What drives a tough call: Determining the importance of contingency factors and individual characteristics in communication executives’ stance decision-making through a conjoint analysis
Voges, Taylor S., Jin, Yan, Chen, Xianyan, Reber, Bryan
Published in Public relations review (01.03.2022)
Published in Public relations review (01.03.2022)
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Journal Article
Solid bed properties under high gas PressureSolid bed properties
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Conference Proceeding
Effective communication management in a public health crisis: lessons learned about COVID-19 pandemic through the lens of health communication executives
Voges, Taylor S., Jin, Yan, Eaddy, LaShonda L., Spector, Shelley
Published in Journal of communication management (London, England) (16.03.2023)
Published in Journal of communication management (London, England) (16.03.2023)
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Journal Article
Concepts of phase separation in supercritical processing
Zacchi, P., Pietsch, A., Voges, S., Ambrogi, A., Eggers, R., Jaeger, P.
Published in Chemical engineering and processing (01.09.2006)
Published in Chemical engineering and processing (01.09.2006)
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Journal Article
Panel Level Packaging - From Idea to Industrialization
Braun, T., Becker, K.-F., Hoelck, O., Voges, S., Boettcher, L., Topper, M., Stobbe, L., Aschenbrenner, R., Voitel, M., Schneider-Ramelow, M., Lang, K.-D.
Published in 2019 IEEE CPMT Symposium Japan (ICSJ) (01.11.2019)
Published in 2019 IEEE CPMT Symposium Japan (ICSJ) (01.11.2019)
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Conference Proceeding
Panel Level Packaging for Component Integration of an Energy Harvesting System
Braun, T., Lang, K.-D., Kahle, R., Voges, S., Holck, O., Bauer, J., Becker, K.-F., Aschenbrenner, R., Dreissigacker, M., Schneider-Ramelow, Martin
Published in 2019 International Wafer Level Packaging Conference (IWLPC) (01.10.2019)
Published in 2019 International Wafer Level Packaging Conference (IWLPC) (01.10.2019)
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Conference Proceeding
Das instationäre Temperaturfeld bei der reaktiven Infiltration zur Herstellung von Metall‐Keramik‐Verbundkörpern
Hußmann, B., Voges, S., Eggers, R., May, M., Janßen, R.
Published in Chemie ingenieur technik (01.10.2004)
Published in Chemie ingenieur technik (01.10.2004)
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Journal Article
Methanol elimination in non-alcoholics: inter- and intraindividual variation
Haffner, H.-T, Besserer, K, Graw, M, Voges, S
Published in Forensic science international (18.04.1997)
Published in Forensic science international (18.04.1997)
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Journal Article
From fan-out wafer to fan-out panel level packaging
Braun, T., Becker, K.-F, Raatz, S., Bader, V., Bauer, J., Aschenbrenner, R., Voges, S., Thomas, T., Kahle, R., Lang, K.-D
Published in 2015 European Conference on Circuit Theory and Design (ECCTD) (01.08.2015)
Published in 2015 European Conference on Circuit Theory and Design (ECCTD) (01.08.2015)
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Conference Proceeding
Foldable Fan-Out Wafer Level Packaging
Braun, T., Becker, K.-F, Raatz, S., Minkus, M., Bader, V., Bauer, J., Aschenbrenner, R., Kahle, R., Georgi, L., Voges, S., Wohrmann, M., Lang, K.-D
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
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Conference Proceeding
Material and process trends for moving from FOWLP to FOPLP
Braun, T., Voges, S., Topper, M., Wilke, M., Wohrmann, M., Maas, U., Huhn, M., Becker, K.-F, Raatz, S., Kim, J.-U, Aschenbrenner, R., Lang, K.-D, O'Connor, C., Barr, R., Calvert, J., Gallagher, M., Iagodkine, E., Aoude, T., Politis, A.
Published in 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) (01.12.2015)
Published in 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) (01.12.2015)
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Conference Proceeding
Panel level packaging for LED lighting
Braun, T., Bauer, J., Becker, K.-F, Kahle, R., Bader, V., Voges, S., Jordan, R., Aschenbrenner, R., Lang, K. D.
Published in 2013 10th China International Forum on Solid State Lighting (ChinaSSL) (01.11.2013)
Published in 2013 10th China International Forum on Solid State Lighting (ChinaSSL) (01.11.2013)
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Conference Proceeding
Journal Article
0.13-μm SiGe BiCMOS technology with More-than-Moore modules
Kaynak, M., Wietstruck, M., Goritz, A., Wipf, S. Tolunay, Inac, M., Cetindogan, B., Wipf, C., Kaynak, C. Baristiran, Wohrmann, M., Voges, S., Braun, T.
Published in 2017 IEEE Bipolar/BiCMOS Circuits and Technology Meeting (BCTM) (01.10.2017)
Published in 2017 IEEE Bipolar/BiCMOS Circuits and Technology Meeting (BCTM) (01.10.2017)
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Conference Proceeding