A methodology for modeling the effects of systematic within-die interconnect and device variation on circuit performance
Mehrotra, Vikas, Sam, Shiou Lin, Boning, Duane, Chandrakasan, Anantha, Vallishayee, Rakesh, Nassif, Sani
Published in Annual ACM IEEE Design Automation Conference: Proceedings of the 37th conference on Design automation; 05-09 June 2000 (01.01.2000)
Published in Annual ACM IEEE Design Automation Conference: Proceedings of the 37th conference on Design automation; 05-09 June 2000 (01.01.2000)
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Conference Proceeding
Contact Chains for FinFET Technology Characterization
Brozek, Tomasz, Lam, Stephen, Yu, Shia, Pak, Mike K., Liu, Tom, Vallishayee, Rakesh, Yokoyama, Nobuharu
Published in IEEE transactions on semiconductor manufacturing (01.08.2015)
Published in IEEE transactions on semiconductor manufacturing (01.08.2015)
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Journal Article
Evaluation of Truly Passive Crossbar Memory Arrays on Short Flow Characterization Vehicle Test Chips
Hess, Christopher, Brozek, Tomasz, Schneider, Hendrik, Yu, Yuan, Lunenborg, Meindert, Ng, Khim Hong, Ciplickas, Dennis, Vallishayee, Rakesh, Dolainsky, Christoph, Weiland, Larg H.
Published in 2019 IEEE 32nd International Conference on Microelectronic Test Structures (ICMTS) (01.03.2019)
Published in 2019 IEEE 32nd International Conference on Microelectronic Test Structures (ICMTS) (01.03.2019)
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Conference Proceeding
Manufacturability of Electronic Chips
Vallishayee, Rakesh R, Orszag, Steven A, Jackson, Eric, Barouch, Eytan
Published in Theoretical and computational fluid dynamics (01.01.1998)
Published in Theoretical and computational fluid dynamics (01.01.1998)
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Journal Article
Monitoring of wafer thinning induced in-die mechanical stress with embedded sensors for heterogeneous integration
Piadena, Alberto, Quarantelli, Michele, Brozek, Tomasz, Saxena, Sharad, Hess, Christopher, Weiland, Larg, Vallishayee, Rakesh, Yu, Yuan, Strojwas, Andrzej
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
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Conference Proceeding
Monitoring Product Chip Health with In-die Quality Monitors
Brozek, Tomasz, Piadena, Alberto, Quarantelli, Michele, Weiland, Larg, Hess, Christopher, Saxena, Sharad, Yu, Yuan, Vallishayee, Rakesh, Strojwas, Andrzej
Published in 2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) (03.03.2024)
Published in 2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) (03.03.2024)
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Conference Proceeding
Tracking in-die mechanical stress through silicon embedded sensors for advanced packaging applications
Saxena, Sharad, Hess, Christopher, Quarantelli, Michele, Piadena, Alberto, Weiland, Larg, Vallishayee, Rakesh, Yu, Yuan, Ciplickas, Dennis, Brozek, Tomasz, Strojwas, Andrzej
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
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Conference Proceeding
Product relevant device leakage scribe characterization vehicle test chip for efficient full wafer testing
Hess, C., Firu, R., Vallishayee, R., Shia Yu, Peng Zhao, Sa Zhao
Published in 2011 IEEE ICMTS International Conference on Microelectronic Test Structures (01.04.2011)
Published in 2011 IEEE ICMTS International Conference on Microelectronic Test Structures (01.04.2011)
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Conference Proceeding
Estimating MOSFET Leakage from Low-cost, Low-resolution Fast Parametric Test
Saxena, S., Uezono, T., Vallishayee, R., Lindley, R., Swimmer, A., Winters, S.
