Extending the validity of squeezed-film damper models with elongations of surface dimensions
Veijola, T, Pursula, A, Råback, P
Published in Journal of micromechanics and microengineering (01.09.2005)
Published in Journal of micromechanics and microengineering (01.09.2005)
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Journal Article
Synthesis of Reduced Equivalent Circuits for Transmission Lines
Kallio, A., Veijola, T.
Published in IEEE transactions on circuits and systems. I, Regular papers (01.10.2006)
Published in IEEE transactions on circuits and systems. I, Regular papers (01.10.2006)
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Journal Article
Gas damping model for a RF MEM switch and its dynamic characteristics
Veijola, T., Tinttunen, T., Nieminen, H., Ermolov, V., Ryhanen, T.
Published in 2002 IEEE MTT-S International Microwave Symposium Digest (Cat. No.02CH37278) (2002)
Published in 2002 IEEE MTT-S International Microwave Symposium Digest (Cat. No.02CH37278) (2002)
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Conference Proceeding
Journal Article
Large-displacement modelling and simulation of micromechanical electrostatically driven resonators using the harmonic balance method
Veijola, T., Mattila, T., Jaakkola, O., Kiihamaki, J., Lamminmaki, T., Oja, A., Ruokonen, K., Seppa, H., Seppala, P., Tittonen, I.
Published in 2000 IEEE MTT-S International Microwave Symposium Digest (Cat. No.00CH37017) (2000)
Published in 2000 IEEE MTT-S International Microwave Symposium Digest (Cat. No.00CH37017) (2000)
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Conference Proceeding
Journal Article
Numerical and compact modelling of squeeze-film damping in RF MEMS resonators
Veijola, T., Lehtovuori, A.
Published in 2008 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (01.04.2008)
Published in 2008 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (01.04.2008)
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Conference Proceeding
Compact model for a cantilever beam MEM contact switch
Veijola, T.
Published in Proceedings of the 2005 European Conference on Circuit Theory and Design, 2005 (2005)
Published in Proceedings of the 2005 European Conference on Circuit Theory and Design, 2005 (2005)
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Conference Proceeding
Comparison between damping coefficients of measured perforated structures and compact models
Veijola, T., De Pasquale, G., Soma, A.
Published in 2008 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (01.04.2008)
Published in 2008 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (01.04.2008)
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Conference Proceeding
Equivalent-circuit model of the squeezed gas film in a silicon accelerometer
Veijola, Timo, Kuisma, Heikki, Lahdenperä, Juha, Ryhänen, Tapani
Published in Sensors and actuators. A. Physical. (30.05.1995)
Published in Sensors and actuators. A. Physical. (30.05.1995)
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Journal Article
Model for thermal spreading impedance in GaAs MESFETs
Veijola, T.
Published in Proceedings of Third International Conference on Electronics, Circuits, and Systems (1996)
Published in Proceedings of Third International Conference on Electronics, Circuits, and Systems (1996)
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Conference Proceeding
The influence of gas-surface interaction on gas-film damping in a silicon accelerometer
Veijola, Timo, Kuisma, Heikki, Lahdenperä, Juha
Published in Sensors and actuators. A, Physical (01.04.1998)
Published in Sensors and actuators. A, Physical (01.04.1998)
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Journal Article
Conference Proceeding
Model for gas film damping in a silicon accelerometer
Veijola, T., Kuisma, H., Lahdenpera, J.
Published in Proceedings of International Solid State Sensors and Actuators Conference (Transducers '97) (1997)
Published in Proceedings of International Solid State Sensors and Actuators Conference (Transducers '97) (1997)
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Conference Proceeding
Transient capacitance measurement of MEM capacitor
Nieminen, Heikki, Hyyryläinen, Jari, Veijola, Timo, Ryhänen, Tapani, Ermolov, Vladimir
Published in Sensors and actuators. A. Physical. (14.01.2005)
Published in Sensors and actuators. A. Physical. (14.01.2005)
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Journal Article
3D FEM simulations of perforated MEMS gas dampers
Veijola, T.
Published in 2009 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (01.04.2009)
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Published in 2009 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (01.04.2009)
Conference Proceeding