Comprehensive Study on the Interactions of Multiple Die Shift Mechanisms During Wafer Level Molding of Multichip-Embedded Wafer Level Packages
Ho Siow Ling, Bu Lin, Chong Ser Choong, Velez, Sorono Dexter, Chai Tai Chong, Xiaowu Zhang
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.06.2014)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.06.2014)
Get full text
Journal Article
Thermo-compression bonding for 2.5D fine pitch copper pillar bump interconnections on TSV interposer
Lim, Sharon Pei-Siang, Mian Zhi Ding, Velez Sorono, Dexter, Cereno, Daniel Ismael, Jong Kai Lin, Rao, Vempati Srinivasa
Published in 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) (01.12.2014)
Published in 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) (01.12.2014)
Get full text
Conference Proceeding
Optimization of the wafer level molding process for high power device module
Lin Bu, Siow Ling Ho, Velez Sorono, Dexter, Woo, Daniel Rhee Min
Published in 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) (01.12.2014)
Published in 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) (01.12.2014)
Get full text
Conference Proceeding
Thermo-mechanical reliability study on Package on Package (PoP) with Embedded Wafer Level Package (eWLP)
Chen, Zhaohui, Jung, Boo Yang, Lim, Sharon Pei Siang, Velez, Dexter Sorono, Ho, David Soon Wee, Zhang, Xiaowu
Published in 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) (01.12.2014)
Published in 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) (01.12.2014)
Get full text
Conference Proceeding
Development of SiC power module using 70μm single metal layer substrates
Hwang How Yuan, Jaafar, Norhanani, Dexter Velez, Sorono, Lee Jong Bum, Yeap Yean Wei, Woo, Daniel Rhee Min
Published in 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) (01.12.2015)
Published in 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) (01.12.2015)
Get full text
Conference Proceeding
Simultaneous molding and under-filling for void free process to encapsulate fine pitch micro bump interconnections of chip-to-wafer (C2W) bonding in wafer level packaging
Velez Sorono, Dexter, Vempati, Srinivasa Rao, Lin Bu, Ser Choong Chong, Liang, Calvin Teo Wei, Seit Wen Wei
Published in 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) (01.12.2013)
Published in 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) (01.12.2013)
Get full text
Conference Proceeding
Novel high performance millimeter-wave resonator and filter structures using embedded wafer level packaging (EWLP) technology
Rui Li, Boo Yang Jung, Cheng Jin, Chang Ka Fai, Soon Wee Ho, Velez Sorono, Dexter
Published in 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) (01.12.2013)
Published in 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) (01.12.2013)
Get full text
Conference Proceeding
3-D Numerical and Experimental Investigations on Compression Molding in Multichip Embedded Wafer Level Packaging
Lin Ji, Sorono, D. V., Tai Chong Chai, Xiaowu Zhang
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.04.2013)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.04.2013)
Get full text
Journal Article
Design and Optimization of Wafer-Level Compression Molding Process for One Chip Plus Multiple Decaps
Lin Bu, Siowling Ho, Velez, Sorono Dexter, Lau Boon Long, Booyang Jung, Taichong Chai, Xiaowu Zhang
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.05.2015)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.05.2015)
Get full text
Journal Article
High power SiC inverter module packaging solutions for junction temperature over 220°C
Woo, Daniel Rhee Min, Hwang How Yuan, Li, Jerry Aw Jie, Ho Siow Ling, Lee Jong Bum, Zhang Songbai, Zhang Hengyun, Selvaraj, Susai Lawrence, Velez, Sorono Dexter, Singh, Ravinder Pal
Published in 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) (01.12.2014)
Published in 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) (01.12.2014)
Get full text
Conference Proceeding
Development of low profile fan out PoP solution with embedded passive
Jung, Boo Yang, Ho, David Soon Wee, Sorono, Dexter Velez, Lim, Sharon Pei Siang, Chen, Zhaohui, Yong, Han, Lin, Bu, Chong, Chai Tai
Published in 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) (01.12.2014)
Published in 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) (01.12.2014)
Get full text
Conference Proceeding
Process integration of solder bumps and Cu pillar microbumps on 2.5D fine pitch TSV interposer
Pei-Siang, Sharon Lim, Ding, L., MingBin Yu, Mian Zhi Ding, Dexter Velez, Sorono, Rao, Vempati Srinivasa
Published in 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) (01.12.2013)
Published in 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) (01.12.2013)
Get full text
Conference Proceeding
Study on mold flow during compression molding for embedded wafer level package (EMWLP) with multiple chips
Sorono, D. V., Ji Lin, Chai Tai Chong, Ser Choong Chong, Vempati, S. R.
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
Get full text
Conference Proceeding
Investigation on decap shift and incomplete fill issues in the wafer level compression molding process
Lin Bu, Siowling Ho, Dexter Velez, Sorono, Boyu Zheng, Ser Choong Chong, Booyang Jung, Taichong Chai, Xiaowu Zhang
Published in 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) (01.12.2013)
Published in 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) (01.12.2013)
Get full text
Conference Proceeding