by Nicola, L., Xiang, Y., Vlassak, J.J., Van der Giessen, E., Needleman, A.
Published in Journal of the mechanics and physics of solids (01.10.2006)

by Xiang, Y., Chen, X., Vlassak, J.J.
Published in Journal of materials research (01.09.2005)

by Xiang, Y., Tsui, T.Y., Vlassak, J.J.
Published in Journal of materials research (01.06.2006)

by Vlassak, J.J., Ciavarella, M., Barber, J.R., Wang, X.
Published in Journal of the mechanics and physics of solids (01.09.2003)

by Vlassak, J.J., Lin, Y., Tsui, T.Y.
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (25.01.2005)

by Li, J., Celiz, A. D., Yang, J., Yang, Q., Wamala, I., Whyte, W., Seo, B. R., Vasilyev, N. V., Vlassak, J. J., Suo, Z., Mooney, D. J.
Published in Science (American Association for the Advancement of Science) (28.07.2017)

by Xiang, Y., Vlassak, J.J.
Published in Acta materialia (01.12.2006)

by Passeri, D., Rossi, M., Vlassak, J.J.
Published in Ultramicroscopy (01.05.2013)

by Xiang, Y., Vlassak, J.J.
Published in Scripta materialia (01.07.2005)

by Vlassak, J.J.
Published in Journal of the mechanics and physics of solids (01.04.2004)

by Wang, X., Bellouard, Y., Vlassak, J.J.
Published in Acta materialia (01.10.2005)

by Chama, C.C., Vlassak, J.J., Soboyejo, W.O.
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (2012)

by Vlassak, J J
Published in International journal of fracture (01.01.2003)

by Xiang, Y., Chen, X., Tsui, T.Y., Jang, J-I., Vlassak, J.J.
Published in Journal of materials research (01.02.2006)

by Sugimura, Y., Cohen-Karni, I., McCluskey, P., Vlassak, J.J.
Published in Journal of materials research (01.09.2005)

by Pérez-Prado, M.T., Vlassak, J.J.
Published in Scripta materialia (09.12.2002)

by Passeri, D., Bettucci, A., Germano, M., Rossi, M., Alippi, A., Fiori, A., Tamburri, E., Orlanducci, S., Terranova, M.L., Vlassak, J.J.
Published in Microelectronic engineering (01.03.2007)

by Yong Xiang, Tsui, T.Y., Vlassak, J.J., McKerrow, A.J.
Published in Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729) (2004)