Published in 2009 IEEE International Conference on Microelectronic Test Structures (01.03.2009)
Published in 2009 IEEE International Conference on Microelectronic Test Structures (01.03.2009)
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Conference Proceeding
Passive array test structure for cross-point memory characterization
Lunenborg, Meindert, Ng, SiewHoon, Vallishayee, Rakesh, Schneider, Hendrik, Brozek, Tomasz, Joag, Amit, Yu, Yuan, Hess, Christopher
Year of Publication 05.05.2020
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Year of Publication 05.05.2020
Patent
Impact of layout at advanced technology nodes on the performance and variation of digital and analog figures of merit
Saxena, Sharad, Dolainsky, Christoph, Lunenborg, Meindert, Jianjun Cheng, Yu, Bob, Vallishayee, Rakesh, Ciplickas, Dennis
Published in 2013 IEEE International Electron Devices Meeting (01.12.2013)
Published in 2013 IEEE International Electron Devices Meeting (01.12.2013)
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Conference Proceeding
Journal Article
IC with test structures and e-beam pads embedded within a contiguous standard cell area
Vallishayee, Rakesh, Lee, Sherry, Liao, Marci, Weiland, Larg, Strojwas, Marcin, Ciplickas, Dennis, Michaels, Kimon, Rovner, Vyacheslav, Strojwas, Andrzej, Hess, Christopher, Matsuhashi, Hideki, Moe, Matthew, Lam, Stephen, Fiscus, Timothy, Cheng, Jeremy, Comensoli, Simone, Brozek, Tomasz, Doong, Kelvin, Taylor, Carl, De, Indranil, Haigh, Jonathan, Kibarian, John, Rauscher, Markus, Yokoyama, Nobuharu, O'Sullivan, Conor, Eisenmann, Hans, Lin, Sheng-Che
Year of Publication 31.08.2021
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Year of Publication 31.08.2021
Patent
IC with test structures and e-beam pads embedded within a contiguous standard cell area
Vallishayee, Rakesh, Lee, Sherry, Liao, Marci, Weiland, Larg, Strojwas, Marcin, Ciplickas, Dennis, Michaels, Kimon, Rovner, Vyacheslav, Strojwas, Andrzej, Hess, Christopher, Matsuhashi, Hideki, Moe, Matthew, Lam, Stephen, Fiscus, Timothy, Cheng, Jeremy, Comensoli, Simone, Brozek, Tomasz, Doong, Kelvin, Taylor, Carl, De, Indranil, Haigh, Jonathan, Kibarian, John, Rauscher, Markus, Yokoyama, Nobuharu, O'Sullivan, Conor, Eisenmann, Hans, Lin, Sheng-Che
Year of Publication 03.08.2021
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Year of Publication 03.08.2021
Patent
IC with test structures and e-beam pads embedded within a contiguous standard cell area
Vallishayee, Rakesh, Lee, Sherry, Liao, Marci, Weiland, Larg, Strojwas, Marcin, Ciplickas, Dennis, Michaels, Kimon, Rovner, Vyacheslav, Strojwas, Andrzej, Hess, Christopher, Matsuhashi, Hideki, Moe, Matthew, Lam, Stephen, Fiscus, Timothy, Cheng, Jeremy, Comensoli, Simone, Brozek, Tomasz, Doong, Kelvin, Taylor, Carl, De, Indranil, Haigh, Jonathan, Kibarian, John, Rauscher, Markus, Yokoyama, Nobuharu, O'Sullivan, Conor, Eisenmann, Hans, Lin, Sheng-Che
Year of Publication 03.08.2021
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Year of Publication 03.08.2021
Patent
IC with test structures and E-beam pads embedded within a contiguous standard cell area
Vallishayee, Rakesh, Lee, Sherry, Liao, Marci, Weiland, Larg, Strojwas, Marcin, Ciplickas, Dennis, Michaels, Kimon, Rovner, Vyacheslav, Strojwas, Andrzej, Hess, Christopher, Matsuhashi, Hideki, Moe, Matthew, Lam, Stephen, Fiscus, Timothy, Cheng, Jeremy, Comensoli, Simone, Brozek, Tomasz, Doong, Kelvin, Taylor, Carl, De, Indranil, Haigh, Jonathan, Kibarian, John, Rauscher, Markus, Yokoyama, Nobuharu, O'Sullivan, Conor, Eisenmann, Hans, Lin, Sheng-Che
