Fabrication of High Aspect Ratio TSV and Assembly With Fine-Pitch Low-Cost Solder Microbump for Si Interposer Technology With High-Density Interconnects
Aibin Yu, Lau, J. H., Soon Wee Ho, Kumar, A., Wai Yin Hnin, Wen Sheng Lee, Ming Ching Jong, Sekhar, V. N., Kripesh, V., Pinjala, D., Chen, S., Chien-Feng Chan, Chun-Chieh Chao, Chi-Hsin Chiu, Chih-Ming Huang, Chen, C.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.09.2011)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.09.2011)
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Journal Article
Cu Damascene Process on Temporary Bonded Wafers for Thin Chip Stacking using Cu-Cu Hybrid Bonding
Sekhar, Vasarla Nagendra, Kumar, Mishra Dileep, Lianto, Prayudi, Chong, Ser Choong, Rao, Vempati Srinivasa
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
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Conference Proceeding
Study on the Effect of Wafer Back Grinding Process on Nanomechanical Behavior of Multilayered Low-k Stack
Sekhar, V. N., Lu Shen, Kumar, A., Tai Chong Chai, Xiaowu Zhang, Premchandran, C. S., Kripesh, V., Seung Wook Yoon, Lau, J. H.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.01.2012)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.01.2012)
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Journal Article
Process Challenges in Thin Wafers Fabrication with Double Side Hybrid Bond Pads for Chip Stacking
Kumar, Mishra Dileep, Nagendra Sekhar, Vasarla, Rao, B.S.S. Chandra, Choong Chong, Ser, Rao, Vempati Srinivasa
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
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Conference Proceeding
Multi-Chip Stacked Memory Module Development using Chip to Wafer (C2W) Hybrid Bonding for Heterogeneous Integration Applications
Sekhar, Vasarla Nagendra, Kumar, Mishra Dileep, Tippabhotla, Sasi Kumar, Rao, B. S. S. Chandra, Daniel, Ismael Cereno, Chong, Ser Choong, Rao, Vempati Srinivasa
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
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Conference Proceeding
Evaluation of Low Temperature Inorganic Dielectric Materials for Hybrid Bonding Applications
Kumar, Mishra Dileep, Nagendra Sekhar, Vasarla, Choong, Chong Ser, Chandra Rao, B.S.S., Chui, King-Jien, Rao, Vempati Srinivasa
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
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Conference Proceeding
Polymer Dielectric Materials Evaluation for Hybrid Bonding Applications
Sekhar, Vasarla Nagendra, Fujiwara, Takenori, Araki, Hitoshi, Shoji, Yu, Jukei, Masaya, Nomura, Kota, Kumar, Mishra Dileep, Ser Choong, Chong, Rao, Vempati Srinivasa
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
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Conference Proceeding
Reliability Assessment of 2.5D Module using Chip to Wafer Hybrid Bonding
Chong, Ser Choong, Au Keng Yuen, Jason, Sekhar, Vasarla Nagendra, Cereno Daniel, Ismael, Kumar, Mishra Dileep, Srinivasa Rao, Vempati
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
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Conference Proceeding
Design, assembly and reliability of large die and fine-pitch Cu/low- k flip chip package
Ong, Yue Ying, Ho, Soon Wee, Vaidyanathan, Kripesh, Sekhar, Vasarla Nagendra, Jong, Ming Chinq, Yak Long, Samuel Lim, Wen Sheng, Vincent Lee, Wai, Leong Ching, Rao, Vempati Srinivasa, Ong, Jimmy, Ong, Xuefen, Zhang, Xiaowu, Seung, Yoon Uk, Lau, John H., Lim, Yeow Kheng, Yeo, David, Chan, Kai Chong, Yanfeng, Zhang, Tan, Juan Boon, Sohn, Dong Kyun
Published in Microelectronics and reliability (01.07.2010)
Published in Microelectronics and reliability (01.07.2010)
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Journal Article
Development of 4 die stack module using Hybrid bonding approach
Chong, Ser Choong, Keng Yuen, Jason Au, Sekhar, Vasarla Nagendra, Daniel, Ismael Cereno, Rao, Vempati Srinivasa
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
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Conference Proceeding
Dielectric Stack Optimization for Die-level Warpage Reduction for Chip-to-Wafer Hybrid Bonding
Rao, B.S.S. Chandra, Kumar, Mishra Dileep, Sekhar, Vasarla Nagendra, Daniel, Ismael Cereno, Tippabhotla, Sasi Kumar, Chong, Ser Choong, C, Hemanth Kumar, Rao, Vempati Srinivasa
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
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Conference Proceeding
Process and Reliability of Embedded Micro-Wafer-Level Package (EMWLP) Using Low Cure Temperature Dielectric Material
Rao, V. S., Sekhar, V. N., Ho Soon Wee, Rajoo, R., Sharma, G., Lim Ying Ying, Damaruganath, P.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.01.2012)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.01.2012)
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Journal Article
Design and Development of Multi-Die Laterally Placed and Vertically Stacked Embedded Micro-Wafer-Level Packages
Sharma, G, Rao, V S, Kumar, A, Lim Ying Ying, Khong Chee Houe, Lim, S, Sekhar, V N, Rajoo, R, Kripesh, V, Lau, J H
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.01.2011)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.01.2011)
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Journal Article
Development of a Cu/Low- k Stack Die Fine Pitch Ball Grid Array (FBGA) Package for System in Package Applications
Xiaowu Zhang, Lau, J H, Premachandran, C S, Ser-Choong Chong, Leong Ching Wai, Lee, V, Chai, T C, Kripesh, V, Sekhar, V N, Pinjala, D, Che, F X
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.03.2011)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.03.2011)
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Journal Article
Underfill Selection, Characterization, and Reliability Study for Fine-Pitch, Large Die Cu/Low-K Flip Chip Package
Yue Ying Ong, Soon Wee Ho, Sekhar, V N, Xuefen Ong, Ong, J, Xiaowu Zhang, Vaidyanathan, K, Seung Uk Yoon, Lau, J H, Lim Yeow Kheng, Yeo, D, Kai Chong Chan, Yanfeng Zhang, Juan Boon Tan, Dong Kyun Sohn
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.03.2011)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.03.2011)
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Journal Article
RDL-1st Fan-Out Panel Level Packaging (FOPLP) for Heterogeneous and Economical Packaging
Sekhar, Vasarla Nagendra, Rao, Vempati Srinivasa, Che, F.X., Choong, Chong Ser, Yamamoto, Kazunori
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
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Conference Proceeding
Low-Loss Broadband Package Platform With Surface Passivation and TSV for Wafer-Level Packaging of RF-MEMS Devices
Chen, Bangtao, Sekhar, Vasarla Nagendra, Jin, Cheng, Lim, Ying Ying, Toh, Justin See, Fernando, Sanchitha, Sharma, Jaibir
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.09.2013)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.09.2013)
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Journal Article
Development of Package-on-Package Using Embedded Wafer-Level Package Approach
Ser Choongv Chong, Wee, David Ho Soon, Rao, Vempati Srinivasa, Vasarla, Nagendra Sekhar
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.10.2013)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.10.2013)
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Journal Article