Embedded RF Packaging Via Ceramic 3D Printing and Printed Electronics Additive Manufacturing
Obeidat, Abdullah S., Umar, Ashraf, Dou, Zhi, Alshatnawi, Firas, Al-Haidari, Riadh, Al-Shaibani, Waleed, Alhendi, Mohammed, Abdelatty, Mohamed Y., Boyd, Linda, Hoel, Cathleen, Valle Angulo, Genaro Soto, Budka, Thomas, Case, Jason, Iannotti, Joseph, Pavinatto, Felippe, Poliks, Mark D.
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
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