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Published in IEEE MICRO (01.03.2020)
Published in IEEE MICRO (01.03.2020)
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The Microarchitecture of DOJO, Tesla's Exa-Scale Computer
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Published in IEEE MICRO (01.05.2023)
Published in IEEE MICRO (01.05.2023)
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이종 멀티-레이어 구조
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Year of Publication 19.04.2024
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Year of Publication 19.04.2024
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Computer and Redundancy Solution for the Full Self-Driving Computer
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Published in 2019 IEEE Hot Chips 31 Symposium (HCS) (01.08.2019)
Published in 2019 IEEE Hot Chips 31 Symposium (HCS) (01.08.2019)
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Year of Publication 13.02.2024
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Year of Publication 24.10.2024
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HETEROGENOUS MULTI-LAYER STRUCTURE
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Year of Publication 26.06.2024
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Pang, Mengzhi, Sun, Shishuang, McGee, William Arthur, Venkataramanan, Ganesh, Butler, Steven
Year of Publication 17.02.2022
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Year of Publication 17.02.2022
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Packaged device having imbedded array of components
Pang, Mengzhi, Sun, Yang, Zhao, Jin, Butler, Steven Wayne, Krithivasan, Vijaykumar, Venkataramanan, Ganesh
Year of Publication 14.09.2021
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Year of Publication 14.09.2021
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ELECTRONIC ASSEMBLY
BUTLER, Steven, MCGEE, William Arthur, PANG, Mengzhi, SUN, Shishuang, VENKATARAMANAN, Ganesh
Year of Publication 28.07.2021
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Year of Publication 28.07.2021
Patent
HETEROGENOUS MULTI-LAYER STRUCTURE
SUN, Yang, DENG, Shaowei, BUTLER, Steven, MCGEE, William Arthur, PANG, Mengzhi, ZHAO, Jin, CHANG, Bill, NABOVATI, Aydin, SUN, Shishuang, VENKATARAMANAN, Ganesh
Year of Publication 23.02.2023
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Year of Publication 23.02.2023
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PACKAGED DEVICE HAVING EMBEDDED ARRAY OF COMPONENTS
SUN, Yang, BUTLER, Steven Wayne, PANG, Mengzhi, ZHAO, Jin, KRITHIVASAN, Vijaykumar, VENKATARAMANAN, Ganesh
Year of Publication 16.07.2020
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Year of Publication 16.07.2020
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PACKAGED DEVICE HAVING EMBEDDED ARRAY OF COMPONENTS
Pang, Mengzhi, Sun, Yang, Zhao, Jin, Butler, Steven Wayne, Krithivasan, Vijaykumar, Venkataramanan, Ganesh
Year of Publication 09.07.2020
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Year of Publication 09.07.2020
Patent