Die Pad Delamination on QFN Package
Chiew, Chong Chee, Samsun, Paing, Vigneswaran, Letcheemana, Ang, Amy
Published in 2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT) (01.09.2018)
Published in 2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT) (01.09.2018)
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Conference Proceeding
Lead delamination correlation with Sn layer melting during sawing in power QFN package
Vigneswaran, L, Chong Chooi Mei
Published in 2010 12th Electronics Packaging Technology Conference (01.12.2010)
Published in 2010 12th Electronics Packaging Technology Conference (01.12.2010)
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Conference Proceeding
Die attach capability on ultra thin wafer thickness for power semiconductor
Abdullah, Z., Vigneswaran, L., Ang, A., Goh Zhi Yuan
Published in 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) (01.11.2012)
Published in 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) (01.11.2012)
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Conference Proceeding