Copper cleaning in supercritical CO2 for the microprocessor interconnects
VENTOSA, C, REBISCOUL, D, PERRUT, V, IVANOVA, V, RENAULT, O, PASSEMARD, G
Published in Microelectronic engineering (01.07.2008)
Published in Microelectronic engineering (01.07.2008)
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Journal Article
Prebonding Thermal Treatment in Direct Si–Si Hydrophilic Wafer Bonding
Ventosa, C., Rieutord, F., Libralesso, L., Fournel, F., Morales, C., Moriceau, H.
Published in Journal of the Electrochemical Society (2009)
Published in Journal of the Electrochemical Society (2009)
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Journal Article
Comparison of two HIV testing strategies in primary care centres: indicator‐condition‐guided testing vs. testing of those with non‐indicator conditions
Menacho, I, Sequeira, E, Muns, M, Barba, O, Leal, L, Clusa, T, Fernandez, E, Moreno, L, Raben, D, Lundgren, J, Gatell, JM, Garcia, F, Cayuelas, L, Aragunde, V, Vergara, M, Catalan, M, Moreno, MA, Hormigo, G, Siso, A, Herreras, Z, Sebastian, L, Benito, L, Picas, A, Hoyo, J, Giner, MJ, Cararach, D, Moles, E, Moro, ML, Arrabal, P, Roca, D, Prego, S, Ferrer, X, Egido, A, Ventosa, C, Garcia, S, Muñoz, S, Massana, A, Sole, J, Curiel, M, Heras, F, Leon, A
Published in HIV medicine (01.10.2013)
Published in HIV medicine (01.10.2013)
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Journal Article
Water management on semiconductor surfaces
Le Tiec, Y., Ventosa, C., Rochat, N., Fournel, F., Moriceau, H., Clavelier, L., Rieutord, F., Butterbaugh, J., Radu, I.
Published in Microelectronic engineering (01.12.2011)
Published in Microelectronic engineering (01.12.2011)
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Journal Article
Conference Proceeding
Mechanism of Thermal Silicon Oxide Direct Wafer Bonding
Ventosa, C., Morales, C., Libralesso, L., Fournel, F., Papon, A. M., Lafond, D., Moriceau, H., Penot, J. D., Rieutord, F.
Published in Electrochemical and solid-state letters (2009)
Published in Electrochemical and solid-state letters (2009)
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Journal Article
Chemical-Mechanical Polishing YAG For Wafer Bonding
Mc Kay, Jeffrey, Moulet-Ventosa, Caroline, Goorsky, M. S.
Published in ECS transactions (15.03.2013)
Published in ECS transactions (15.03.2013)
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Journal Article
Advanced Characterization of a Direct Wafer Bonding-compatible Germanium Exfoliation Process
Ferain, Isabelle Pauline, Kou, Xiaolu, Moulet-Ventosa, Caroline, Goorsky, M. S., Colinge, Cindy
Published in ECS transactions (15.03.2013)
Published in ECS transactions (15.03.2013)
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Journal Article
Low Temperature Wafer Bonding
Fournel, Frank, Moriceau, H., Ventosa, Caroline, Libralesso, Laure, Le Tiec, Yannick, Signamarcheix, Thomas, Rieutord, François
Published in ECS transactions (2009)
Published in ECS transactions (2009)
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Journal Article
Copper cleaning in supercritical CO 2 for the microprocessor interconnects
Ventosa, C., Rébiscoul, D., Perrut, V., Ivanova, V., Renault, O., Passemard, G.
Published in Microelectronic engineering (2008)
Published in Microelectronic engineering (2008)
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Journal Article