A 1mW Always-on Computer Vision Deep Learning Neural Decision Processor
Garrett, David, Park, Youn Sung, Kim, Seongjong, Sharma, Jay, Huang, Wenbin, Shaghaghi, Majid, Parthasarathy, Vinay, Gibellini, Stephen, Bailey, Stephen, Moturi, Mallik, Vorenkamp, Pieter, Busch, Kurt, Holleman, Jeremy, Javid, Behrooz, Yousefi, Alireza, Judy, Mohsen, Gupta, Atul
Published in 2023 IEEE International Solid- State Circuits Conference (ISSCC) (19.02.2023)
Published in 2023 IEEE International Solid- State Circuits Conference (ISSCC) (19.02.2023)
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Conference Proceeding
An Embedded 65 nm CMOS Baseband IQ 48 MHz-1 GHz Dual Tuner for DOCSIS 3.0
Gatta, F., Gomez, R., Shin, Y.J., Hayashi, T., Hanli Zou, Chang, J.Y.C., Dauphinee, L., Jianhong Xiao, Chang, D.S.-H., Tai-Hong Chih, Brandolini, M., Dongsoo Koh, Hung, B.J.-J., Tao Wu, Introini, M., Cusmai, G., Zencir, E., Singor, F., Eberhart, H., Tan, L.K., Currivan, B., Lin He, Cangiane, P., Vorenkamp, P.
Published in IEEE journal of solid-state circuits (01.12.2009)
Published in IEEE journal of solid-state circuits (01.12.2009)
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Journal Article
SEMICONDUCTOR PACKAGE WITH INTEGRATED ELECTROMAGNETIC SHIELDING
VORENKAMP PIETER, KHAN REZAUR, KARIKALAN SAMPATH, CHEN XIANGDONG, HU KEVIN, ZHAO SAM
Year of Publication 04.09.2013
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Year of Publication 04.09.2013
Patent
SYSTEM-IN-PACKAGE WITH INTEGRATED SOCKET
VORENKAMP PIETER, KHAN REZAUR, KARIKALAN SAMPATH, CHEN XIANGDONG, HU KEVIN, ZHAO SAM
Year of Publication 03.09.2013
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Year of Publication 03.09.2013
Patent
SEMICONDUCTOR PACKAGE WITH IMPROVED TESTABILITY
VORENKAMP PIETER, KHAN REZAUR, KARIKALAN SAMPATH, CHEN XIANGDONG, HU KEVIN, ZHAO SAM
Year of Publication 08.08.2013
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Year of Publication 08.08.2013
Patent
SEMICONDUCTOR PACKAGE WITH A BRIDGE INTERPOSER
VORENKAMP PIETER, KHAN REZAUR, KARIKALAN SAMPATH, CHEN XIANGDONG, HU KEVIN, ZHAO SAM
Year of Publication 08.07.2013
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Year of Publication 08.07.2013
Patent
SEMICONDUCTOR PACKAGE WITH ULTRA-THIN INTERPOSER WITHOUT THROUGH-SEMICONDUCTOR VIAS
VORENKAMP PIETER, KHAN REZAUR, KARIKALAN SAMPATH, CHEN XIANGDONG, HU KEVIN, ZHAO SAM
Year of Publication 08.07.2013
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Year of Publication 08.07.2013
Patent
STACKED PACKAGING USING RECONSTITUTED WAFERS
VORENKAMP PIETER, KHAN REZAUR, KARIKALAN SAMPATH, CHEN XIANGDONG, HU KEVIN, ZHAO SAM
Year of Publication 26.06.2013
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Year of Publication 26.06.2013
Patent
Microcontroller interface for audio signal processing
Vorenkamp, Pieter, Busch, Kurt F, Holleman, III, Jeremiah H, Bailey, Stephen W
Year of Publication 27.08.2024
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Year of Publication 27.08.2024
Patent