Grain growth-induced thermal property enhancement of NiTi shape memory alloys for elastocaloric refrigeration and thermal energy storage systems
Warzoha, Ronald J., Vu, Nicholas T., Donovan, Brian F., Cimpoiasu, Elena, Sharar, Darin J., Leff, Asher C., Wilson, Adam A., Smith, Andrew N.
Published in International journal of heat and mass transfer (01.06.2020)
Published in International journal of heat and mass transfer (01.06.2020)
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Journal Article
Strained Polymer Thermal Conductivity Enhancement Counteracted by Additional Off-Axis Strain
Donovan, Brian F, Warzoha, Ronald J, Cosby, Tyler, Giri, Ashutosh, Wilson, Adam A, Borgdorff, Andrew J, Vu, Nicholas T, Patterson, Eric A, Gorzkowski, Edward P
Published in Macromolecules (22.12.2020)
Published in Macromolecules (22.12.2020)
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Journal Article
Elimination of Extreme Boundary Scattering via Polymer Thermal Bridging in Silica Nanoparticle Packings: Implications for Thermal Management
Donovan, Brian F, Warzoha, Ronald J, Venkatesh, R. Bharath, Vu, Nicholas T, Wallen, Jay, Lee, Daeyeon
Published in ACS applied nano materials (25.10.2019)
Published in ACS applied nano materials (25.10.2019)
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Journal Article
A numerical fitting routine for frequency-domain thermoreflectance measurements of nanoscale material systems having arbitrary geometries
Warzoha, Ronald J., Wilson, Adam A., Donovan, Brian F., Smith, Andrew N., Vu, Nicholas, Perry, Trent, Li, Longnan, Miljkovic, Nenad, Getto, Elizabeth
Published in Journal of applied physics (21.01.2021)
Published in Journal of applied physics (21.01.2021)
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Journal Article
Effect of Grain Size on the Thermal Properties of Nickel-Titanium Shape Memory Alloys Across the Martensite-Austenite Phase Transition
Vu, Nicholas T., Warzoha, Ronald J., Donovan, Brian F., Sharar, Darin J., Leff, Asher C., Wilson, Adam A., Smith, Andrew N.
Published in 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2019)
Published in 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2019)
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Conference Proceeding
Elimination of Extreme Boundary Scattering via Polymer Thermal Bridging in Silica Nanoparticle Packings: Implications for Thermal Management
Donovan, Brian F, Warzoha, Ronald J, Venkatesh, R. Bharath, Vu, Nicholas T, Wallen, Jay, Lee, Daeyeon
Year of Publication 08.08.2019
Year of Publication 08.08.2019
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Journal Article
A Numerical Fitting Routine for Frequency-domain Thermoreflectance Measurements of Nanoscale Material Systems having Arbitrary Geometries
Warzoha, Ronald J, Wilson, Adam A, Donovan, Brian F, Smith, Andrew N, Vu, Nicholas T, Perry, Trent, Li, Longnan, Miljkovic, Nenad, Getto, Elizabeth
Published in arXiv.org (21.09.2020)
Published in arXiv.org (21.09.2020)
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Journal Article