Impact of “terminal effect” on Cu electrochemical deposition: Filling capability for different metallization options
Armini, Silvia, Tokei, Zsolt, Volders, Henny, El-Mekki, Zaid, Radisic, Aleksandar, Beyer, Gerald, Ruythooren, Wouter, Vereecken, Philippe M.
Published in Microelectronic engineering (01.05.2011)
Published in Microelectronic engineering (01.05.2011)
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Conference Proceeding
Integration and Dielectric Reliability of 30 nm Half Pitch Structures in Aurora ® LK HM
Demuynck, Steven, Huffman, Craig, Claes, Martine, Suhard, Samuel, Versluijs, Janko, Volders, Henny, Heylen, Nancy, Kellens, Kristof, Croes, Kristof, Struyf, Herbert, Vereecke, Guy, Verdonck, Patrick, Roest, David De, Beynet, Julien, Sprey, Hessel, Beyer, Gerald P.
Published in Japanese Journal of Applied Physics (01.04.2010)
Published in Japanese Journal of Applied Physics (01.04.2010)
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Journal Article
Dielectric Reliability of 50 nm Half Pitch Structures in Aurora ® LK
Demuynck, Steven, Kim, Honggun, Huffman, Craig, Darnon, Maxime, Struyf, Herbert, Versluijs, Janko, Claes, Martine, Vereecke, Guy, Verdonck, Patrick, Volders, Henny, Heylen, Nancy, Kellens, Kristof, Roest, David De, Sprey, Hessel, Beyer, Gerald
Published in Japanese Journal of Applied Physics (01.04.2009)
Published in Japanese Journal of Applied Physics (01.04.2009)
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Journal Article
Study of metal barrier deposition-induced damage to porous low- k materials
Zhao, Larry, Volders, Henny, Baklanov, Mikhail, Tőkei, Zsolt, Pantouvaki, Marianna, Wilson, Christopher J., Van Besien, Els, Beyer, Gerald P., Claeys, Cor
Published in Microelectronic engineering (01.09.2011)
Published in Microelectronic engineering (01.09.2011)
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Journal Article
In situ X-ray diffraction study of self-forming barriers from a Cu–Mn alloy in 100 nm Cu/low- k damascene interconnects using synchrotron radiation
Wilson, Christopher J., Volders, Henny, Croes, Kristof, Pantouvaki, Marianna, Beyer, Gerald P., Horsfall, Alton B., O’Neill, Anthony G., Tőkei, Zsolt
Published in Microelectronic engineering (01.03.2010)
Published in Microelectronic engineering (01.03.2010)
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Conference Proceeding
Texture characterization of Cu interconnects with different Ta-based sidewall diffusion barriers
Wilson, Christopher J., Zhao, Chao, Volders, Henny, Zhao, Larry, Croes, Kristof, Tőkei, Zsolt, Beyer, Gerald P.
Published in Microelectronic engineering (01.05.2011)
Published in Microelectronic engineering (01.05.2011)
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Journal Article
Conference Proceeding
In situ X-ray diffraction study of self-forming barriers from a Cu–Mn alloy in 100nm Cu/low-k damascene interconnects using synchrotron radiation
Wilson, Christopher J., Volders, Henny, Croes, Kristof, Pantouvaki, Marianna, Beyer, Gerald P., Horsfall, Alton B., O’Neill, Anthony G., Tőkei, Zsolt
Published in Microelectronic engineering (01.03.2010)
Published in Microelectronic engineering (01.03.2010)
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Journal Article
Copper Plating on Resistive Substrates, Diffusion Barrier and Alternative Seed Layers
Radisic, Aleksandar, Nagar, Magi, Strubbe, Katrien, Armini, Silvia, El-Mekki, Zaid, Volders, Henny, Ruythooren, Wouter, Vereecken, Philippe M.
