Reversible TAD Chemistry as a Convenient Tool for the Design of (Re)processable PCL‐Based Shape‐Memory Materials
Defize, Thomas, Riva, Raphaël, Thomassin, Jean‐Michel, Alexandre, Michaël, Herck, Niels Van, Prez, Filip Du, Jérôme, Christine
Published in Macromolecular rapid communications. (01.01.2017)
Published in Macromolecular rapid communications. (01.01.2017)
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Covalent Adaptable Networks with Tunable Exchange Rates Based on Reversible Thiol–yne Cross‐Linking
Van Herck, Niels, Maes, Diederick, Unal, Kamil, Guerre, Marc, Winne, Johan M., Du Prez, Filip E.
Published in Angewandte Chemie (24.02.2020)
Published in Angewandte Chemie (24.02.2020)
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Ultra High Density RDL Patterning of High-Resolution Dielectrics by Maskless Exposure Technology for High Performance Computing and Artificial Intelligence
Varga, Ksenija, Uhrmann, Thomas, Holly, Roman, Zenger, Tobias, Povazay, Boris, Janssen, Dimitri, van Herck, Niels, Reybrouck, Mario, Vandevyvere, Marieke, Malik, Sanjay, Vanclooster, Stefan
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
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Conference Proceeding
Polyaddition Synthesis Using Alkyne Esters for the Design of Vinylogous Urethane Vitrimers
Spiesschaert, Yann, Danneels, Jens, Van Herck, Niels, Guerre, Marc, Acke, Guillaume, Winne, Johan, Du Prez, Filip
Published in Macromolecules (14.09.2021)
Published in Macromolecules (14.09.2021)
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Ring opening copolymerisation of lactide and mandelide for the development of environmentally degradable polyesters with controllable glass transition temperatures
Graulus, Geert-Jan, Van Herck, Niels, Van Hecke, Kristof, Van Driessche, Gonzalez, Devreese, Bart, Thienpont, Hugo, Ottevaere, Heidi, Van Vlierberghe, Sandra, Dubruel, Peter
Published in Reactive & functional polymers (01.07.2018)
Published in Reactive & functional polymers (01.07.2018)
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Optimization of PI & PBO Layers Lithography Process for High Density Fan-Out Wafer Level Packaging & Next Generation Heterogeneous Integration Applications Employing Digitally Driven Maskless Lithography
Uhrmann, Thomas, Povazay, Boris, Zenger, Tobias, Thallner, Bemd, Holly, Roman, Lednicka, Bozena Matuskova, Reybrouck, Mario, Van Herck, Niels, Persijn, Bart, Janssen, Dimitri, Vanclooster, Stefan, Heirbaut, Stef
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
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Conference Proceeding