Thermal transport through Ge-rich Ge/Si superlattices grown on Ge(0 0 1)
Thumfart, L, Carrete, J, Vermeersch, B, Ye, N, Truglas, T, Feser, J, Groiss, H, Mingo, N, Rastelli, A
Published in Journal of physics. D, Applied physics (10.01.2018)
Published in Journal of physics. D, Applied physics (10.01.2018)
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Journal Article
Predictive Design and Experimental Realization of InAs/GaAs Superlattices with Tailored Thermal Conductivity
Carrete, J, Vermeersch, B, Thumfart, L, Kakodkar, R. R, Trevisi, G, Frigeri, P, Seravalli, L, Feser, J. P, Rastelli, A, Mingo, N
Published in Journal of physical chemistry. C (22.02.2018)
Published in Journal of physical chemistry. C (22.02.2018)
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Journal Article
Thermal Performance Evaluation of Multi-Core SOCs Using Power-Thermal Co-Simulation
Mishra, S., Vermeersch, B., Sankatali, V., Kukner, H., Sharma, A., Mirabeli, G., Bufler, F. M., Brunion, M., Abdi, D., Oprins, H., Biswas, D., Zografos, O., Catthoor, F., Weckx, P., Hellings, G., Myers, J., Ryckaert, J.
Published in 2024 IEEE International Reliability Physics Symposium (IRPS) (14.04.2024)
Published in 2024 IEEE International Reliability Physics Symposium (IRPS) (14.04.2024)
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Conference Proceeding
Towards Chip-Package-System Co-optimization of Thermally-limited System-On-Chips (SOCs)
Mishra, S., Sankatali, V., Vermeersch, B., Brunion, M., Lofrano, M., Abdi, D., Oprins, H., Biswas, D., Zografos, O., Hiblot, G., Van Der Plas, G., Weckx, P., Hellings, G., Myers, J., Catthoor, F., Ryckaert, J.
Published in 2023 IEEE International Reliability Physics Symposium (IRPS) (01.03.2023)
Published in 2023 IEEE International Reliability Physics Symposium (IRPS) (01.03.2023)
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Conference Proceeding
III-V HBTs on 300 mm Si substrates using merged nano-ridges and its application in the study of impact of defects on DC and RF performance
Vais, A., Yadav, S., Mols, Y., Vermeersch, B., Kodandarama, K. V., Baryshnikova, M., Mannaert, G., Alcotte, R., Boccardi, G., Wambacq, P., Parvais, B., Langer, R., Kunert, B., Collaert, N.
Published in ESSDERC 2022 - IEEE 52nd European Solid-State Device Research Conference (ESSDERC) (19.09.2022)
Published in ESSDERC 2022 - IEEE 52nd European Solid-State Device Research Conference (ESSDERC) (19.09.2022)
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Conference Proceeding
Transistor modelling for mm-Wave technology pathfinding
Parvais, B., ElKashlan, R., Yu, H., Sibaja-Hernandez, A., Vermeersch, B., Putcha, V., Cardinael, P., Rodriguez, R., Khaled, A., Alian, A., Peralagu, U., Zhao, M., Yadav, S., Gramegna, G., Driessche, J. Van, Collaert, N.
Published in 2021 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) (27.09.2021)
Published in 2021 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) (27.09.2021)
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Conference Proceeding
Time and frequency domain CCD-based thermoreflectance techniques for high-resolution transient thermal imaging
Vermeersch, B, Christofferson, J, Maize, K, Shakouri, A, De Mey, G
Published in 2010 26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM) (01.02.2010)
Published in 2010 26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM) (01.02.2010)
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Conference Proceeding
Thermal impedances of thin plates
De Mey, G., Vermeersch, B., Banaszczyk, J., Swia¸tczak, T., Wie¸cek, B., Janicki, M., Napieralski, A.
Published in International journal of heat and mass transfer (01.10.2007)
Published in International journal of heat and mass transfer (01.10.2007)
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Journal Article
Temperature Dependence of Quasi-Ballistic Transport in n-Type and p-Type Nanosheets
Bufler, F. M., Vermeersch, B., Mishra, S., Beckers, A., Ritzenthaler, R., Grill, A., Matagne, P., Hellings, G.
Published in 2024 IEEE Latin American Electron Devices Conference (LAEDC) (08.05.2024)
Published in 2024 IEEE Latin American Electron Devices Conference (LAEDC) (08.05.2024)
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Conference Proceeding
Thermal Modelling of GaN & InP RF Devices with Intrinsic Account for Nanoscale Transport Effects
Vermeersch, B., Rodriguez, R., Sibaja-Hernandez, A., Vais, A., Yadav, S., Parvais, B., Collaert, N.
Published in 2022 International Electron Devices Meeting (IEDM) (03.12.2022)
Published in 2022 International Electron Devices Meeting (IEDM) (03.12.2022)
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Conference Proceeding
Thermal imaging for reliability characterization of copper vias
Alavi, S, Yazawa, K, Alers, G, Vermeersch, B, Christofferson, J, Shakouri, A
Published in 2011 27th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (01.03.2011)
Published in 2011 27th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (01.03.2011)
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Conference Proceeding