Using dedicated device arrays for the characterization of TDDB in a scaled HK/MG technology
Saraza-Canflanca, P., Diaz-Fortuny, J., Vici, A., Bury, E., Degraeve, R., Kaczer, B.
Published in 2023 IEEE International Reliability Physics Symposium (IRPS) (01.03.2023)
Published in 2023 IEEE International Reliability Physics Symposium (IRPS) (01.03.2023)
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Conference Proceeding
Analysis of TDDB lifetime projection in low thermal budget HfO2/SiO2 stacks for sequential 3D integrations
Vici, A., Degraeve, R., Roussel, P. J., Franco, J., Kaczer, B., De Wolf, I.
Published in 2023 IEEE International Reliability Physics Symposium (IRPS) (01.03.2023)
Published in 2023 IEEE International Reliability Physics Symposium (IRPS) (01.03.2023)
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Conference Proceeding
Factors That Influence the Performance of Jumantik Cadres
Illahika, Anung Putri, Sekar P, Gita, A, Vici, Irsyadul, M., Y.H, Enggar, C.Y, Armiesha, Y.M, Elok, A.S, Hafif Fitra
Published in KnE Medicine (15.09.2022)
Published in KnE Medicine (15.09.2022)
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Journal Article
A USEFUL METHODOLOGY TO SELECT LIPASE-CATALYZED TRANSESTERIFICATION AIMING BIODIESEL APPLICATION
Facchini, F. D. A., Vici, A. C., Pereira, M. G., Oliveira, M. F. de, Batista, A. C. F., Vieira, A. T., Silva, T. A., Jorge, J. A., Polizeli, M. L. T. M.
Published in Revista Brasileira de Engenharia de Biossistemas (Online) (21.03.2016)
Published in Revista Brasileira de Engenharia de Biossistemas (Online) (21.03.2016)
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Journal Article
Gate oxide reliability: upcoming trends, challenges, and opportunities
Kaczer, B., Degraeve, R., Franco, J., Grasser, T., Roussel, Ph. J., Bury, E., Weckx, P., Chasin, A., Tyaginov, S., Vandemaele, M., Grill, A., O'Sullivan, B., Fortuny, J. Diaz, Canflanca, P. Saraza, Waltl, M., Rinaudo, P., Zhao, Y., Kao, E., Asanovski, R., Catapano, E., Beckers, A., Vici, A., Truijen, B., Higashi, Y., Clima, S., Xiang, Y., Sangani, D., Panarella, L., Smets, Q., Knobloch, T., Waldhor, D., Van Troeye, B., Guo, Y., Kruv, A., Viswakarma, K., Gonzalez, M., Linten, D.
Published in 2024 IEEE Silicon Nanoelectronics Workshop (SNW) (15.06.2024)
Published in 2024 IEEE Silicon Nanoelectronics Workshop (SNW) (15.06.2024)
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Conference Proceeding
Through-silicon-trench in back-side-illuminated CMOS image sensors for the improvement of gate oxide long term performance
Vici, A., Russo, F., Lovisi, N., Latessa, L., Marchioni, A., Casella, A., Irrera, F.
Published in 2018 IEEE International Electron Devices Meeting (IEDM) (01.12.2018)
Published in 2018 IEEE International Electron Devices Meeting (IEDM) (01.12.2018)
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Conference Proceeding
Linking Tmn and Administrative Applications
Vici, A.D., Gugliermetti, S., Franceschi, F., Audisio, G.
Published in IEEE Network Operations and Management Symposium, 1994 (1994)
Published in IEEE Network Operations and Management Symposium, 1994 (1994)
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Conference Proceeding
Journal Article
APPLICABILITÀ DI TRICHROME BLUE STAIN PER IDENTIFICAZIONE DI MICROSPORIDI ED OPPORTUNISTI ENTERICI
E. Fabbro, A. Arzese, A. Vici, M. Tavio, A. Londero, P. Viale
Published in Microbiologia Medica (01.09.2007)
Published in Microbiologia Medica (01.09.2007)
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Journal Article
First steps towards the future TMN: dealing with short term architectural tradeoffs
Pelaggi, A., Dionisi Vici, A., Mambella, E., Raineri, F.
Published in IEEE Global Telecommunications Conference GLOBECOM '91: Countdown to the New Millennium. Conference Record (1991)
Published in IEEE Global Telecommunications Conference GLOBECOM '91: Countdown to the New Millennium. Conference Record (1991)
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Conference Proceeding
Libri Logicorvm In Officina Henrici S. Secvnda Recognitione Ad archetypos recogniti cu[m] nouis ad littera[m] co[m]me[n]tariis
Anitius Manlius Torquatus Severinus Boëthius, Jacques Lefèvre d'Étaples, Henri Estienne, ex officina libraria Henrici Stephani, a Reginaldo chaudiere vici sancti Iacobi sub signo hominis siluestris
Year of defence 1510
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Year of defence 1510
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