A
,
WALTER DAVID N
Year of Publication
17.05.2011
Get full text
Patent
Save to List
Saved in:
9
Loading…
Array molded package-on-package having redistribution lines
by
Gerber, Mark A
,
Walter
,
David N
Year of Publication
17.05.2011
Get full text
Patent
Save to List
Saved in:
10
Loading…
ARRAY-MOLDED PACKAGE-ON-PACKAGE HAVING REDISTRIBUTION LINES
by
WALTER
,
DAVID
,
N
,
GERBER, MARK, A
Year of Publication
31.12.2008
Get full text
Patent
Save to List
Saved in:
11
Loading…
Array molded package-on-package having redistribution lines
by
GERBER MARK A
,
WALTER DAVID N
Year of Publication
25.12.2008
Get full text
Patent
Save to List
Saved in:
12
Loading…
ARRAY-MOLDED PACKAGE-ON-PACKAGE SEMICONDUCTOR DEVICE AND METHOD
by
WALTER
,
DAVID
,
N
,
GERBER, MARK, A
Year of Publication
27.11.2008
Get full text
Patent
Save to List
Saved in:
13
Loading…
Method for Fabricating Array-Molded Package-On-Package
by
GERBER MARK A
,
WALTER DAVID N
Year of Publication
20.11.2008
Get full text
Patent
Save to List
Saved in:
14
Loading…
Two-metal layer ball grid array and chip scale package having local interconnects used in wire-bonded and flip-chip semiconductor assembly
by
WALTER DAVID N
,
MURTUZA MASOOD
Year of Publication
04.11.2004
Get full text
Patent
Save to List
Saved in:
15
Loading…
Controlling flip-chip techniques for concurrent ball bonds in semiconductor devices
by
Walter
,
David N
,
Le, Duy-Loan T
,
Gerber, Mark A
Year of Publication
17.08.2010
Get full text
Patent
Save to List
Saved in:
16
Loading…
Two-metal layer ball grid array and chip scale package having local interconnects used in wire-bonded and flip-chip semiconductor assembly
by
Walter
,
David N
,
Murtuza, Masood
Year of Publication
06.04.2004
Get full text
Patent
Save to List
Saved in:
17
Loading…
Two-metal layer ball grid array and chip scale package having local interconnects used in wire-bonded and flip-chip semiconductor assembly
by
WALTER DAVID N
,
MURTUZA MASOOD
Year of Publication
06.04.2004
Get full text
Patent
Save to List
Saved in:
18
Loading…
SEMICONDUCTOR DEVICE
by
WALTER DAVID N
,
MURTUZA MASOOD
Year of Publication
02.04.2004
Get full text
Patent
Save to List
Saved in:
19
Loading…
TWO-METAL LAYER BALL GRID ARRAY AND CHIP SCALE PACKAGE HAVING LOCAL INTERCONNECTS USED IN WIRE-BONDED AND FLIP-CHIP SEMICONDUCTOR ASSEMBLY
by
WALTER DAVID N
,
MURTUZA MASOOD
Year of Publication
11.03.2004
Get full text
Patent
Save to List
Saved in:
20
Loading…
Controlling flip-chip techniques for concurrent ball bonds in semiconductor devices
by
Walter
,
David N
,
Le, Duy-Loan T
,
Gerber, Mark A
Year of Publication
11.08.2009
Get full text
Patent
Save to List
Saved in:
1
2
Next
[2]
RSS Feed
Email Search
Save Search
Search History
Back
Refine Results
Page will reload when a filter is selected or excluded.
Limit to articles from scholarly journals
Limit to articles with full text available
Limit to Open Access content
Exclude newspaper articles
Include articles at other libraries
Expand results using synonyms
Format
Patent
37 results
37
Newspaper Article
1 results
1
Subject Area
chemistry
31 results
31
medicine
31 results
31
sciences
31 results
31
physics
1 results
1
Topic
electricity
29 results
29
basic electric elements
28 results
28
electric solid state devices not otherwise provided for
28 results
28
semiconductor devices
28 results
28
casings or constructional details of electric apparatus
4 results
4
electric techniques not otherwise provided for
4 results
4
See more
Language
English
35 results
35
French
6 results
6
German
5 results
5
Chinese
2 results
2
Year of Publication
From:
To:
Database
esp@cenet
31 results
31
USPTO Issued Patents
6 results
6
ProQuest Central
1 results
1
