Pattern Collapse Simulation in CMOS Image Sensors Devices
Sart, Clement, Vianne, Benjamin, Prevost, Emilie, Garnier, Philippe, Dubois, Jerome
Published in Solid state phenomena (14.08.2023)
Published in Solid state phenomena (14.08.2023)
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Journal Article
Advances in 3D CMOS image sensors optical modeling: combining realistic morphologies with FDTD
Vianne, Benjamin, Crocherie, Axel, Guissi, Sofiane, Sieger, Daniel, Calderon, Stephane, Rideau, D., Wehbe-Alause, Helene
Published in 2019 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) (01.09.2019)
Published in 2019 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) (01.09.2019)
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Conference Proceeding
Thermo-mechanical characterization of passive stress sensors in Si interposer
Vianne, Benjamin, Bar, Pierre, Fiori, Vincent, Gallois-Garreignot, Sébastien, Ewuame, Komi Atchou, Chausse, Pascal, Escoubas, Stéphanie, Hotellier, Nicolas, Thomas, Olivier
Published in Microelectronics and reliability (01.04.2015)
Published in Microelectronics and reliability (01.04.2015)
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Journal Article
IMAGE ACQUISITION DEVICE
GAY, Laurent, SAIDI, Bilel, JOBLOT, Sylvain, GREGOIRE, Magali, VIANNE, Benjamin
Year of Publication 20.06.2024
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Year of Publication 20.06.2024
Patent
Dispositif d'acquisition d'images
GAY, Laurent, SAIDI, Bilel, JOBLOT, Sylvain, GREGOIRE, Magali, VIANNE, Benjamin
Year of Publication 21.06.2024
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Year of Publication 21.06.2024
Patent
IMAGE ACQUISITION DEVICE
GAY, Laurent, SAIDI, Bilel, JOBLOT, Sylvain, GREGOIRE, Magali, VIANNE, Benjamin
Year of Publication 19.06.2024
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Year of Publication 19.06.2024
Patent
Thermo-mechanical characterization of passive stress sensors in Si interposer
Vianne, Benjamin, Bar, Pierre, Fiori, Vincent, Gallois-Garreignot, Sebastien, Ewuame, Komi Atchou, Chausse, Pascal, Escoubas, Stephanie, Hotellier, Nicolas, Thomas, Olivier
Published in 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2014)
Published in 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2014)
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Conference Proceeding
Thermo-mechanical study of a 2.5D passive silicon interposer technology: Experimental, numerical and In-Situ stress sensors developments
Vianne, Benjamin, Bar, Pierre, Fiori, Vincent, Petitdidier, Sebastien, Chevrier, Norbert, Gallois-Garreignot, Sebastien, Farcy, Alexis, Chausse, Pascal, Escoubas, Stephanie, Hotellier, Nicolas, Thomas, Olivier
Published in 2013 IEEE International 3D Systems Integration Conference (3DIC) (01.10.2013)
Published in 2013 IEEE International 3D Systems Integration Conference (3DIC) (01.10.2013)
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Conference Proceeding