Factoring Interacting Stress Mechanisms in Design for Reliability of Extreme Environment Power Modules
Huitink, David, Vinson, Whit, Ruby, Collin, Al Razi, Imam, Agogo-Mawuli, David, Mantooth, Alan, Peng, Yarui
Published in Journal of microelectronics and electronic packaging (01.10.2023)
Published in Journal of microelectronics and electronic packaging (01.10.2023)
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Journal Article
Combined Electromigration and Strain Accelerated Failure Test Development for Al Wire Bonds and Reliability Analysis of Grid-Tied Solar Inverter
Vinson, Whit, Iradukunda, Ange, Huitink, David, Lee, Jong-Pil, Kwon, Minho, Oh, Chang-Yeol
Published in 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (01.06.2021)
Published in 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (01.06.2021)
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Conference Proceeding
Electromigration-Aware Reliability Optimization of MCPM Layouts Using PowerSynth
Razi, Imam Al, Vinson, Whit, Huitink, David R., Peng, Yarui
Published in 2022 IEEE Energy Conversion Congress and Exposition (ECCE) (09.10.2022)
Published in 2022 IEEE Energy Conversion Congress and Exposition (ECCE) (09.10.2022)
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Conference Proceeding