Year of Publication 27.07.2021
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Year of Publication 27.07.2021
Patent
IC with test structures and e-beam pads embedded within a contiguous standard cell area
Vallishayee, Rakesh, Lee, Sherry, Liao, Marci, Weiland, Larg, Strojwas, Marcin, Ciplickas, Dennis, Michaels, Kimon, Rovner, Vyacheslav, Strojwas, Andrzej, Hess, Christopher, Matsuhashi, Hideki, Moe, Matthew, Lam, Stephen, Fiscus, Timothy, Cheng, Jeremy, Comensoli, Simone, Brozek, Tomasz, Doong, Kelvin, Taylor, Carl, De, Indranil, Haigh, Jonathan, Kibarian, John, Rauscher, Markus, Yokoyama, Nobuharu, O'Sullivan, Conor, Eisenmann, Hans, Lin, Sheng-Che
Year of Publication 25.05.2021
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Year of Publication 25.05.2021
Patent
IC with test structures and E-beam pads embedded within a contiguous standard cell area
Vallishayee, Rakesh, Lee, Sherry, Liao, Marci, Weiland, Larg, Strojwas, Marcin, Ciplickas, Dennis, Michaels, Kimon, Rovner, Vyacheslav, Strojwas, Andrzej, Hess, Christopher, Matsuhashi, Hideki, Moe, Matthew, Lam, Stephen, Fiscus, Timothy, Cheng, Jeremy, Comensoli, Simone, Brozek, Tomasz, Doong, Kelvin, Taylor, Carl, De, Indranil, Haigh, Jonathan, Kibarian, John, Rauscher, Markus, Yokoyama, Nobuharu, O'Sullivan, Conor, Eisenmann, Hans, Lin, Sheng-Che
Year of Publication 13.04.2021
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Year of Publication 13.04.2021
Patent
Method for Fast and Accurate Calibration of Litho Simulator for Hot Spot Analysis
Jank, S., Temchenko, V., Karakatsanis, P.G., Veerasingam, R., Vallishayee, R., Dolainsky, C., Xiaojing Yang, Nehmadi, Y., Poyastro, M.
Published in 2006 IEEE International Symposium on Semiconductor Manufacturing (01.09.2006)
Published in 2006 IEEE International Symposium on Semiconductor Manufacturing (01.09.2006)
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Conference Proceeding
Method for processing a semiconductor wafer using non-contact electrical measurements indicative of at least one tip-to-side short or leakage, at least one corner short or leakage, and at least one via open or resistance, where such measurements are obtained from non-contact pads associated with respective tip-to-side short, corner short, and via open test areas
Vallishayee, Rakesh, Lee, Sherry, Liao, Marci, Weiland, Larg, Strojwas, Marcin, Ciplickas, Dennis, Michaels, Kimon, Rovner, Vyacheslav, Strojwas, Andrzej, Hess, Christopher, Matsuhashi, Hideki, Lam, Stephen, Fiscus, Timothy, Cheng, Jeremy, Comensoli, Simone, Brozek, Tomasz, Doong, Kelvin, Taylor, Carl, De, Indranil, Haigh, Jonathan, Kibarian, John, Rauscher, Markus, Yokoyama, Nobuharu, O'Sullivan, Conor, Eisenmann, Hans, Lin, Sheng-Che
Year of Publication 01.12.2020
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Year of Publication 01.12.2020
Patent
IC with test structures embedded within a contiguous standard cell area
Vallishayee, Rakesh, Lee, Sherry, Liao, Marci, Weiland, Larg, Strojwas, Marcin, Ciplickas, Dennis, Michaels, Kimon, Rovner, Vyacheslav, Strojwas, Andrzej, Hess, Christopher, Matsuhashi, Hideki, Lam, Stephen, Fiscus, Timothy, Cheng, Jeremy, Comensoli, Simone, Brozek, Tomasz, Doong, Kelvin, Taylor, Carl, De, Indranil, Haigh, Jonathan, Kibarian, John, Rauscher, Markus, Yokoyama, Nobuharu, O'Sullivan, Conor, Eisenmann, Hans, Lin, Sheng-Che
Year of Publication 15.09.2020
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Year of Publication 15.09.2020
Patent