Epitaxial diamond-hexagonal silicon nano-ribbon growth on (001) silicon
Qiu, Y, Bender, H, Richard, O, Kim, M-S, Van Besien, E, Vos, I, de Potter de ten Broeck, M, Mocuta, D, Vandervorst, W
Published in Scientific reports (04.08.2015)
Published in Scientific reports (04.08.2015)
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Journal Article
Electrical Characteristics of p-Type Bulk Si Fin Field-Effect Transistor Using Solid-Source Doping With 1-nm Phosphosilicate Glass
Kikuchi, Y., Chiarella, T., De Roest, D., Blanquart, T., De Keersgieter, A., Kenis, K., Peter, A., Ong, P., Van Besien, E., Tao, Z., Kim, M. S., Kubicek, S., Chew, S. A., Schram, T., Demuynck, S., Mocuta, A., Mocuta, D., Horiguchi, N.
Published in IEEE electron device letters (01.09.2016)
Published in IEEE electron device letters (01.09.2016)
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Journal Article
Chemisorption of ALD precursors in and on porous low-k films
Verdonck, P., Delabie, A., Swerts, J., Farrell, L., Baklanov, M.R., Tielens, H., Van Besien, E., Witters, T., Nyns, L., Van Elshocht, S.
Published in Microelectronic engineering (01.06.2013)
Published in Microelectronic engineering (01.06.2013)
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Conference Proceeding
Simulation and measurement of the capacitance benefit of air gap interconnects for advanced technology nodes
Kumaresan, V., Wilson, C.J., Verdonck, P., Van Besien, E., Lazzarino, F., Truffert, V., Bömmels, J., Tokei, Zs, Wong, T.K.S.
Published in Microelectronic engineering (25.05.2014)
Published in Microelectronic engineering (25.05.2014)
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Conference Proceeding
Impact of wavelength of UV light and UV cure time on chemical and mechanical properties of PECVD deposited porous ultra low-k films
Godavarthi, S., Le, Q.T., Verdonck, P., Mardani, S., Vanstreels, K., Van Besien, E., Baklanov, M.R.
Published in Microelectronic engineering (01.07.2013)
Published in Microelectronic engineering (01.07.2013)
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Conference Proceeding
The influence of N containing plasmas on low- k films
Verdonck, P., Aresti, M., Ferchichi, A., Van Besien, E., Stafford, B., Trompoukis, C., De Roest, D., Baklanov, M.
Published in Microelectronic engineering (01.05.2011)
Published in Microelectronic engineering (01.05.2011)
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Conference Proceeding
Gate-all-around MOSFETs based on vertically stacked horizontal Si nanowires in a replacement metal gate process on bulk Si substrates
Mertens, H., Ritzenthaler, R., Hikavyy, A., Kim, M. S., Tao, Z., Wostyn, K., Chew, S. A., De Keersgieter, A., Mannaert, G., Rosseel, E., Schram, T., Devriendt, K., Tsvetanova, D., Dekkers, H., Demuynck, S., Chasin, A., Van Besien, E., Dangol, A., Godny, S., Douhard, B., Bosman, N., Richard, O., Geypen, J., Bender, H., Barla, K., Mocuta, D., Horiguchi, N., Thean, A. V-Y
Published in 2016 IEEE Symposium on VLSI Technology (01.06.2016)
Published in 2016 IEEE Symposium on VLSI Technology (01.06.2016)
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Conference Proceeding
(Invited) Gate-All-Around Transistors Based on Vertically Stacked Si Nanowires
Mertens, Hans, Ritzenthaler, Romain, Hikavyy, Andriy Yakovitch, Kim, Min-Soo, Tao, Zheng, Wostyn, Kurt, Schram, Tom, Kunnen, Eddy, Ragnarsson, Lars-Åke, Dekkers, Harold F. W., Hopf, Toby, Devriendt, Katia, Tsvetanova, Diana, Chew, Soon Aik, Kikuchi, Yoshiaki, Van Besien, Els, Rosseel, Erik, Mannaert, Geert, De Keersgieter, An, Chasin, Adrian, Kubicek, Stefan, Dangol, Anish, Demuynck, Steven, Barla, Kathy, Mocuta, Dan, Horiguchi, Naoto
Published in ECS transactions (26.04.2017)
Published in ECS transactions (26.04.2017)
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Journal Article
Lanthanide(III)-Induced Conversion of 12-Metallacrown-4 to 5-Metallacrown-5 Complexes in Solution
Pacco, Antoine, Parac-Vogt, Tatjana N., van Besien, Els, Pierloot, Kristine, Görller-Walrand, Christiane, Binnemans, Koen
Published in European Journal of Inorganic Chemistry (01.08.2005)
Published in European Journal of Inorganic Chemistry (01.08.2005)
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Journal Article
Implementation of an industry compliant, 5×50μm, via-middle TSV technology on 300mm wafers
Redolfi, A., Velenis, D., Thangaraju, S., Nolmans, P., Jaenen, P., Kostermans, M., Baier, U., Van Besien, E., Dekkers, H., Witters, T., Jourdan, N., Van Ammel, A., Vandersmissen, K., Rodet, S., Philipsen, H. G. G., Radisic, A., Heylen, N., Travaly, Y., Swinnen, B., Beyne, E.
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
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Conference Proceeding
Self-aligned double patterning of 1× nm FinFETs; A new device integration through the challenging geometry
Kim, M.-S, Vandeweyer, T., Altamirano-Sanchez, E., Dekkers, H., Van Besien, E., Tsvetanova, D., Richard, O., Chew, S., Boccardi, G., Horiguchi, N.
Published in 2013 14th International Conference on Ultimate Integration on Silicon (ULIS) (01.03.2013)
Published in 2013 14th International Conference on Ultimate Integration on Silicon (ULIS) (01.03.2013)
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Conference Proceeding
Fundamental study of atomic layer deposition in and on porous low-k films
Verdonck, P., Delabie, A., Swerts, J., Farrell, L., Baklanov, M. R., Tielens, H., Van Besien, E., Witters, J., Nyns, L., Van Elshocht, S.
Published in 2011 IEEE International Interconnect Technology Conference (01.05.2011)
Published in 2011 IEEE International Interconnect Technology Conference (01.05.2011)
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Conference Proceeding
Integration of a k=2.3 spin-on polymer for the sub-28nm technology node using EUV lithography
Wilson, C. J., Lazzarino, F., Truffert, V., Kirimura, T., de Marneffe, J., Verdonck, P., Hirai, M., Nakatani, K., Tada, M., Heylen, N., El-Mekki, Z., Vanstreels, K., Van Besien, E., Ciofi, I., Stucchi, M., Croes, K., Zhang, L., Demuynck, S., Ercken, M., Xu, K., Baklanov, M., Tokei, Z.
Published in 2012 IEEE International Interconnect Technology Conference (01.06.2012)
Published in 2012 IEEE International Interconnect Technology Conference (01.06.2012)
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Conference Proceeding
Through-silicon via technology for three-dimensional integrated circuit manufacturing
Civale, Y., Redolfi, A., Jaenen, P., Kostermans, M., Van Besien, E., Mertens, S., Witters, T., Jourdan, N., Armini, S., El-Mekki, Z., Vandersmissen, K., Philipsen, H., Verdonck, P., Heylen, N., Nolmans, P., Yunlong Li, Croes, K., Beyer, G., Swinnen, B., Beyne, E.
Published in 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) (01.11.2012)
Published in 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) (01.11.2012)
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Conference Proceeding