Published in ECS transactions (22.02.2010)
Published in ECS transactions (22.02.2010)
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Journal Article
Integration and Dielectric Reliability of 30 nm Half Pitch Structures in Aurora\text{\textregistered LK HM
Demuynck, Steven, Huffman, Craig, Claes, Martine, Suhard, Samuel, Versluijs, Janko, Volders, Henny, Heylen, Nancy, Kellens, Kristof, Croes, Kristof, Struyf, Herbert, Vereecke, Guy, Verdonck, Patrick, De Roest, David, Beynet, Julien, Sprey, Hessel, Beyer, Gerald P
Published in Jpn J Appl Phys (25.04.2010)
Published in Jpn J Appl Phys (25.04.2010)
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Journal Article
Dielectric Reliability of 50nm Half Pitch Structures in Aurora® LK
Demuynck, S., Kim, H., Huffman, C., Darnon, Maxime, .Struyf, H., Versluijs, J., Claes, M., Vereecke, G., Verdonck, P., Volders, H., Heylen, N., Kellens, K., de Roest, D., Sprey, H., Beyer, G.
Published in Japanese Journal of Applied Physics (01.04.2009)
Published in Japanese Journal of Applied Physics (01.04.2009)
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Journal Article
A new perspective of barrier material evaluation and process optimization
Zhao, L., Tikei, Z., Gischia, G.G., Volders, H., Beyer, G.
Published in 2009 IEEE International Interconnect Technology Conference (01.06.2009)
Published in 2009 IEEE International Interconnect Technology Conference (01.06.2009)
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Conference Proceeding
CMP process optimization for improved compatibility with advanced metal liners
Heylen, Nancy, Li Yunlong, Kellens, Kristof, Carbonell, Laureen, Volders, Henny, Santoro, Gaetano, Gravey, Virginie, Cockburn, Andrew, Yuchun Wang, Shah, Kavita, Leunissen, Leonardus, Beyer, Gerald P, Tokei, Zsolt
Published in 2010 IEEE International Interconnect Technology Conference (01.06.2010)
Published in 2010 IEEE International Interconnect Technology Conference (01.06.2010)
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Conference Proceeding
Link between silica-metal agglomeration and high porosity ultra-low k scratch formation during Chemical Mechanical Polishing
Heylen, Nancy, Camerotto, Elisabeth, Volders, Henny, Travaly, Youssef, Vereecke, Guy, Beyer, Gerald P, Tokei, Zsolt
Published in 2010 IEEE International Interconnect Technology Conference (01.06.2010)
Published in 2010 IEEE International Interconnect Technology Conference (01.06.2010)
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Conference Proceeding
Copper Plating on Resistive Substrates, Diffusion Barrier and Alternative Seed Layers
Radisic, Aleksandar, Nagar, Magi, Strubbe, Katrien, Armini, Silvia, El-Mekki, Zaid, Volders, Henny, Ruythooren, Wouter, Vereecken, Philippe M.
Published in Meeting abstracts (Electrochemical Society) (10.07.2009)
Published in Meeting abstracts (Electrochemical Society) (10.07.2009)
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Journal Article
Integration of 20nm half pitch single damascene copper trenches by spacer-defined double patterning (SDDP) on metal hard mask (MHM)
Yong Kong Siew, Versluijs, Janko, Kunnen, Eddy, Ciofi, Ivan, Alaerts, Wilfried, Dekkers, Harold, Volders, Henny, Suhard, Samuel, Cockburn, Andrew, Sleeckx, Erik, Van Besien, Els, Struyf, Herbert, Maenhoudt, Mireille, Noori, Atif, Padhi, Deenesh, Shah, Kavita, Gravey, Virginie, Beyer, Gerald
Published in 2010 IEEE International Interconnect Technology Conference (01.06.2010)
Published in 2010 IEEE International Interconnect Technology Conference (01.06.2010)
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Conference Proceeding
Metallization of sub-30 nm interconnects: Comparison of different liner/seed combinations
Carbonell, L., Volders, H., Heylen, N., Kellens, K., Caluwaerts, R., Devriendt, K., Sanchez, E.A., Wouters, J., Gravey, V., Shah, K., Luo, Q., Sundarrajan, A., Jiang Lu, Aubuchon, J., Ma, P., Narasimhan, M., Cockburn, A., Tokei, Z., Beyer, G.P.
Published in 2009 IEEE International Interconnect Technology Conference (01.06.2009)
Published in 2009 IEEE International Interconnect Technology Conference (01.06.2009)
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Conference Proceeding