Monitoring of SPS Concentration by the Ring Current Using a Rotating Ring-Disk Electrode with Dissolving Disk Copper to Refresh a Void Free Solution
Tran, Anh Van Nhat, Van Hoang, Ha, Hirato, Tetsuji, Kondo, Kazuo
Published in Journal of the Electrochemical Society (2019)
Published in Journal of the Electrochemical Society (2019)
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Journal Article
A Rotating Ring Disk Electrode Study to Detect the Acceleration Effect of SPS and MPS in the Presence of Chloride
TRAN, Anh Van Nhat, TRAN, Linh Dieu, HOANG, Ha Van, KONDO, Kazuo
Published in Hyōmen gijutsu (01.08.2017)
Published in Hyōmen gijutsu (01.08.2017)
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Journal Article
High TEC Copper to Connect Copper Bond Pads for Low Temperature Wafer Bonding
Tran, Anh Van Nhat, Hirato, Tetsuji, Kondo, Kazuo
Published in ECS journal of solid state science and technology (01.12.2020)
Published in ECS journal of solid state science and technology (01.12.2020)
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Journal Article
A Rotating Ring Disk Study of Accelerators with Cl－ and Br－ for Copper Damascene Electrodeposition
TRAN, Anh Van Nhat, HOANG, Ha Van, HIRATO, Tetsuji, KONDO, Kazuo
Published in Hyōmen gijutsu (01.08.2018)
Published in Hyōmen gijutsu (01.08.2018)
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Journal Article
Cu/Dielectric hybrid bonding among Glass and Si
Cheemalamarri, Hemanth Kumar, Sundaram, Arvind, Van Nhat Anh, Tran, Jae Ok, Yoo, Rao, Vempati Srinivasa, Singh, Navab
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
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Conference Proceeding
Low Thermal Budget Fine-pitch Cu/Dielectric Hybrid Bonding with Cu Microstructure Modifications
Cheemalamarri, Hemanth Kumar, Van Nhat Anh, Tran, Guan, Chen Gim, Lim, Meng Keong, Vempati, Srinivasa Rao, Singh, Navab
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
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Conference Proceeding
Defect evolution during through-silicon via copper electroplating and methods for robust void-free filling
Van Nhat Anh, Tran, Venkataraman, Nandini, Tao, Meng, Ya-Ching, Tseng, Xiangyu, Wang, King-Jien, Chui, Singh, Navab, Rao, Vempati Srinivasa
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
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Conference Proceeding
Sub-0.5 μm Pitch Scaling of W2W Cu/Dielectric Hybrid Bonding
Cheemalamarri, Hemanth Kumar, Sundaram, Arvind, Sandra, San, Van Nhat Anh, Tran, Chandra Rao, Bhesetti, Guan, Chen Gim, Haitao, Yu, Raju, Mani, Ping, Luo, Chaeeun, Lee, Rao, Vempati Srinivasa, Singh, Navab
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
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Conference Proceeding
Electrical Characterization and Reliability Studies of Nano-TSV
Tseng, Ya-Ching, Chui, King-Jien, Goh, Simon Chun Kiat, Lau, Daniel, Li, Hongyu, Anh, Tran Van Nhat, Yu, Haitao, Tew, Chin Khang, Chen, Gim Guan, Varghese, Binni, Ming, Calvin Chua Hung
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
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Conference Proceeding