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METHOD OF BONDING COPPER AND RESIN
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Recent Progress of High Density Multi-Layer Printed Circuit Boards and the Discussions Towards the Future. Utilization of Multi-Layer Printed Circuit Boards in Advanced Applications. Low Dielectric Constant High Density Multilayer Printed Wiring Board for Large Scale Computer
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Mechanism for the Deposition of Electroless Nickel Films on Copper with No Catalyzer
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Published in Hyōmen gijutsu (01.11.1993)
Published in Hyōmen gijutsu (01.11.1993)
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Mehrschichtige gedruckte Leiterplatte und Verfahren zu ihrer Herstellung
SHIMAZAKI, TAKESHI, MORISHITA, HIROSADA, TAKAHASHI, AKIO, WAJIMA, MOTOYO
Year of Publication 20.01.2000
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Year of Publication 20.01.2000
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Multi-layer printed circuit board and process for production thereof
SHIMAZAKI, TAKESHI, MORISHITA, HIROSADA, TAKAHASHI, AKIO, WAJIMA, MOTOYO
Year of Publication 25.08.1999
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Year of Publication 25.08.1999
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